Products

SC-454M-6 is a thermally conductive, low viscosity, condensation cure, RTV silicone potting or encapsulating compound. It is readily pourable and can cure at room temperature. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

SC-550-LV-TC-2 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-2 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.

SC-550-LV-RT is a 100% silicone solid elastomer designed for electronic potting applications. This two-component, room temperature curing system offers a hard, self-bonding, thermally conductive, low modulus material that is readily re-workable.

SC-417 is a two-part, low viscosity, clear silicone which will cure at room temperature or at elevated temperatures. The cured elastomer is suited for electrical/electronic potting and encapsulating applications and provides environmental protection. It is readily pourable and can cure from room temperature to 200°C. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.

FLASHBOND™ UV-3700F is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-3700F cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass. This filled system is excellent for when low viscosity systems are not ideal. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400- 415nm).

EPOXIBOND™ EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.

FLASHBOND™ UV-5402 is a low viscosity, flexible, light curing epoxy adhesive that offers excellent strenth and flexibility for reduced cracking. UV-5402 is low viscosity and high elongation. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400-415nm) and can also cure down to 365nm.

SetWORX™ 1510 is a fast setting, toughened epoxy adhesive designed for industrial grade applications. This epoxy system has 1:1 mixing ratio by volume & cure fast at room temperature. When cured it is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. The cured adhesive exhibits high impact resistance and exceptional bond strength. It can be used for bonding glass, metals, woods and some plastics.

SETWORX™ 60 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties.

FLASHBOND™ UV-8504E is a low viscosity, fast curing, light-curing epoxy adhesive that offers excellent strength wetting properties. UV-8504E cures to a high Tg, rigid polymer with excellent adhesive to metals, ceramics, and glass.This product requires direct light exposure during cure. UV-8504E can cure fully in 30 seconds using optimal cure conditions. Due to the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cures best in the UVA wavelengths (315-365nm). FLASHBOND™ UV-8504E has been tested to and passes ISO-10993-5 standards for cytotoxicity.

FLASHBOND™ UV-8300LV is a low viscosity, light curing epoxy adhesive that bonds well to a wide variety of substrates including metals, glass, ceramics and some plastics. This product exhibits good surface wetting and adhesion to glass and many plastics. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (405nm) as well as down to 365nm. Flashbond UV-8300LV has been tested to and passes ISO-10993-5 for cytotoxicity.

EC-1106 is an electronic grade Optically Clear Epoxy, Encapsulating and Potting Compound. This heat curing system has very low viscosity and long work life.

FLASHBOND™ UV-5608DC is an innovative light cure epoxy adhesive. It has unique features that allow for fast processing and fixturing of parts. Once the adhesive has been activated with UV light, it has set open time that allows for assembly of parts. The product continues to cure at room temperature or rapidly cures when exposed to low temperature heat. The cured product exhibits low shrinkage and excellent thermal, water and chemical resistance. Typical applications include bonding of optics, connectors, fibers, lenses, prisms and other electronic components where low shrinkage and low outgassing are required.

EPOXIBOND™ EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding. It is used highly in the medical, optical, and semiconductor industries.EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO. It is an excellent choice for semiconductor applications including capillary under fill or flipchip die attach.

SetWORX 90 is a toughened, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications. SetWORX 90 is BPA-Free and non-hazardous for shipping.

EPOXIBOND™ EB-109M-11 is a flexible, two components, low viscosity, clear epoxy adhesive for optical, medical, and semiconductor applications. This long working life adhesive can be cured at room temperature or with moderate heat and provides excellent adhesion to glass, quartz, metals, wood and most plastics.

SetWORX™ 05 is a fast cure, high strength, structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. The high performance epoxy provides excellent bond strengths to a wide variety of plastics and metals.

UV-8509R is a non-sag, fast curing, urethane acrylate that bonds well to engineered plastics and metal based substrates. This product requires direct UV exposure during cure. Because of the variability of different UV light sources it is suggested that the user test and specify UV intensity and exposure time. This material is specially formulated to have reduced surface tack due to oxygen inhibition.

EPOXIBOND™ EB-116 is high strength, structural epoxy adhesive. This tough adhesive has an excellent combination of shear and peel strength. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties and is excellent for cryogenic applications. It is recommended for bonding glass, metal, ceramics, and engineering thermoplastics. Due to its low viscosity, it can be also used for potting and encapsulating electrical/electronic coponents

SetWORX™ 411HP is a toughened, high strength, industrial grade structural epoxy adhesive. This adhesive has an excellent combination of shear and peel strength. 411HP is a one component, heat cure, conductive epoxy adhesive. It has also excellent impact and vibration resistance and low temperature flexibility. This high-performance epoxy adhesive exhibits very good physical, thermal, and electrical insulation properties. It is recommended for bonding engineering thermoplastics, SMC (sheet molding compounds) in aerospace and automotive applications.

EB-155 is an undiluted, unfilled, low viscosity clear epoxy system that exhibits exceptional resistance to impact and thermal shock. This system has low exotherm and long work life. Applications includes, high bond strength adhesive for most similar and dissimilar substrates; LED displays, any fiber optic application. It can also be used for making in-place laminates or for protective coating on metals etc. Also it can be used for semi-rigid, moisture proof, gas tight seals between plastic and metallic or other substrates. This is also recommended for potting devices such as connector shells from which rigid or flexible wires may protrude directly through the epoxy.