Products in Composite Materials

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

DIACARNA™ 30M is a copolymer of α-olefin and maleic anhydride. Applications include as a compounding additive for filler dispersant and adhesion promoter for PA/GF composites.

jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SymaLITE is a special class of lightweight composites that offer low thermal expansion and exceptional mechanical and physical properties. Made from mixed glass and polymer fiber fleeces, SymaLITE is available in rolls and boards, which can be further molded into three-dimensional components using low-pressure molding.Features:Low thermal expansionExcellent mechanical and physical propertiesUltra-light and freely shapeableNoise-absorbentDirect facing with functional or decorative cover layers without adhesivesBenefits:Cost-efficient production of three-dimensional componentsDurable and noise-insulating material for car undershields and engine coversImpact-resistant and non-weathering for outdoor applications in the automotive and construction industrySubstitute for wood-based materials and rigid foams in sandwich constructions for the caravan and commercial vehicle industry.Applications:Automotive and caravan industryConstruction sectorCar headlinersOutdoor applications in the automotive and caravan industrySubstitute for wood-based materials and rigid foams in sandwich constructions for the caravan and commercial vehicle industry.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

GMTex® is a high-performance thermoplastic composite material that has been developed for applications requiring exceptional impact resistance, strength, and durability. Made from a polypropylene or polyamide resin matrix reinforced with both woven and randomly laid fibers, these moldable panels are favored as lightweight, high-performance replacements for steel, aluminum, magnesium, and other industrial materials, or alternatively as additional reinforcement for GMT panels.Features:High impact resistanceExceptional strength and durabilityLightweightMulti-layer glass fiber weave technologyReinforced with both woven and randomly laid fibersBenefits:Can replace traditional industrial materials like steel, aluminum, and magnesiumCan be used as an additional reinforcement for GMT panelsIdeal for use in structural vehicle components, such as front ends and bumper bracketsCan withstand high pressure and velocity conditionsApplications:Structural vehicle components, such as front ends and bumper bracketsIndustrial and manufacturing applications that require high impact resistance, strength, and durabilityAdditional reinforcement for GMT panels in various applications

Mitsubishi Chemical Advanced Materials is considered the world market leader in the production of classic glass-mat-reinforced thermoplastics (GMT). This semi-finished product in panel form was developed primarily as a substitute for metals (steel, aluminum etc.) and its main purchasers can be found in the automotive industry. This is where it is frequently pressed on the industrial scale into complex 3D structural components, although it is also used as panels.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

CRA® eco 17 is an extremely efficient controlled release additive used for adjusting the release force of solvent-free DEHESIVE® systems. It is derived from renewable raw materials and complies with the "Standard REDcert²." CRA® eco 17 offers the highest release values among all CRA® modifiers.

VINNAPAS® UW 4 FS is a solid, thermoplastic homopolymer. The resin is clear, colorless, and tasteless, and it is produced by polymerizing vinyl acetate. Typical applications for VINNAPAS® UW 4 FS include fiber-reinforced plastics, adhesives, powder injection molding, and sound damping.

VINNAPAS® LL 8251 is a solid copolymer of vinyl acetate and crotonic acid, ranging in color from colorless to pale yellowish. It finds typical applications in fiber reinforced plastics and resin modification for composites. The product is available in the form of solid flakes.

VINNEX® 8802 is an innovative compound made from a vinyl acetate/vinyl laurate copolymer and polyvinyl acetate. This thermoplastic resin is colorless, tasteless, and odorless, and it can be easily melted in its dosable form. It is specifically recommended as a highly efficient low profile additive (LPA) that offers a significantly improved LPA effect in vinyl ester resins, even at lower curing temperatures compared to conventional LPA grades. Furthermore, VINNEX® 8802 demonstrates excellent compatibility with biopolyesters like PLA.

VINNAPAS® C 341 is a solid, colorless to pale yellowish copolymer of vinyl acetate and crotonic acid. Typical applications for VINNAPAS® C 341 include composites and resin modification for composites, such as fiber-reinforced plastics. VINNAPAS® C 341 is supplied in 25-kg paper bags.

GENIOPLAST® PP 20A08 is a pelletized formulation consisting of 20% functional silicone dispersed in polypropylene. It has been specifically developed as a compounding additive for unfilled and filled thermoplastic polyolefin compounds. This product is odorless. When used within the recommended levels (0.5 - 2%), GENIOPLAST® PP 20A08 does not have a negative impact on the thermo-mechanical properties of the compounds it is added to. Additionally, due to its specific effect, the processing temperature of the polyolefin compound can be slightly lowered.

NEXIPAL® is a versatile EAP (Electroactive Polymer) laminate designed for actuators and capacitive sensors. It is composed of one or multiple ultrathin silicone layers, known as ELASTOSIL® Film, which have a thickness ranging from 20 to 400 µm. These silicone layers are coated with specialized electrodes, laminated together, and then precisely cut into the desired shape. Multiple layers can be stacked on top of each other to achieve the desired performance.

CRA® 42 is an exceptionally efficient controlled-release additive specifically designed to adjust the release force in solvent-free DEHESIVE® systems. It offers remarkable performance in achieving high release levels. Furthermore, CRA® 42 provides an extremely stable release, ensuring consistent and reliable results. It also boasts fast-curing properties.

SILRES® MK Powder is a condensation-curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Additionally, SILRES® MK Powder is the ideal product for making tack-free prepregs with excellent storage stability. When fully cured, SILRES MK POWDER has the lowest carbon content among all WACKER silicone resins, resulting in a high ash content when pyrolized. Composites made of SILRES® MK Powder exhibit long-term stability against weathering, moisture, and UV light. They can be continuously exposed to changing climatic conditions, UV radiation, and temperatures exceeding 300 °C (572 °F). Furthermore, SILRES® MK Powder provides water repellency and excellent electrical insulation properties to the composite materials.

VINNAPAS® C 501 is a solid, colorless to pale yellowish copolymer of vinyl acetate and crotonic acid. Typical applications for VINNAPAS® C 501 include antishrinkage additives, composites, and resin modification for composites, such as fiber-reinforced plastics. VINNAPAS® C 501 is supplied in 25-kg paper bags.

SILRES® H60 A/B is a liquid, solvent-free, two-part phenyl silicone resin formulation. The product is a modification of the well-established SILRES® H62 C and is thus ideal for impregnating the electrical coils of motors. Besides, SILRES® H60 A/B can be used to provide hydrophobic properties to porous materials and as a binder for composites made of fibrous fillers, cloths, and woven or non-woven reinforcing materials. Fully cured SILRES® H60 A/B has excellent electrical insulation properties and outstanding long-term heat resistance. Additionally, it shows high stability against weathering, moisture, and UV light and can therefore be continuously exposed to constantly changing climatic conditions or UV radiation.

CRA® 21 is an exceptional controlled release additive specifically formulated for adjusting the release force in solvent-based DEHESIVE® systems. As a solvent-based additive, it delivers high release levels, making it highly efficient in its intended application. Additionally, CRA® 21 exhibits good release stability, ensuring consistent performance over time.

SILRES® H 44 is a powdered, condensation-curing phenyl silicone resin with excellent solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Due to its compatibility with organic resins, SILRES® H 44 can also be used to modify or partly replace phenolic resins in the respective compounds. Compared to other silicone resins, SILRES® H 44 cures relatively quickly at elevated temperatures. It is therefore particularly suitable for fully automated production lines.

SILRES® MK Flakes is a condensation-curing methyl silicone resin with good solubility in various organic solvents. The product can be used as a binder or as an impregnation agent for porous materials. Besides, SILRES® MK Flakes is the ideal product for making tack-free prepregs with excellent storage stability. Fully cured SILRES® MK Flakes has the lowest carbon content of all WACKER silicone resins and thus yields a very high ash content when pyrolized. Composites made of SILRES® MK Flakes show long-term stability against weathering, moisture, and UV light. They can therefore be continuously exposed to constantly changing climatic conditions, UV radiation, and temperatures significantly higher than 300 °C (572 °F). SILRES® MK Flakes also provides water repellency and excellent electrical insulation properties to the respective composite materials.

VINNAPAS® UW 2 FS is a solid, thermoplastic homopolymer. The resin is clear, colorless, and tasteless, and it is produced by polymerizing vinyl acetate. This versatile product finds typical applications in fiber-reinforced plastics, adhesives, powder injection molding, and sound damping.

VINNEX® 8803 is an innovative compound made from a vinyl acetate/vinyl laurate copolymer and polyvinyl acetate. It is a colorless, tasteless, and odorless thermoplastic resin that comes in a dosable form and can be easily melted. This product is specifically recommended as a highly efficient, low-profile additive for fiber-reinforced composites and polymer concrete-type applications. It also demonstrates excellent compatibility with biopolyesters such as PLA.

CRA® 23 is a highly efficient controlled-release additive designed to adjust the release force in solvent-based DEHESIVE® systems. As a solvent-based controlled release agent, it provides exceptional release levels. Moreover, CRA® 23 exhibits good release stability, ensuring consistent performance over time. It also boasts an excellent bathing life.

GENIOSIL® CS 2 is an unsaturated alkoxysilane. It is a clear, colorless liquid with a characteristic aromatic odor. In the presence of moisture, it hydrolyzes and liberates alcohol to form silanols that can react with themselves to form siloxanes. As it possesses both silyl and unsaturated organic groups, GENIOSIL® CS 2 acts as a molecular bridge between organic and inorganic substrates.

T-Mulz® Z 900 is a modified aliphatic amine and a clear to light yellow-colored, low-viscosity epoxy curing additive. The incorporation of T-Mulz® Z 900 into epoxy systems allows for less critical mix ratios and excellent solvent resistance. It can be used across a wide range of applications, including tooling compounds, laminates, automotive body patching compounds, and metal and plastic adhesives.

Akulon® K224-G6 is a polyamide 6 (PA 6) resin known for being lightweight and UL flame-rated. They find applications in various markets, including automotive and transportation, consumer goods, healthcare, and pharma, as well as industrial applications. This product is processed through injection molding.

Akulon® K223-KMV6 is a polyamide 6 (PA 6) resin that is halogen-free, flame retardant, heat stabilized, lightweight, and UL flame-rated, making this product suitable for various applications in automotive and transportation. It is also used in the electrical and electronics markets.

Akulon® N24-G3 is a high-performance material that combines the qualities of polyamide 6 and polyamide 66, making it a preferred choice for customers worldwide across a spectrum of industries, including automotive, electronics, electrical, furniture, and packaging. In molded parts, this material excels in providing an excellent balance between ease of design and processing while delivering exceptional mechanical properties across a wide temperature range and under various conditions.