Products

127-04 is a screen-printable, B-Stageable, one part epoxy coating and laminating adhesive. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings.Features B-Stageable laminating adhesive

125-31FPC is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-31FPC is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 125-31FPC is a finer particle version of 125-31C.Features Highly thermally conductive epoxy adhesive B-Stageable Low temperature curing

122-39(SD) is a syringe dispensable, thermally conductive, electrically insulating, one component, 100% solids epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach and thermal management operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-39(SD) is a thermally conductive version of 122- 38(SD).Features Ionically clean die attach adhesive

128-38 is a screen-printable, B-Stageable, one-part epoxy coating and laminating adhesive that maintains hermetic properties up to 170°C. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include lid attach adhesives, printed circuit board fabrication, advanced material composites, sealing, and high-performance coatings.Features Hermetic properties B-Stageable Long Screen Life High Tg Hermetic lid attach

127-03 is a screen-printable, B-Stageable, thermally conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 127-03 is designed to exhibit minimal flow during bonding. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment, and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and flexibility in the B-Staged form and is optimal for absorbing stress when bonding mismatched CTE substrates. 127-03 is a thermally conductive, electrically insulating version of 125-22.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Highly thermally conductive epoxy adhesive B-Stageable

126-08 is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing and high performance coatings.Features Extremely high thermally conductive epoxy adhesive

127-45 is a die attach adhesive engineered for high reliability performance and high efficiency production. This product is a syringe dispensable, anisotropic conductive, one component, 100% solids epoxy adhesive and features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesion to gold plated substrates and tin/lead solder terminated components, die attach operations, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 127-45 is an anisotropic conductive version of Electraset™ 620.Features Die attach adhesive

123-34 is a pad-printable, B-Stageable, one part epoxy coating and adhesive, suitable for application by pad printing, dipping and syringe dispensing. This system has been pre-catalyzed with CMI 119-44 to allow for low temperature cure. This product features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. 123-34 is a pre-catalyzed version of 122- 48.Features B-Stageable Epoxy Adhesive

125-35C is a syringe dispensable, 100 % solids, thermally conductive, electrically insulating, precatalyzed, epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 125-35C is flexible and is able to absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. This is an electrically insulating, thermally conductive version of 124-08C.Features Highly thermally conductive epoxy adhesive

127-31 is an extremely flexible one-component, syringe dispensable, 100% solids, thermally conductive, electrically insulating soft epoxy adhesive, encapsulant, and potting compound. This system features excellent thermal stability, chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 127-31 features a low durometer and is highly flexible allowing it to absorb stress when bonding mismatched CTE substrates. 127-31 even displays some elastomeric properties. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding.Features Elastomeric Flexible thermally conductive adhesive/potting compound

122-38(SD) is a single component, silver filled, syringe dispensable, 100% solid, electrically conductive, epoxy adhesive. 122-38(SD) provides for fine pitch resolution, when syringe dispensed, stencil printed, or screen-printed. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include adhesives, die attachment, printed circuit board fabrication, advanced material composites, sealing and high performance coatings. 122-38(SD) provides excellent adhesion to gold plated substrates, as well as tin/lead solder terminated components.Features Ionically clean die attach adhesive

128-21C is a jet or syringe dispensable, thermally conductive, electrically insulating, pre-catalyzed epoxy adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Unlike conventional thermally conductive epoxy adhesives, 128-21C is flexible and can absorb stress when bonding mismatched CTE substrates. Applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. 128-21C is a version of 125-31C optimized for jet dispensing.Features Low stress thermally highly thermally conductive epoxy adhesive

127-10 is a fast drying, silver filled ink, designed for producing electrically conductive traces on rigid and flexible circuit boards. This material provides excellent adhesion to aluminum, glass, Mylar, Kapton, and a variety of other substrates. Some additional applications for 127-10 include, but are not limited to, emi/rfi shielding, polymer thick film circuitry, membrane switches and circuit repair.Features Low temp curing, adheres to polycarbonate

124-07 is a screen-printable, B-Stageable, one part epoxy coating and laminating adhesive. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings.Features Screen-print

124-07-F is a B-staged, one part epoxy coating and laminating adhesive film. This system features excellent thermal stability, thermal cycle resistance and chemical resistance. Applications include adhesives, printed circuit board fabrication, advanced material composites, sealing, and high performance coatings. This product is available in thicknesses from 1 to 5 mils.

124-33-F is an electrically conductive, transferable, thermoplastic adhesive film. Some applications for the 125-33- F series include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembly of electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handleability. This product is available in thicknesses from 1 to 5 mils.

118-06-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. The 118-06-F Series was developed with wafer manufacturing in mind. Some other applications for 118-06-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the B-staged form. This product is available in thicknesses from 1 to 5 mils (see product codes below). 118-06-F is designed with the performance criteria of Mil-Std-883 5011.4 in mind and is expected to pass ASTM E-595 outgassing testing when fully and properly cured.Features Excellent Electrical Conductivity. Easy Liner Release. Excellent Chemical Resistance. Low Ionics.

125-22-F is a B-staged, electrically conductive, transferable, epoxy adhesive film. Some applications for 125-22-F include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of SMD devices, as well as the assembling electrical and electronic components. This system features excellent thermal stability and high temperature properties. This product has been formulated to have improved handling in the Bstaged form. This product is available in thicknesses from 1 to 5 milsFeatures Excellent Electrical Conductivity Easy Liner Release Excellent Chemical Resistance Minimal Flow During Cure Low CTE Excellent High Temperature Performance

118-06(SP) is a screen-printable, B-Stage able, electrically conductive, one part epoxy coating and adhesive. 118- 06(SP) can also be applied by dipping and syringe dispensing. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include, but are not limited to assembling electrical and electronic components.Features Excellent Electrical Conductivity Outstanding Printability B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Low Ionics B-stageable conductive adhesive.

127-03-F is a B-staged, thermally conductive, transferable, epoxy adhesive film. Some applications for 127-03-F include, but are not limited to, die attachment, printed circuit board fabrication, advanced material composites, LED attachment and heat sink bonding. The chemistry in 127-03 features excellent thermal stability and high temperature properties and is able to absorb stress when bonding mismatched CTE substrates. This product has been formulated to have improved handling in the B-staged form and is available in thicknesses from 1 to 5 milsFeatures Excellent Thermal Conductivity. Easy Liner Release. Excellent Chemical Resistance. Minimal Flow During Cure. Low CTE. Excellent High Temperature Performance.

105-48 is a flexible, semi-conductive, silicone, pressure sensitive adhesive. The overall balance of peel strength, cohesion, lap shear strength and high temperature holding power provides a versatility that makes this product useful in a wide range of fastening and bonding applications. This product is very resistant to flexing and creasing. Some applications for 105-48 include, but are not limited to, electrostatic discharge, polymer thick film circuitry and membrane switches.Features Semi-conductive pressure-sensitive adhesive

125-01A/B-187 is a two-component syringe dispensable, anisotropically conductive, epoxy coating and adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications for 125-01A/B-187 include, but are not limited to, conductive splicing of ribbon cables, electrical attachment of surface mounted devices and bonding of flex circuits to PC boards and electroluminescent panels. This product is useful in application where shorts between closely spaced contacts are a concern. This system features excellent thermal stability.Features Snap cure die attach adhesive

122-07SP is a screen-printable, B-Stageable, highly thermally conductive, one part epoxy coating and adhesive. This system features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Applications include die attach adhesives, printed circuit board fabrication, advanced material composites, sealing and high performance coatings.Features Excellent Thermal Conductivity] Outstanding Printability B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance Low Ionics Highly thermally conductive epoxy adhesive, B-Stageable

126-22-F is an anisotropic conductive, solvent-resistant, transferable adhesive film. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern. This product is available in thicknesses from 1 to 5 mils

B-STAGE PROCEDURE125-22 is a screen-printable, B-Stageable, electrically conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 125-22 is designed to exhibit minimal flow during bonding. This product provides superior electrical and thermal conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance B-stageable conductive adhesive with low flow & low CTE