- Product Type:Potting Compound, Encapsulant
- Application Area:Integrated Circuits, Power Transformers, Oscillators, Amplifiers, Semiconductors
- Chemical Family:Epoxy & Epoxy Derivatives
EC-1850FT is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components.