Products

Toray Toray MicroPly™ TCF4045 is a low dielectric, low density epoxy syntactic film. The material displays both good mechanical and dielectric properties. Toray MicroPly™ TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties. 177°C (350°F) Cure, Low Dielectric Epoxy Syntactic Film.

Toray Nomex® Honeycomb Core—Aerospace Grade is manufactured from Nomex® paper sheets and is coated and bonded together with a phenolic resin. Designed to offer users and designers high strength-to-weight properties at relatively low cost, Nomex® honeycomb is particularly suitable as a core material for production of sandwich structures requiring significant FST performance and using high performance fiber reinforced composites as the facing material.

Toray TC410 is Toray’s newest high performance cyanate ester resin system designed specifically for the latest generation of radomes and satellite structures. TC410 is unique in that it allows for low stress cures at 121°C (250°F) while achieving extremely low moisture absorption and high conversion levels. The lower cure temperature allows for lower stress in part fabrication. TC410 possesses all the key attributes for satellite use with good resistance to atomic radiation, low microcracking, and excellent resistance to process moisture. TC410 possesses low dielectric and loss tangents for radome usage. 121°C (250°F) Cure Toughened Cyanate Ester Resin System

Toray EX-1515 cyanate ester prepreg resin system is unique in the industry in that it is able to achieve an extremely high level of cure conversion after a 121°C (250°F) cure. This level of conversion provides optimal mechanical properties, high radiation resistance, low moisture absorption, and low outgassing while retaining unparalleled toughness, a low 118°C (244°F), stress-free temperature, and long out time. The resin system excels in its ability to resist microcracking, even when subjected to thermal cycling and high levels of radiation exposure. EX-1515 also displays low dielectric and low loss values which makes it outstanding for radome and antenna Applicationss. EX-1515 can be post cured, freestanding, to increase thermal performance for temperature-critical structures. 107–121°C (225–250°F) Cure Toughened Cyanate Ester

Toray Toray AmberTool® HX42 is a low temperature curing epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190°C (374°F) is achieved. Toray AmberTool® HX42 is an exceptional and very well proven system that exhibits a high end use temperature and extended out life. 50–75°C (122–167°F) Low Temperature Curing Epoxy Tooling Prepreg.

Toray Nomex® Honeycomb Core—Commercial Grade is manufactured from Nomex® paper sheets and is coated and bonded together with a phenolic resin. Designed to offer industrial users and designers high strength-to-weight properties at relatively low cost, Nomex® honeycomb is particularly suitable as a core material for production of nonmetallic sandwich structures using high performance fiber reinforced composites as the facing material.

Toray BT250E-1 resin system is a 121°C (250°F) cure epoxy prepreg system with excellent toughness and strength. It provides an outstanding surface finish under vacuum-bag/oven-cure only. The resin system, which is self-adhesive to honeycomb and foam core, is MIL-R-9300 qualified and makes a great choice for many Applicationss in the low-tomedium-service temperature range.

Toray Toray MicroPly™ TCF4050 core splice adhesive is a cyanate ester-based core splice with flatwise tensile strength up to 260°C (500°F). This product has been developed to be compatible with the high temperature Toray TC420 and Toray EX-1505 prepreg resin systems. 177°C (350°F) Cure, Cyanate Ester Core Splice Adhesive.

BTCy-1 is a 177°C (350°F) curing cyanate ester and is an industry standard for use on satellite structure and radomes. 177°C (350°F ) Cure Cyanate Ester.

Toray Toray Cetex® MC1322 New is a thermoplastic bulk molding compound (BMC) fabricated from Toray Cetex® TC1320 PEKK thermoplastic uni-directional tape. It is based on a semi-crystalline PEKK thermoplastic polymer and as such has excellent resistance to chemicals and solvents, while also offering excellent elevated service performance, good hot/ wet strength, and offers superior performance in flammability properties. Toray Cetex® MC1322 PEKK is offered on standard-modulus carbon fibers in lengths of up to 25.4 mm (1”). Intermediate modulus fibers and alternative lengths may also be available. Thermoplastic bulk molding compound allows part fabrication with short cycle times. This product also allows complex shapes to be made with varying wall thicknesses, integrated ribs, and reinforcing structures. Compression molded parts are used to replace metal parts for weight savings.

Toray RS-36 is an advanced modified epoxy system for structural composite Applicationss. RS-36 offers an excellent balance of mechanical properties, low moisture absorption, high glass transition temperatures, and a range of processing options. A higher Tg version, RS-36-1, with similar mechanical properties, is available. 177°C (350°F) Cure Epoxy Resin System

Toray RS-50 is a toughened low viscosity epoxy RTM resin. It features a long 4-hour pot life and a low minimum viscosity for excellent RTM and VARTM processing. It can also be used in wet winding Applicationss. 177°C (350°F) Curing Epoxy RTM Resin

Toray Toray MicroPly™ TCF4035 is a syntactic film compatible with 121°C (250°F) epoxy prepregs. It features a 30-day out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot). It features a higher service temperature than Toray TCF4025. Syntactic Epoxy Film.

Toray Toray Cetex® TC1200 is a high-end thermoplastic composite material, utilizing the semi-crystalline thermoplastic polymer PEEK for excellent mechanical performance. The long-standing use of PEEK in demanding Applicationss such as aerospace and cutting edge medical Applicationss proves its benefits and versatility. As a composite material it offers outstanding mechanical performance, also at elevated temperatures. The semi-crystalline nature of the resin ensures an excellent resistance to chemicals and solvents, and an equally superior performance in flammability properties. Toray Cetex® TC1200 is available in UD tape, fabric prepreg, and RTL formats (reinforced thermoplastic laminate). RTLs can be equipped with lightning strike protection, and carbon reinforced RTLs can be supplied with a thin glass top layer to protect a partly metallic assembly against galvanic corrosion. Glass scrim is also applicable in structures made from UD tape. PEEK (PolyEtherEtherKetone) Thermoplastic Resin System.

Toray Toray MicroPly™ EX-1541 cyanate ester syntactic foam is extremely unique in the industry due to its coupling of extremely low density and good structural properties. If packed well, the material does not require pressing during cure to achieve its mechanical properties and is easily machined to shape if required. Toray MicroPly™ EX-1541 is simply packed or injected into tooling cavities and can also be extruded with the proper tooling. Toray MicroPly™ EX 1541’s inherently low dielectric/low loss performance makes it ideal for radomes, antennas, and radar transparent structures, while its cyanate ester backbone chemistry assures low moisture absorption and low outgassing. These latter two features coupled with Toray MicroPly™ EX-1541’s low isotropic CTE make it ideal for spacecraft and other dimensionally stable structures and tooling. Toray MicroPly™ EX-1541 can be accurately machined and hand-finished. Sanding and fairing is easily performed on cured Toray MicroPly™ EX-1541 and is similar to working with balsa wood. Variants from 176–384 kg/m³ (11–24 lb/ft³) (pcf) are available.

Toray’s TC250 offers an excellent balance of toughness, mechanical properties, and hot/wet performance. It is easily processed via vacuum bag/oven, autoclave, or press curing operations. Although TC250 is a 130°C (265°F) cure system, it can be post cured for a higher dry and wet Tg, which enhance the product’s elevated temperature performance. TC250 can also be cured or freestanding post cured to 177°C (350°F) to increase its high temperature performance. TC250 is available with virtually all fiber reinforcements in uni-directional tape, slit unidirectional tape, woven, and non-woven prepreg forms. 130°C (265°F) Cure, Toughened Epoxy Resin System

Toray Toray Cetex® MC1200 is a thermoplastic bulk molding compound (BMC) based upon Cetex TC1200 PEEK thermoplastic uni-directional tape. Toray Cetex® MC1200 is offered on standard-modulus fibers lengths of up to 25.4 mm (1”). Intermediate modulus fibers and alternative lengths may also be available. Thermoplastic bulk molding compound allows part fabrication with short cycle times. This product allows complex shapes to be made with varying wall thickness, integrated ribs, and reinforcing structure. Many composite compression molded parts are used to replace metal parts for weight savings or they replace plastic injection molded parts where higher strengths or stiffness are required. Toray Cetex® MC1200-4A, PEEK, 25.4 mm (1”) represents standard-modulus AS-4 fiber chopped to 25.4 mm (1”) in length.

Toray Toray Cetex® TC1000 Premium is a high-end thermoplastic composite, utilizing the amorphous PEI polymer for outstanding toughness and an inherently outstanding fire, smoke, and toxicity performance (< 15/15 OSU). With over 30 years in flight, Toray Cetex® TC1000 Premium is utilized in a consistently growing number of Applicationss. The material has gained a wide array of qualifications at Airbus, Boeing, and many other airframe OEMs. Compared to its semi-crystalline counterparts, Toray Cetex® TC1000 Premium can be used to achieve even shorter cycle times in part production. The material exhibits a superior bondability, which makes it very suitable for hybrid assemblies consisting of different materials. Toray Cetex® TC1000 is available as a UD tape and as a fabric prepreg, but is typically supplied in pre-consolidated reinforced thermoplastic laminates (RTLs) of varying thicknesses. Laminates and prepregs are available in black, cream white, gray, and natural (amber) resin colors. PEI (PolyEtherImide) Thermoplastic Resin System.

Toray MS-1A is a high performance carbon fiber/epoxy resin compression molding system based on high-modulus carbon fiber. MS-1A compression molding compound yields unparalleled stiffness and high strength. MS-1A is qualified for space Applicationss. 138°C (280°F) Cure High-Modulus Compression Molding System

Toray E721-FR is a modified epoxy resin system of medium viscosity for cures at 120°C (248°F), pre-impregnated into high performance fibers such as carbon, glass, and aramid. Toray E721-FR offers excellent structural properties, flame retardancy, and exceptional toughness allowing direct lamination to honeycomb without the use of resin film. Toray E721-FR is designed for structural Applicationss in the motor racing, marine industries, and for a wide range of engineering Applicationss. If fire-retardant properties are not required, consult separate data sheet for Toray E720.

Toray EX-1545 is a 2-part highly modified, tough cyanate ester resin formulated to have extremely low viscosity at room temperature. The low viscosity allows RTM processing with minimal heat to the resin, which extends resin pot life and mold filling time for difficult and/or large RTM’d structures. EX-1545 displays both excellent mechanical and thermal properties in addition to low moisture absorption. Finally, the material is unique in that it develops full mechanical properties from its initial 177°C (350°F) cure. 177°C (350°F) Curing Toughened Cyanate Ester for RTM Applicationss

Toray Toray MicroPly™ SF-4 is a BMI syntactic film that provides excellent elevated temperature properties and compatible to Toray RS-8HT. Toray MicroPly™ SF-4 is available in unsupported or supported continuous film form in various thicknesses from 0.25–2.5 mm (10 mils– 100 mils). Toray MicroPly™ SF-4 has been evaluated and qualified in aerospace structures. 204°C (400°F) Cure BMI Syntactic Film. Film to 127 cm (50”) wide.

Toray Toray Cetex® TC925 FST is a value-oriented engineered thermoplastic composite, utilizing a polycarbonate compound for impact toughness and good fire resistance. Although Toray Cetex® TC925 FST is a cost-effective material to begin with, the real cost saving on a part level lies in streamlining production with < 3 minutes per automated process cycle, cutting out most manual postprocessing and potential for error. Additionally, this material offers a very good surface quality. Toray Cetex® TC925 FST is available as a fabric prepreg, but is typically supplied in pre-consolidated reinforced thermoplastic laminates (RTLs) of varying thicknesses and lay-ups. Laminates from natural color resin have a translucent quality. A white color option is also available. PolyCarbonate (PC) Thermoplastic Resin System.

Toray Toray Microply™ TC235SF-1 is a composite surfacing film designed to provide paintable composite surfaces off of the tool. It may be cured under vacuum-only pressure or under low autoclave pressure. The surfacing properties of Toray MicroPly™ TC235SF-1 allow smooth, paintable surfaces, even with thin-skinned honeycomb-stiffened composite structure. Epoxy Surfacing System 121°C–177°F (250°F–350°F).

Toray BTCy-2 is our lowest dielectric cyanate ester prepreg resin system. This resin system is valued in high-energy microwave Applicationss due to the low loss tangent. 177°C (350°F) Cure Cyanate Ester

Toray BT250E-6 resin system is a 121°C (250°F) cure epoxy prepreg with excellent strength and stiffness. It provides an outstanding surface finish under vacuum bag/oven cure. BT250E-6 has an FAA-conformed database on carbon IM-7 uni-directional tape, S2-glass, and AS-4C plain weave.

Toray TC380 sets a new benchmark for toughened epoxy prepreg systems. TC380 is extremely tough with an excellent balance of OHC, OHT, CAI, and GIC/GIIC properties. It features low moisture absorption with outstanding hot/wet mechanical properties to 121°C (250°F). TC380 is optimized for out-of-autoclave/vacuum bag only (OOA/VBO) cures, facilitating construction of large or complex composite parts and assemblies. Unlike some other highly toughened systems, there is no need to sequence the prepreg front and back face, assuring robustness and simplifying lay-up. TC380 out life are 21 and 28 days, respectively. 180°C (356°F) Cure, Toughened Epoxy Resin System

Toray TC420 is a flow-controlled high temperature cyanate ester resin, toughened to resist microcracking. TC420 is specifically formulated to facilitate production of large out-of-autoclave structures. It can act as a self-adhesive system and is resistant to microcracking. This resin represents a new family of next generation high temperature resins, film adhesives, syntactic paste and expanding foams for ultra-high temperature conditions. TC420 is easy to process, and yields low void laminates with a flexible cure cycle under vacuum-only pressure. This system is also autoclave processable. TC420 is an attractive alternative to bismaleimide (BMI) and polyimide resins.

Toray TC890 high temperature polyimide prepreg system utilizes PROOF Research Advanced Composites Division 900HT resin system. TC890 is a high temperature, polyimide-based thermoset prepreg with outstanding dry property retention at 343°C (650°F), wet service property retention at 288°C (550°F), and short-term and intermittent service temperature capability to 427°C (800°F). TC890 has been successfully demonstrated in short term, transient heating Applicationss to temperatures as high as 1300°F. TC890 is an excellent non-MDA replacement for high temperature PMR-15 Applicationss. TC890 prepreg system is easily processable and thermally stable, exhibiting the highest glass transition temperature of commercially available structural matrices. This system displays exceptional toughness, excellent dielectric properties, and low toxicity. High Temperature Polyimide

Toray Toray AmberTool® TC40 is a BMI resin that which provides excellent elevated temperature properties and processability. Toray AmberTool TC40 has been designed for high temperature tooling Applicationss. BMI Tooling Prepreg.

Toray Toray Cetex® MC1100 PPS is a thermoplastic bulk molding compound (BMC) based upon Toray Cetex® TC1100 PPS thermoplastic uni-directional tape. Toray Cetex® MC1100 PPS is offered on standard-modulus fibers in lengths of up to 25.4 mm (1”). Intermediate-modulus fibers and alternative lengths may also be available. Thermoplastic bulk molding compound allows part fabrication with short cycle times. Many composite compression molded parts are used to replace metal parts for weight savings or replace plastic injection molded parts where higher strengths or stiffness are required. Toray Cetex® MC1100-4A, PPS, 25.4 mm (1”) represents standard-modulus AS-4 fiber chopped to 25.4 mm (1”) in length.

Toray Toray MicroPly™ SF-5 is a cyanate ester based syntactic film developed to be compatible with various cyanate ester matrices, including Toray RS-3. Toray MicroPly™ SF-5 is available in unsupported and supported continuous film form in thicknesses from 0.25–6.35 mm (10–250 mils). Toray MicroPly™ SF-5 has been evaluated and qualified in aerospace and dielectric structures. 177°C (350°F) Cure Cyanate Ester Syntactic Film. Film to 127 cm (50”) wide.

Toray EX-1510 is a highly modified two-part toughened cyanate ester resin formulated to have extremely low viscosity at room temperature. Its viscosity allows resin transfer molding (RTM) to take place without the Applications of heat to the resin. This feature provides long resin pot life and mold filling time for difficult and/or large RTM’d structures and helps increase manufacturing efficiency and reduces waste. EX-1510 displays excellent mechanical and thermal properties in addition to low moisture absorption. Finally, the material is unique in that it develops full mechanical properties from its initial 177°C (350°F) cure. A freestanding post cure increases the heat resistance.

TC275-1E is an extended out time version of the TC275-1 resin system. TC275-1E is a flexible cure toughened epoxy prepreg designed to enable composite part construction with low pressure or vacuum bag only (VBO) cures. The resin system provides a 28-day total out time to facilitate construction of thick or larger composite structures. TC275-1E may be cured at temperatures from 135°C (275°F) to 177°C (350°F) for higher temperature service. 135–177°C (275–350°F) Cure Toughened Epoxy Resin System

Aluminum Flex-Core® honeycomb utilizes either 5052 or 5056 alloy foil material and is available in two cell sizes. FlexCore® has unique cell configurations that significantly reduce anticlastic behavior and permit small radii of curvature without deformation of the cell walls or loss of mechanical properties. Aluminum Flex-Core® has been developed to allow the designer and fabricator freedom in the utilization of honeycomb for components requiring simple and compound curvatures. Highly contoured sandwich panels such as leading edges and flaps, nacelles, fairings, doors, and access covers, and other parabolic, spherical, and cylindrical shapes are prime Flex-Core® candidates. Duplicate die model and control tooling for aerospace use are also examples of Flex-Core® Applicationss. As with standard aluminum honeycomb, Flex-Core® provides controlled crush characteristics without rebound and thus curved energy absorption units become feasible and economical.

Toray RS-3 is a modified cyanate ester prepreg resin developed to provide a good balance between toughness and high temperature/wet performance. RS-3 has been evaluated and qualified in the areas of satellite, airframe/missile, and dielectric structures. RS-3 is also available in several modified formulations including: RS-3C, a controlled-flow vacuum-bag/oven-cure version; and RS-3M, an extremely low-flow autoclave version. 177°C (350°F) Service Toughened Cyanate Ester Resin