Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Applications
- Application Area
- Compatible Substrates & Surfaces
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Melt Bonding Temperature | 80 - 100 | °C | — |
| Shear Bond Strength (at 25°C) | min. 1000 | psi | — |
| Shear Bond Strength (at 50°C) | min. 1000 | psi | — |
| Shear Bond Strength (at 75°C) | max. 30 | psi | — |
| Shear Bond Strength (at 100°C) | 0 | psi | — |
| Suggested Zero Shear Removal Temperature | 80 - 100 | °C | — |
| Cleaning Solvent (Process for Wafer) | Isopropyl alcohol | — | — |
| Cleaning Solvent (Process for Carrier) | Isopropyl alcohol | — | — |
Regulatory & Compliance
- Certifications & Compliance