Products

WACKER® Silicone Paste P 12 is a pure white, soft-consistency heat sink paste with marked thermal conductivity. It is electrically insulating. WACKER® PASTE P 12 is used especially in semiconductor technology as a heat sink paste. When there is a need for good heat transfer from a semiconductor to a cooling element, applying a thin coating of WACKER® PASTE P 12 is advisable. In the assembly of semiconductors such as diodes, transistors, and thyristors, microscopic irregularities may exist on the mating surfaces of the semiconductor and the cooling surface. These surface irregularities can hinder firm metal-to-metal contact when assembled.

SEMICOSIL® 9672 TC is a thermally conductive gap filler silicone material designed for heat sink applications in the electronics industry. It is a shear-thinning, non-slump, two-part silicone gel that cures at room temperature to a soft gel with excellent thermal conductivity.

SEMICOSIL® 9671 TC2 A/B is a thermal conductive gap filler silicone material used in heat sink applications for the electronics industry. It is a shear-thinning, easy-dispensing, non-slump, addition-curing, two-part silicone rubber that cures at room temperature. This material is specifically designed to enhance heat dissipation and provide efficient thermal management in electronic devices. SEMICOSIL® 9671 TC2 A/B is ideal for filling gaps and ensuring effective heat transfer in heat sink applications.

SEMICOSIL® 962 TC A/B is a gap filler paste material with excellent thermal conductivity. It is a two-part silicone rubber that is shear-thinning, easy to dispense, and non-slump. This addition-curing formulation cures at room temperature, resulting in a soft, flexible, and tacky rubber with outstanding thermal conductivity properties.

SEMICOSIL® 9981 TC is a one-part, thermally conductive paste with electrical conductivity that cures into a gap-filling silicone. The thermal paste efficiently fills the finest gaps of heat-generating and ablating substrates, minimizing contact resistance. The thermal resistance is minimized due to an exceptional thermal conductivity of 10 W/mK, in combination with the possibility of reducing bond line thickness to 10 μm.

SEMICOSIL® 961 TC A/B is a shear-thinning, easy-dispensing, non-slump, two-part silicone rubber that cures at room temperature. It transforms into a soft and tacky rubber with excellent thermal conductivity. Specifically designed as an interface material, SEMICOSIL® 961 TC A/B is ideal for heat sink applications in the electronics industry.