Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Stress free.
- Reworkable.
- Electrically conductive.
- B-staged epoxy film adhesive.
- Substrate and component.
- Reworkability.
- Mismatched CTE's.
Applications & Uses
- Applications
- Application Procedures
- Let adhesive thaw in bag or plastic box for 30 min. Cut to desired size.
- Lift the corner ofa release liner on one side of the tack film.
- Peel the release liner over to 180° and pull quickly to remove the liner in one stroke.
- Attach to components, and then peel the 2nd release liner.
- Note
When this product is removed from the freezer, used and refrozen, the shelf life at -40°C and pot life 25°C is lowered depending on the amount of time out of the -40°C freezer.
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Electrical Resistivity (at 150°C, 60minutes) | max. 5x10⁻⁴ | Ω-cm | — |
| Glass Transition Temperature | 0 | °C | — |
| Lap Shear Strength | min. 6.1 | N/mm² | — |
| Device Push Off Strength | min. 16.6 | N/mm² | — |
| Hardness | 73.8 - 90.2 | Shore A | — |
| Cured Density | 3.15 - 3.85 | g/cc | — |
| Thermal Conductivity | min. 8.0 | W/m-°C | — |
| Thermal Conductivity | 6.4 | W/m-°C | — |
| Coefficeint of Linear Thermal Expansion | 93.5 - 126.5 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Electrical Resistivity | max. 4x10⁻⁴ | Ω-cm | — |
| Die Shear Strength | min. 1500 | psi | — |
Regulatory & Compliance
- Certifications & Compliance
- Quality Standards
Technical Details & Test Data
- Cure Schedules
Temperature Time Pressure 80°C 12 hrs 3-5 psi 100°C 6 hrs 3-5 psi 125°C 3 hrs 3-5 psi 150°C 2 hrs 3-5 psi Post-curing at 125°C for 24 hours is required to pass NASA outgassing testing. The die or component can be tacked on the substrate with 3-5 psi, at 80°C to 100°C. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle. Use 100°C, 1 hr prior to using the 125°C and 150°C cures. Pot life is 48 hrs at 25°C.
Packaging & Availability
- Product Availability
TC8750 is available in sheet sizes or as custom preforms. Standard thicknesses are 0.003" and 0.006". Special thicknesses are available.
Storage & Handling
- Shelf Life
- 12 Months (at -40°C)
- Storage Information
Storage temperature: 0- 5°C in sealed package.