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HexPly® M77 is a fast curing hotmelt, thermosetting epoxy resin matrix, specifically designed for prepreg applications at which short cure cycles are required. M77 is recommended for curing at 120 – 150°C and is suitable for a range of pressures (5 – 35bar). M77 can be used for manufacture of large industrial components, suitable for cure of thin and thick sections.

Polymer Name: Epoxy Resins & Compounds

Functions: Prepreg

Technical Data Sheet

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Identification & Functionality

Composite Materials Functions

Features & Benefits

Materials Features

Applications & Uses

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Typical cured Tg :+/-5°C130
Optimum cured Tg: +/-5°C130
Density1.15 – 1.25g/cm3ISO 1183-1
Tack:Moderate

Technical Details & Test Data

Curing Conditions
  • Recommended heat-up rate: 0.5 – 5°C/min
  • Recommended cure cycle: 15min @130°C
  • Pressure gage: 5 – 35bar

Storage & Handling

Shelf Life
  • at +23°C 6 weeks
  • at +5°C 6 months
  • at -18°C 18 months