Products in Industrial & Assembly Adhesives: Epoxy & Epoxy Derivatives

ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

Fast Set Epoxy 8332 is a quick-set 2-part epoxy adhesive. Bonded parts need only be held together for eight to ten minutes before handling. It offers excellent adhesion to a wide range of materials that are difficult to bond with, including glass, fiberglass, concrete, ceramics, woods, and most metals and plastics. This is a general-purpose adhesive suitable for household, industrial and manufacturing applications.

EPOXIBOND™ EB-119SP is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

EPOXIBOND™ EB-119M is a two component, low viscosity, heat cure epoxy designed for high temperature applications. It is especially well suited to fiber optic terminating, where optical fibers are "pot and polished" into connectors or ferrules.

EPOXIBOND™ EB-107LY is a two-part, low viscosity, clear epoxy adhesive and encapsulating material. EB-107LY is a low yellowing version of EB-107LP-2. It is recommended for bonding and encapsulating where reduced yellowing is preferred. It is recommended for joining transparent materials, such as glass, and where a thin bond line is desired. EB-107LY can be used for bonding most metals, ceramics, and some plastics.

EPOXIBOND™ EB-135LP is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume & cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics.

EPOXIBOND™ EB-153 is unfilled, low viscosity, heat curing, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates. It has long pot-life and has an amber color change upon cure.

FLASHBOND™ UV-3607HTis a 1-component, UV/Thermal cure adhesive & sealant. This material can cure under moderate intensity UV light as well as elevated temperatures for shadowed areas. Its low viscosity is ideal for coating, capillary action, and doming applications. Unlike traditional dual cure epoxy systems which need light + heat, UV-3607HT can cure either with UV/LED light or with heat.

EPOXIBOND™ EB-135 is a clear epoxy adhesive designed for electronic, optical, medical, and general applications and for casting of small electrical components. This epoxy system has 2 to 1 mixing ratio by volume & cure fast at moderate temperature. The cured adhesive gives high impact and bond strength. It can be used for bonding glass, metals, woods and some plastics

Epilox F 16-01 is a colorless, low-molecular-weight bisphenol F epoxy resin.

RIKARESIN DME-100 is an alicyclic epoxy resin that is useful as a diluent with low viscosity and low Tg drop, has excellent weather resistance, mechanical properties, and electrical properties, and is suitable for electrical insulating materials, adhesives, paints, etc.

BB Resins BB-EPA 1100 is a medium viscosity unmodified epoxy resin obtained by blend of Bisphenol A/Bisphenol F based resins.

PHOTOMER® 3016-40G is a moderate viscosity, non volatile, acrylic ester derived from a low molecular weight aromatic epoxy resin. The product exhibits very fast cure speed.

Epilox A 19-04 is a low molecular weight bisphenol A epoxy resin with medium viscosity.

Silquest™ A-186 silane adhesion promoter, can result in better electrical and/or mechanical properties in a variety of applications and industries. From enhancing electronic encapsulants to enabling improved sealant formulations, Silquest™ A-186 silane provides both epoxy and silane functionalities that promote adhesion in a range of formulations, including SPUR+ prepolymer, urethane, epoxy, silicone, and acrylic caulks, coatings, sealants and adhesives.

PHOTOMER® 3316 is a 100% low viscosity modified epoxy acrylate oligomer. It is used to increase hardness and gloss levels, is very fast curing with excellent solvent resistance, and has versatility of use, especially for overprint varnishes, wood coating and pigmented systems.

Epilox A 19-03 is a medium viscosity bisphenol A epoxy resin which may crystallize on storage.

Epilox A 17-01 is a colorless, low-molecular-weight bisphenol A epoxy resin.

PHOTOMER® 3052 is a high viscosity, non-volatile, difunctional acrylate ester derived from a modified epoxy acrylate blend. The product exhibits fast cure speed, low odor and low skin irritancy. It is an excellent film former and contributes to unique performance properties typical of epoxy resins in UV/EB curable formulations.

PHOTOMER® 3016-20G is a moderate viscosity, non volatile, acrylic ester derived from a low molecular weight aromatic epoxy resin. The product exhibits very fast cure speed.

CoatOSil™ MP 200 silane promotes adhesion in a broad range of applications via multiple epoxy and silane groups on each oligomer chain. Its gamma-gylcidoxy propyl epoxide ring reacts with many organic groups while its alkoxy silane groups promote adhesion to inorganic substrates. Condensation of its silanol groups can also provide crosslinks between polymer chains.

Addison Clear Wave Coatings TCL-104 is a thermal conductive heat curable epoxy adhesive obtained by cataionic polymerization. It is a one component boron nitride filled non- electrically conductive adhesive ready for use, solvent free, heat curing and thixotropic.

Magna-Tac™ E645 is a two-part, thermosetting, formulated epoxy adhesive for bonding stack laminations used in stators, rotors, gyros, servomechanisms, synchros, transformers and magnetic amplifiers. It can also be used as an insulating varnish for impregnated coils and small electrical equipment. Bonding is achieved by heat. Only sufficient pressure to assure complete contact is needed.

PHOTOMER® 3319 is a low viscosity di functional aliphatic epoxy acrylate which exhibit of excellent reactivity and chemical resistance.

Magna-Tac™ M648-T is a high-strength, room-temperature-curing, 100%-Reactive, two-component, formulated epoxy adhesive designed for bonding all metals and other rigid materials (such as glass, ceramics, plastics, plastic foams and structural laminates) to themselves and to each other. Fully cured bonds exhibit minimal shrinkage, are electrical insulators and provide excellent resistance to weather, galvanic action and most chemical, acids and alkalis.