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SEMICOSIL® 961 TC A/B

1 of 27 products in this brand
SEMICOSIL® 961 TC A/B is a shear-thinning, easy-dispensing, non-slump, two-part silicone rubber that cures at room temperature. It transforms into a soft and tacky rubber with excellent thermal conductivity. Specifically designed as an interface material, SEMICOSIL® 961 TC A/B is ideal for heat sink applications in the electronics industry.

Application Area: Batteries, Electric Vehicle (EV) Batteries, Electrical Components, Power Control Unit (PCU), Sensors

Features: Abrasion Resistant, Cost Effective, Easy To Dispense, Good Gap Filling Capabilities, Good Stability, Good Thermal Conductivity, High Durability, Low VOC, Low Volatility, Non-slump, Shear Thinning, Shorter Cycle Time, Soft, Tacky, Thermally Conductive

Chemical Family: Silicones

Technical Data Sheet

Knowde Enhanced TDS

Identification & Functionality

Chemical Family

Features & Benefits

Materials Features

Applications & Uses

Applications
  • Automotive Electronics
  • Battery
  • Electrics & Electronics
  • Power Control Unit (PCU)
  • Power Electronics
  • Thermal Interface Management
Application Details

Interface material for heat sink applications for the electronics industry

Processing

The platinum catalyst is contained in component A. Only components A and B with the same lot number may be processed together.

Temperature

Curing time, thickness 6mm, 90% cure

25°C 300 min
100°C 5 min

Properties

Flame Rating
Physical Form
Catalyst Properties
ValueUnitsTest Method / Conditions
Dynamic Viscosity (A+B, Catalyzed, at 23°C, Shear rate 10 s⁻¹)130000mPa·sISO 3219
Mix Ratio (A:B)1:1parts by weight
Platinum Catalyst in Component (A+B)Component A
Pot Life (A+B, at 23°C, up to 300,000 mPa.s)60minutesDIN EN ISO 3219
Technical Data
ValueUnitsTest Method / Conditions
Thermal Conductivity2.3W/mK
Cured Properties
ValueUnitsTest Method / Conditions
Density (in water, at 23°C)2.9g/cm³DIN EN ISO 1183-1 A
Dielectric Strength8kV/mmIEC 60243-1
Flame RatingV-0Internal test acc. UL94
Heat Capacity1J/gK
Shore Hardness 0055ASTM D 2240
Siloxane D4-D8max. 350 ppmppmNSCG012
Thermal Conductivity2.3W/m.KASTM D 5470-12
Volume Resistivitymin. 10¹³ Ohm-cmIEC 62631-3-1
Uncured Properties
ValueUnitsTest Method / Conditions
Density (at 23°C, Componenet A)2.9g/cm³DIN EN ISO 1183-1 A
Dynamic Viscosity (Component A, at 23°C, Shear rate 10 s⁻¹)130000mPa·sISO 3219
Dynamic Viscosity (Component B, at 23°C, Shear rate 10 s⁻¹)130000mPa·sISO 3219
Properties
  • Gap filler, thermal conductivity 2.3 W/mK
  • Two-part, RT curing
  • Constant properties from –50 °C to 130 °C
  • Low stress, soft and tacky
  • D4-D8 < 350 ppm
Note

Cured for 5 min at 165°C

Regulatory & Compliance

Packaging & Availability

Country Availability
Regional Availability
  • Africa
  • Asia
  • Europe
  • Latin America
  • Middle East
  • North America
  • Oceania