Products in Printed Circuit Boards (PCBs)

Microglass milled fibers are E-glass filaments. Microglass is used as reinforcement in composites to increase mechanical properties (impact, tensile, compressive and flexural), improve dimensional stability and minimize distortion at elevated temperatures.

Microglass milled fibers are E-glass filaments. Microglass is used as reinforcement in composites to increase mechanical properties (impact, tensile, compressive and flexural), improve dimensional stability and minimize distortion at elevated temperatures.

Neoflon FEP NF-0100 is a white solid film crafted via melt extrusion using neoflon FEP material. This film, infused with carbon and fluorine atoms, delivers exceptional heat resistance, chemical durability, and non-flammability. Known for its transparency and smoothness, it's adept at tasks like heat sealing, thermoforming, and welding. Its attributes extend to specialized surface treatment for improved adhesion, making it valuable across sectors such as automotive, electrical and electronics, aerospace, and transportation. Its applications span electrical components, printed circuit boards, wire and cable insulation, and aircraft components.

Staticide® 8696 Urethane Conformal Coating is a super tough coating with excellent chemical resistance. It protects against acidic and alkaline substances, making it an ideal choice for many general applications such as HVAC, fire alarms, relays, generators, motors, transformers, and battery-operated devices. Being ACL's hardest transparent conformal coating, it will not crack, yellow, or discolor over time under normal use. It provides outstanding protection without RoHS or REACH SVHC chemicals.

CC7130-PRTC is a low viscosity version of CC7130-PR for thin coating. It is a translucent coating liquid. It provides excellent protection for electronic components and devices that are highly sensitive to moisture. CC7130 PRTC, coated on PCB, provides more than 200 giga-ohm resistance at 1000 volt even when the board is in direct contact with salt water. It protects PCB to 1000 volt even after prolong exposure to 85CI85% humidity. In accelerated aging test, submerging in 5 wt% salt waters at 60°C, it protects copper surfaces for >24 hours. It is flexible to withstand extreme temperature cycles in Outdoor environment. CC7130-PRTC can easily be dispensed using conventional tools without vacuum deposition equipment. Compared to acrylic or urethane materials, CC7130-PRTC material has low moisture absorption and low moisture transmission rate.

CGSTAPE - 8459 is a polyimide backing and acrylic adhesive offers outstanding thermal resistance and excellent electrical insulating properties. This tape is used where toughness, puncture resistance, extreme resistance to heat are required.

Rainmaker Polymers ACOTASXXNA1 is an Antistatic Compound. Rainmaker Polymers' Antistat Concentrates dissipate surface charges and eliminate the undesirable effects of static build up.

Neoflon FEP NF-025B1 is a white solid film produced through melt extrusion using neoflon FEP material. With a composition rich in carbon and fluorine atoms, it exhibits remarkable heat resistance, chemical durability, and non-flammability. This film's attributes include transparency, smoothness, and the ability to bond with materials like adhesives, resins, and rubbers due to specialized surface treatments. Its versatility shines in applications across automotive, electrical and electronics, aerospace, and transportation sectors, encompassing areas like electrical components, printed circuit boards, wire and cable insulation, and aircraft parts.

Mineral Wool Fibers Are Inorganic Synthetic “Wool-Like” Fibers Comprised Mainly Of Silicates Of Calcium, Magnesium, And Aluminum.

ME 8452 is a reworkable, solvent free, pure silver filled, electrically and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials having highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80°C to 100°C. It is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE.

ME8456 is a reworkable, pure silver filled, electrically and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked from 80 to 100°C and is ideal for applications such as large area die attach and substrate attach because of its ability to bond materials with highly mismatched CTE's. Meets Mil-Std 883; Method 5011.5 and NASA-ESA Outgassing Requirements.

Rainmaker Polymers ACLLAS05NA1 is Antistat PEC. Rainmaker Polymers' Antistat Concentrates dissipate surface charges and eliminate the undesirable effects of static build up. It is a Chemical agent that bloom to the polymer's surface where they react with atmospheric moisture resulting in a microscopic layer of water on the surface that will dissipate the static charge.

CGSTAPE - 7258 (10mil) is a polyimide film, synthesized by polymerizing an aromatic dianhydride and an aromatic diamine. It possesses a unique combination of properties, including excellent electrical and physical properties over a wide range of temperatures.

Tedlar® TTR10AH8 is a DuPont registered trademark for a highly versatile polyvinyl fluoride (PVF) film that provides a long-lasting finish to a wide variety of surfaces exposed to harsh environments, while its inert, non-stick properties make it an excellent release film.

CGSTAPE - 7258 (6 mil) is a polyimide film, synthesized by polymerizing an aromatic dianhydride and an aromatic diamine. It possesses a unique combination of properties, including excellent electrical and physical properties over a wide range of temperatures.

CGSTAPE - 7258 (2 mil) is a polyimide film, synthesized by polymerizing an aromatic dianhydride and an aromatic diamine. It possesses a unique combination of properties, including excellent electrical and physical properties over a wide range of temperatures.

CGSTAPE - 7258 (8 mil) is a polyimide film, synthesized by polymerizing an aromatic dianhydride and an aromatic diamine. It possesses a unique combination of properties, including excellent electrical and physical properties over a wide range of temperatures.

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 milsFeatures Excellent Thermal Conductivity. Easy Liner Release. Excellent Chemical Resistance. Minimal Flow During Cure. Low CTE. Excellent High Temperature Performance.

Neoflon PFA AF-0025B1 is a white film known for its superior heat and chemical resistance, manufactured through melt extrusion with neoflon PFA material. Its molecular design, combining carbon and fluorine atoms with a perfluoroalkoxyl group, ensures outstanding nonadhesion and nonflammability properties. This film offers unique fabricating capabilities, including sealing, thermoforming, welding, and heat bonding. With specialized surface treatment, it now facilitates adherence to materials like adhesives, resins, and rubbers. Primarily utilized in electrical and electronics components, printed circuit boards, and aerospace applications, it guarantees high performance, low stretchability, and weldability.

Microglass milled fibers are E-glass filaments. Microglass is used as reinforcement in composites to increase mechanical properties (impact, tensile, compressive and flexural), improve dimensional stability and minimize distortion at elevated temperatures.

Neoflon FEP NF-01500 is a white solid film crafted through melt extrusion using neoflon FEP material. With a composition rich in carbon and fluorine atoms, it excels in heat resistance, chemical durability, and non-flammability. The film's notable attributes include remarkable transparency, smooth texture, and restricted stretchability. It facilitates diverse fabrication techniques like heat sealing, thermoforming, welding, and heat bonding, coupled with enhanced adhesion properties. Catering to sectors such as automotive, electrical and electronics, and aerospace, this product finds its niche in applications like printed circuit boards, wire and cable systems, and specialized aircraft components.

Wollastonite is a naturally occuring, non-metallic, acicular (needle-shape) mineral.

CGSTAPE - 7258 (7 mil) is a polyimide film, synthesized by polymerizing an aromatic dianhydride and an aromatic diamine. It possesses a unique combination of properties, including excellent electrical and physical properties over a wide range of temperatures.

Anhydrous Hydrofluoric Acid (AHF) is a highly flammable and corrosive liquid.• We deliver AHF in our ISO containers, manufactured to the highest safety standards and handled in-house, in addition to other packaging solutions tailored to customers´ needs.• We manufacture a range of AHF products, from industrial to top quality semiconductor grades.• Our logistics service provides just-in-time delivery to all our customers.• Safety is a core value for DDF, and our track record is representative of our commitment. Our highly qualified technical team offers an advisory service to our clients in order to ensure the safe handling and transportation of products.

Wollastonite is a naturally occuring, non-metallic, acicular (needle-shape) mineral.

Neoflon PFA AF-0050 is a white film renowned for its exceptional heat and chemical resistance, crafted through melt extrusion using neoflon PFA material. With a unique molecular structure integrating carbon and fluorine atoms with a perfluoroalkoxyl group, it ensures remarkable nonadhesion and nonflammability. This film excels in various fabricating processes, including sealing, thermoforming, welding, and heat bonding. Predominantly applied in electrical and electronics components, printed circuit boards, aerospace, and transportation sectors, it showcases attributes like high performance, low stretchability, and weldability, meeting stringent industry demands.