- Polymer Name:Polyvinylidene Fluoride (PVDF)
- Processing Methods:Injection Molding
- Fillers Included:Carbon Fiber
- Flexural Modulus:13930.0 - 13930.0 MPa
LNP™ THERMOCOMP™ Compound 5C004 is a Polyvinylidene fluoride (PVDF) resin-based compound infused with 20% carbon fiber, imparting excellent electrical conductivity. This grade offers remarkable stiffness and strength characteristics, making it well-suited for applications in electrical and electronics, energy management, electronic components, and industrial material handling. The compound is processed using injection molding techniques.