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Creative Materials 125-22

B-STAGE PROCEDURE125-22 is a screen-printable, B-Stageable, electrically conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 125-22 is designed to exhibit minimal flow during bonding. This product provides superior electrical and thermal conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form.

Features

  • Minimal flow during cure
  • Low CTE
  • B-Stageable
  • Long Screen Life
  • Excellent Chemical Resistance
  • Excellent High Temperature Performance
  • B-stageable conductive adhesive with low flow & low CTE

Product Type: 1K (1 component) Adhesive, Conductive Adhesive, Epoxy Adhesive

Application Area: Electrical Components

Cure Method: Heat Cure

Compatible Substrates & Surfaces: Aluminum, Ceramic, Copper, Metal

Application Method: Injection, Screen Coating

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Application Area
Application Method
Compatible Substrates & Surfaces
Cure Method
Application Method
  • Screen-print
B-stage Procedure

Apply adhesive to substrate or release liner. Next apply heat to advance the curing to the non-tacky stage when cooled to room temperature. A temperature of 100°C to 120°C for 5 to 15 minutes is required, B-Stage time is mass related. User is encouraged to experiment for optimum drying time at a given temperature.

Bonding Procedure

To use, apply b-staged adhesive to one part, carefully align parts to be bonded, apply uniform pressure to maintain location. Cure for 15 minutes at 200°C, or 30 minutes at 175°C, or 1 hour at 160°C. For better adhesion of the bstaged film to the first part, it is suggested to warm the part to 40°C. Cure times given are mass related, timing should start after adhesive and substrates reach curing temperature.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Pot LifeLatent--
Conductivity0.001--
Uncured Properties
ValueUnitsTest Method / Conditions
Brookfield Viscosity - HAT Viscometer (at 10 rpm at 25°C)20,000 - 30,000cps-
Specific Gravity1.88g/cc-
Theoretical Coverage (at 0.001" Thickness)approx. 30in^2-
Screen Lifemin. 8hrs-
FillerSilver--
Volume Resistivitymax. 0.001Ω - cm-
Thermal Conductivity6.5W/mK-
Percent Silver (cured)60--
Typical Cured Properties
ValueUnitsTest Method / Conditions
Thermal StabilityGood to 325°C-
Useful Temperature Range55 to 230ºC-
Glass Transition Temperature (Tg)150ºC-
Coefficient of Thermal Expansion below Tg50 x 10^-6in/in/°C-
Coefficient of Thermal Expansion above Tg60 x 10^-6in/in/ºC-
Tensile Shear Strengthmin. 2000Psi-
Peel Strength (Copper to copper at 90°)9Pli-

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Curing Guidelines

These temperatures and times are presented as a guide only. The end-user is encouraged to experiment to determine optimum curing schedule.

Temperature (ºC) Time (min.)
160 60
175 30
200 15
Handling And Storage

Material is ready to use as received. Store frozen to maintain consistent flow properties. Allow material to warm up to room temperature before opening container. It is important to resuspend any settled filler before using. Be careful not entrap air while mixing. 125-22 can be thinned with small amounts of CMI# 113-12 (fast drying), or #102-03 (slow drying) thinners.

Storage Temperature Containers B-Staged Film
25°C 2 months 1 month
-10°C 6 months 3 months