LNP™ THERMOCOMP™ Compound ZX08309

Identification & Functionality

Additives Included

Heat Stabilizer

Fillers Included

Mineral,

Titanium Dioxide

Polymer Name

PPO/PS Alloy

Plastics & Elastomers Functions

Resin

Technologies

Plastics

Product Families

Plastics — Engineering & Specialty Polymers

Blends & Alloys

Features & Benefits

Materials Features

Cost Effective,

Excellent Dielectric Properties,

Heat Stabilized,

Unreinforced

Thermocomp™ Compounds For Dielectric Solutions

LNP™ THERMOCOMP compounds portfolio contains thermoplastic injection molding materials that offer low Dissipation Factor (Df ) for improved signal gain and longer reading distance paired with tailor made Dielectric Constants (Dk ) to fine tune or detour a signal direction supporting innovative antenna designs. Beyond that, THERMOCOMP compounds allow further antenna miniaturization and the design of phase shifters with higher productivity through combined high Dk and low Df material properties.

Typical Industry Requirements

• Materials for individual antenna design to fine tune or detour signal direction.
• Improved signal gain and longer reading distance through less signal attenuation.
• Miniaturized antenna solutions with sufficient signal strength for 5G technology.
• Improved mechanical performance versus Epoxy or Ceramics in more complex designs for less maintenance through longer lifetime.

Typical Material Characteristics

• Tailored Dielectric Constant Dk by customized compound formulations.
• Very low Dissipation Factor Df for lower signal absorption, less signal scattering.
• Combined high Dk and low Df with very high signal transmission density.
• Sufficient flowability for thin wall design, improved ductility, dimensional and dielectric stability versus current solution.

Applications & Uses

Markets

Automotive & Transportation,

Consumer Goods,

Electrical & Electronics,

Personal Care,

Printing & Packaging

Applications

Consumer Goods — Appliances & Electronics

Automotive & Transportation — Automotive

Interior

Electrical & Electronics — Devices & Assemblies

Consumer Electronics,

Displays

Printing & Packaging — Packaging

Non-Food Consumer Packaging

Personal Care — Packaging & Accessories

Applicators & Accessories

Electrical & Electronics — Parts & Components

Connectors,

Switches & Relays

Plastics & Elastomers End Uses

Automotive Applications,

Automotive Interior Parts,

Cell Phones,

Computer Components,

Consumer Applications,

Containers,

Displays,

Electrical Components,

Electrical/Electronic Applications,

Personal Accessories,

Tablets,

Wireless Communication,

Wiring Devices

Plastics & Elastomers Processing Methods

Injection Molding

Properties

Mechanical Properties

	Value	Units	Test Method / Conditions
Flexural Stress (Break, 1.3 mm/min, 50 mm span) ¹¹	90 - 100	MPa	ASTM D790
Flexural Modulus (at 2 mm/min) ¹¹	3200 - 3500	MPa	ISO 178

Physical Properties

	Value	Units	Test Method / Conditions
Mold Shrinkage (flow, 24 hrs) ᵍ ¹¹	0.7	%	ASTM D955
Mold Shrinkage (xflow, 24 hrs) ᵍ ¹¹	0.65	%	ASTM D955
Density ¹¹	1.66	g/cm³	ISO 1183
Melt Volume Rate (at 300°C, 5.0 kg) ¹¹	11	cm³/10 min	ISO 1133

Thermal Properties

	Value	Units	Test Method / Conditions
Heat Deflection Temperature (at 0.45 MPa, 3.2 mm, Unannealed) ¹¹	134	°C	ASTM D648
Heat Deflection Temperature (at 1.82 MPa, 3.2mm, Unannealed) ¹¹	122	°C	ASTM D648

Electrical Properties

	Value	Units	Test Method / Conditions
Dielectric Constant (at 1.1 GHz) ¹¹	4.4 - 4.6	—	ASTM ES 7-83
Dissipation Factor (at 1.1 GHz) ¹¹	0.002 - 0.004	—	ASTM ES 7-83

Impact Properties

	Value	Units	Test Method / Conditions
Izod Impact (Notched, at 23°C) ¹¹	60	J/m	ASTM D256

Injection Molding

	Value	Units	Test Method / Conditions
Drying Temperature ⁷	105	°C	—
Drying Time ⁷	3 - 5	Hrs	—
Melt Temperature ⁷	295 - 305	°C	—
Nozzle Temperature ⁷	290 - 295	°C	—
Front - Zone 3 Temperature ⁷	300 - 305	°C	—
Middle - Zone 2 Temperature ⁷	290 - 295	°C	—
Rear - Zone 1 Temperature ⁷	280 - 285	°C	—
Mold Temperature ⁷	90	°C	—
Back Pressure ⁷	9	MPa	—
Screw Speed ⁷	100	rpm	—

Note

• ᵍ Measurements made from Laboratory test Coupon. Actual shrinkage may vary outside of range due to differences in processing conditions, equipment, part geometry and tool design. It is recommended that mold shrinkage studies be performed with surrogate or legacy tooling prior to cutting tools for new molded article.
• ⁷ Injection Molding parameters are only mentioned as general guidelines. These may not apply or may need adjustment in specific situations such as low shot sizes, large part molding, thin wall molding and gas-assist molding.
• ¹¹ The information stated on Technical Datasheets should be used as indicative only for material selection purposes and not be utilized as specification or used for part or tool design.

 

Technical Details & Test Data

Typical Properties of Thermocomp Compounds for Dielectric Solutions

Packaging & Availability

Country Availability

Canada,

China (Mainland),

Mexico,

USA

Regional Availability

• Americas
• Asia
• Europe
• North America