Products

Toray TC410 is Toray’s newest high performance cyanate ester resin system designed specifically for the latest generation of radomes and satellite structures. TC410 is unique in that it allows for low stress cures at 121°C (250°F) while achieving extremely low moisture absorption and high conversion levels. The lower cure temperature allows for lower stress in part fabrication. TC410 possesses all the key attributes for satellite use with good resistance to atomic radiation, low microcracking, and excellent resistance to process moisture. TC410 possesses low dielectric and loss tangents for radome usage. 121°C (250°F) Cure Toughened Cyanate Ester Resin System

Toray EX-1515 cyanate ester prepreg resin system is unique in the industry in that it is able to achieve an extremely high level of cure conversion after a 121°C (250°F) cure. This level of conversion provides optimal mechanical properties, high radiation resistance, low moisture absorption, and low outgassing while retaining unparalleled toughness, a low 118°C (244°F), stress-free temperature, and long out time. The resin system excels in its ability to resist microcracking, even when subjected to thermal cycling and high levels of radiation exposure. EX-1515 also displays low dielectric and low loss values which makes it outstanding for radome and antenna Applicationss. EX-1515 can be post cured, freestanding, to increase thermal performance for temperature-critical structures. 107–121°C (225–250°F) Cure Toughened Cyanate Ester

Toray BT250E-1 resin system is a 121°C (250°F) cure epoxy prepreg system with excellent toughness and strength. It provides an outstanding surface finish under vacuum-bag/oven-cure only. The resin system, which is self-adhesive to honeycomb and foam core, is MIL-R-9300 qualified and makes a great choice for many Applicationss in the low-tomedium-service temperature range.

Toray Toray AmberTool® HX42 is a low temperature curing epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 190°C (374°F) is achieved. Toray AmberTool® HX42 is an exceptional and very well proven system that exhibits a high end use temperature and extended out life. 50–75°C (122–167°F) Low Temperature Curing Epoxy Tooling Prepreg.

Toray’s TC250 offers an excellent balance of toughness, mechanical properties, and hot/wet performance. It is easily processed via vacuum bag/oven, autoclave, or press curing operations. Although TC250 is a 130°C (265°F) cure system, it can be post cured for a higher dry and wet Tg, which enhance the product’s elevated temperature performance. TC250 can also be cured or freestanding post cured to 177°C (350°F) to increase its high temperature performance. TC250 is available with virtually all fiber reinforcements in uni-directional tape, slit unidirectional tape, woven, and non-woven prepreg forms. 130°C (265°F) Cure, Toughened Epoxy Resin System

Toray Toray Cetex® MC1200 is a thermoplastic bulk molding compound (BMC) based upon Cetex TC1200 PEEK thermoplastic uni-directional tape. Toray Cetex® MC1200 is offered on standard-modulus fibers lengths of up to 25.4 mm (1”). Intermediate modulus fibers and alternative lengths may also be available. Thermoplastic bulk molding compound allows part fabrication with short cycle times. This product allows complex shapes to be made with varying wall thickness, integrated ribs, and reinforcing structure. Many composite compression molded parts are used to replace metal parts for weight savings or they replace plastic injection molded parts where higher strengths or stiffness are required. Toray Cetex® MC1200-4A, PEEK, 25.4 mm (1”) represents standard-modulus AS-4 fiber chopped to 25.4 mm (1”) in length.

Toray Toray AmberTool® HX50 is a low temperature curing epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 180°C (356°F) is achieved. Toray AmberTool® HX50 achieves an excellent surface finish for small to medium sized autoclave tooling. 40–55°C (104–131°F) Low Temperature Curing Epoxy Tooling Prepreg.

Toray E745 is a 135°C (275°F) cure toughened epoxy component prepreg. E745 has been developed for impact structures and other mechanically demanding structural Applicationss. E745 can be impregnated into a range of fiber and fabric types. 135°C (275°F) Cure Mid Temperature Curing Toughened Epoxy Component Prepreg.

BTCy-1 is a 177°C (350°F) curing cyanate ester and is an industry standard for use on satellite structure and radomes. 177°C (350°F ) Cure Cyanate Ester.

Toray Toray Cetex® MC1322 New is a thermoplastic bulk molding compound (BMC) fabricated from Toray Cetex® TC1320 PEKK thermoplastic uni-directional tape. It is based on a semi-crystalline PEKK thermoplastic polymer and as such has excellent resistance to chemicals and solvents, while also offering excellent elevated service performance, good hot/ wet strength, and offers superior performance in flammability properties. Toray Cetex® MC1322 PEKK is offered on standard-modulus carbon fibers in lengths of up to 25.4 mm (1”). Intermediate modulus fibers and alternative lengths may also be available. Thermoplastic bulk molding compound allows part fabrication with short cycle times. This product also allows complex shapes to be made with varying wall thicknesses, integrated ribs, and reinforcing structures. Compression molded parts are used to replace metal parts for weight savings.

Toray RS-36 is an advanced modified epoxy system for structural composite Applicationss. RS-36 offers an excellent balance of mechanical properties, low moisture absorption, high glass transition temperatures, and a range of processing options. A higher Tg version, RS-36-1, with similar mechanical properties, is available. 177°C (350°F) Cure Epoxy Resin System

Toray BTCy-2 is our lowest dielectric cyanate ester prepreg resin system. This resin system is valued in high-energy microwave Applicationss due to the low loss tangent. 177°C (350°F) Cure Cyanate Ester

Toray E750 is a toughened epoxy component prepreg developed for structural Applicationss within Formula 1 and high performance automotive. Toray E750 allows curing from 80°C (176°F) to 180°C (356°F) and can be impregnated into a range of fiber and fabric types.

Toray Toray AmberTool® HX56 is a low temperature curing epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 180°C (356°F) is achieved. Toray AmberTool® HX56 achieves an excellent surface finish for small to medium sized autoclave tooling.

Toray TC420 is a flow-controlled high temperature cyanate ester resin, toughened to resist microcracking. TC420 is specifically formulated to facilitate production of large out-of-autoclave structures. It can act as a self-adhesive system and is resistant to microcracking. This resin represents a new family of next generation high temperature resins, film adhesives, syntactic paste and expanding foams for ultra-high temperature conditions. TC420 is easy to process, and yields low void laminates with a flexible cure cycle under vacuum-only pressure. This system is also autoclave processable. TC420 is an attractive alternative to bismaleimide (BMI) and polyimide resins.

Toray TC380 sets a new benchmark for toughened epoxy prepreg systems. TC380 is extremely tough with an excellent balance of OHC, OHT, CAI, and GIC/GIIC properties. It features low moisture absorption with outstanding hot/wet mechanical properties to 121°C (250°F). TC380 is optimized for out-of-autoclave/vacuum bag only (OOA/VBO) cures, facilitating construction of large or complex composite parts and assemblies. Unlike some other highly toughened systems, there is no need to sequence the prepreg front and back face, assuring robustness and simplifying lay-up. TC380 out life are 21 and 28 days, respectively. 180°C (356°F) Cure, Toughened Epoxy Resin System

Toray C640 is a cyanate ester resin system suitable for curing between 70°C (158°F) and 135°C (275°F). The medium viscosity resin is pre-impregnated into high-performance fibers such as carbon, glass and aramid. The system is capable of withstanding very high temperatures and is inherently flame-retardant. After a suitable post cure, the glass transition temperature can be increased to as high as 335°C (635°F).

Toray MS-1A is a high performance carbon fiber/epoxy resin compression molding system based on high-modulus carbon fiber. MS-1A compression molding compound yields unparalleled stiffness and high strength. MS-1A is qualified for space Applicationss. 138°C (280°F) Cure High-Modulus Compression Molding System

Toray E721-FR is a modified epoxy resin system of medium viscosity for cures at 120°C (248°F), pre-impregnated into high performance fibers such as carbon, glass, and aramid. Toray E721-FR offers excellent structural properties, flame retardancy, and exceptional toughness allowing direct lamination to honeycomb without the use of resin film. Toray E721-FR is designed for structural Applicationss in the motor racing, marine industries, and for a wide range of engineering Applicationss. If fire-retardant properties are not required, consult separate data sheet for Toray E720.

Toray E731 is a toughened epoxy resin system designed to deliver enhanced resin clarity for cosmetic components within high performance automotive. The resin formulation ensures that components are free from white-spots and exhibit high clarity.

Toray TC346 is a high temperature epoxy component prepreg developed for structural Applicationss within Formula 1 and high performance automotive. Toray TC346 is designed to deliver enhanced compression properties to manufactured parts while maintaining a good fracture toughness. When exposed to elevated temperature environments, TC346 composites demonstrate excellent retention of mechanical performance.

Toray Toray MicroPly™ SF-4 is a BMI syntactic film that provides excellent elevated temperature properties and compatible to Toray RS-8HT. Toray MicroPly™ SF-4 is available in unsupported or supported continuous film form in various thicknesses from 0.25–2.5 mm (10 mils– 100 mils). Toray MicroPly™ SF-4 has been evaluated and qualified in aerospace structures. 204°C (400°F) Cure BMI Syntactic Film. Film to 127 cm (50”) wide.

Toray Toray AmberTool® HX32-1 New is an epoxy composite tooling prepreg. After a suitable post cure, an end use temperature of 140°C (284°F) is achieved. Toray AmberTool® HX32-1 prepreg is ideal for large tooling Applicationss. 65–80°C (149–176°F) Curing Epoxy Tooling Prepreg.

Toray BT250E-6 resin system is a 121°C (250°F) cure epoxy prepreg with excellent strength and stiffness. It provides an outstanding surface finish under vacuum bag/oven cure. BT250E-6 has an FAA-conformed database on carbon IM-7 uni-directional tape, S2-glass, and AS-4C plain weave.

Toray Toray AmberTool® TC40 is a BMI resin that which provides excellent elevated temperature properties and processability. Toray AmberTool TC40 has been designed for high temperature tooling Applicationss. BMI Tooling Prepreg.

Toray TC890 high temperature polyimide prepreg system utilizes PROOF Research Advanced Composites Division 900HT resin system. TC890 is a high temperature, polyimide-based thermoset prepreg with outstanding dry property retention at 343°C (650°F), wet service property retention at 288°C (550°F), and short-term and intermittent service temperature capability to 427°C (800°F). TC890 has been successfully demonstrated in short term, transient heating Applicationss to temperatures as high as 1300°F. TC890 is an excellent non-MDA replacement for high temperature PMR-15 Applicationss. TC890 prepreg system is easily processable and thermally stable, exhibiting the highest glass transition temperature of commercially available structural matrices. This system displays exceptional toughness, excellent dielectric properties, and low toxicity. High Temperature Polyimide

Toray E722 is a 120°C (248°F) cure toughened epoxy component prepreg. E722 is designed for structural Applicationss in the motorsport and marine industries. Toray E722 would also suit general aircraft fittings, sporting equipment, and a wide range of engineering Applicationss. Toray E722 is compatible for co-cure with Toray MicroPly™ EF72, a 120°C (248°F) cure resin film, and Toray MicroPly™ SC72A syntactic core. 120°C (248°F) Cure Toughened Epoxy Resin System

Toray Toray Cetex® MC1100 PPS is a thermoplastic bulk molding compound (BMC) based upon Toray Cetex® TC1100 PPS thermoplastic uni-directional tape. Toray Cetex® MC1100 PPS is offered on standard-modulus fibers in lengths of up to 25.4 mm (1”). Intermediate-modulus fibers and alternative lengths may also be available. Thermoplastic bulk molding compound allows part fabrication with short cycle times. Many composite compression molded parts are used to replace metal parts for weight savings or replace plastic injection molded parts where higher strengths or stiffness are required. Toray Cetex® MC1100-4A, PPS, 25.4 mm (1”) represents standard-modulus AS-4 fiber chopped to 25.4 mm (1”) in length.

Toray TC264-1 is a flame-retardant epoxy prepreg that has been developed for oven cure composite fabrication processes utilizing either expendable or reusable lay-up mandrels. This epoxy-based prepreg system is ideal for use in Applicationss where flame retardency is needed such as air management system ducting, decorative enclosures, and fire-retardent composite panel assemblies. 127°C (260°F) Cure, Fire Retardant Epoxy Prepreg

Toray Toray AmberTool® HXR56 New is a low temperature curing epoxy composite tooling prepreg, fully impregnated into a carbon multiaxial backing ply construction. This two-layer product facilitates 3-D construction while allowing efficient lay-up, reducing overall tooling costs. HXR56 prepreg is co-compatible with our heritage AmberTool® HX56 carbon 205gsm 2x2 twill reinforcement surface ply. After a suitable post cure, an end use temperature of 180°C (356°F) is achieved. 40–55°C (104–131°F) Low Temperature Curing Epoxy Tooling Prepreg.

Toray C740 is a cyanate ester resin system for cures at 135°C (275°F), pre-impregnated into high performance fibers such as carbon, glass and aramid. The system is capable of withstanding very high temperatures and is inherently flame-retardant. After a suitable post cure the glass transition temperature can be increased to as high as 325°C (617°F).

Toray RS-1 is an epoxy prepreg resin that provides an excellent balance of mechanical properties, toughness, and modulus. RS-1 has been evaluated and qualified in areas ranging from marine to aerospace and dielectric structures. RS-1 is also available in a lower temperature curing formulation 80°C (176°F).

Toray Toray CFRT® TW-2000 is a reinforced thermoplastic composite laminate. It blends the benefits of a thermoplastic polymer matrix with woven carbon fibers in a twill weave for enhanced performance. The TW-2000 1L & 2L style laminate is available in a single or multilayer product; carbon fiber reinforcement at 0° and 90° orientations that is ultra-thin, lightweight, and resilient for improved energy return.

Toray Toray CFRT® AG18-2L is a reinforced thermoplastic composite laminate. It blends the benefits of a thermoplastic polymer matrix with woven glass fibers in a plain weave for enhanced performance. The AG-18 2L style laminate is available in a dual-layer product with glass fibers in both directions (0° & 90°). This construction is ultra-thin, lightweight, and resilient for improved energy return.

Toray E650 is a low temperature curing toughened resin system pre-impregnated into high performance fibers such as carbon, glass and aramid. It is designed for the production of composite structures in the leisure and sporting industries and also for a range of engineering Applicationss. Toray E650 is compatible for co-cure with Toray’s low temperature cure resin film, Toray EF44, and Toray’s low temperature cure syntactic core, Toray MicroPly™ LT64.

Toray E726 is a toughened epoxy resin system with controlled flow for cures at 120°C (248°F), pre-impregnated into high performance fibers such as carbon, glass and aramid. It is designed for use within medical and industrial Applicationss and would also suit a wide range of engineering Applicationss. Toray E726 is compatible for co-cure with Toray EF72, a 120°C (248°F) cure resin film and Toray MicroPly™ SC72A syntactic core.