Products

WACKER® Silicone Paste P 12 is a pure white, soft-consistency heat sink paste with marked thermal conductivity. It is electrically insulating. WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. When there is a need for good heat transfer from a semiconductor to a cooling element, applying a thin coating of WACKER® PASTE P 12 is advisable. In the assembly of semiconductors such as diodes, transistors, and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. These surface irregularities can hinder firm metal-to-metal contact when assembled.

SEMICOSIL® 9671 TC2 A/B is a thermal conductive gap filler silicone material used in heat sink applications for the electronics industry. It is a shear-thinning, easy-dispensing, non-slump, addition-curing, two-part silicone rubber that cures at room temperature. This material is specifically designed to enhance heat dissipation and provide efficient thermal management in electronic devices. SEMICOSIL® 9671 TC2 A/B is ideal for filling gaps and ensuring effective heat transfer in heat sink applications.

SEMICOSIL® 961 TC A/B is a shear-thinning, easy-dispensing, non-slump, two-part silicone rubber that cures at room temperature. It transforms into a soft and tacky rubber with excellent thermal conductivity. Specifically designed as an interface material, SEMICOSIL® 961 TC A/B is ideal for heat sink applications in the electronics industry.