Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Product Highlights
- Stress Free
- Solvent Free
- Thermally Conductive
- Reworkable
- Epoxy Paste Adhesive
Applications & Uses
- Applications
- Application Area
- Applications
- Termal Management
- Reworkablility
- Mismatched CTE's
- Curing During Solder Reflow of
- S.M. Devices
- Application Process
- Thaw at room temperature for at least 30 minutes before using.
- Dispense adhesive onto clean substrate.
- Cure according to one of the recommended schedules.
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Average Viscosity (0.5 rpm, 25°C) | 216000 - 324000 | cp | Brookfield DV-1, Spindle CP51 |
| Cured Density | 2.07 - 2.53 | gm/cc | - |
| Device Push-off Strength | 10.3 | N/mm² | - |
| Dielectric Strength | min. 750 | Volts/mil | - |
| Electrical Resistivity (150°C/60 min) | 1x10¹⁴ | ohm-cm | - |
| Glass Transition Temperature | -27.5 to -22.5 | °C | - |
| Lap-Shear Strength | min. 6.9 | N/mm² | - |
| Linear Thermal Expansion Coefficient | 102 - 138 | ppm/°C | - |
| Maximum Continuous Operation Temperature | max. 150 | °C | - |
| Thermal Conductivity | 1.53 - 1.87 | W/m-°C | - |
Technical Details & Test Data
- Cure Schedules
Temperature Time 100°C 60 min 125°C 30 min 150°C 5 min
Packaging & Availability
- Availability
ME7155-SC4 is available in syringes for automatic needle dispense applications or in jars.
Storage & Handling
- Shelf Life
- 1 year (-40°C)