Products

Leepoxy Plastics 17015 is a proprietary Freon-resistant epoxy specifically developed for patching magnet wire coatings in refrigeration motors whose wires are scraped, nicked, or chipped, thus exposing the copper substrate. It is thixotropic enough not to drip or slump off the wire. After a room temperature set and either an immediate or subsequent post heat cure, LEEPOXY 8-46 forms a highly-cross-linked plastic with excellent adhesion, mechanical and electrical properties. Resistance to Freon is excellent, but only with sufficient post cure. Post cure can occur during dehydration, varnish cure, or other processes any time prior to exposure to Freon.

LEECAST 15-95-3 is a two-part epoxy casting compound designed for encapsulation of high voltage components. Used in UL-listed applications requiring excellent electrical performance, heat dissipation,and flame retardance, it provides a system that is non-burning and highly resistant to thermal cycling with minimal effect on components.

LEECAST 30-125 is a two-component urethane that is mixed and poured at room temperature. LEECAST 30-125 develops full hardness after 24 hours at room temperature to provide an impact, UV and temperature resistant system.

LEECAST 23-130-5 is a unique urethane system that contains neither MOCA nor TDI. LEECAST 23-130-5 is designed to provide excellent dielectric properties over a wide temperature range. It has good low temperature flexibility and is ideally suited for protecting pressure sensitive glass diodes and other fragile electrical circuitry in UL-listed products. Its low viscosity and long pot life make it attractive for penetrating complex modules and for the aggregate casting method of encapsulation and potting. LEECAST 23-130-5 also features excellent reversion resistance and hydrolytic stability.

LEECAST 38-191 is a proprietary two-part epoxy adhesive and encapsulating compound. It has been used extensively for potting lead wires in UL-listed commercial gasoline pumps. LEECAST 38-191 has exceptional chemical resistance, especially in respect to gasoline, various gasoline alcohol additives, and other aggressive organic solvents. It also features fast room temperature cure and excellent adhesion to a variety of wire coatings and other substrates. It is formulated with enough thixotropy to inhibit sag on vertical surfaces and self-leveling when applied in a bead on horizontal surfaces.

LEEBOND 15-93-1 is a two-part, room temperature curing epoxy adhesive designed for bonding oily steel to various substrates.

LEEBOND 37-75 is a proprietary two-part epoxy adhesive used in both electrical-grade potting and structural adhesive applications. Cured systems demonstrate excellent toughness, impact resistance and exceptional bond strength for hard to bond to substrates. This system can be cured at both room temperature or accelerated with modest heating.

LEECAST 20-73 is a two-part, reversion resistant, electrical grade room temperature curing potting compound. It is a unique urethane system that contains neither MOCA nor TDI. LEECAST 20-73 is designed to provide excellent dielectric properties over a wide temperature range. It has good low temperature flexibility and is ideally suited for protecting pressure sensitive glass diodes and other electronic devices. Its low viscosity and long pot life make it attractive for penetrating complex modules and for the aggregate casting method of encapsulation and potting. LEECAST 20-73 also features excellent reversion resistance or hydrolytic stability.

LEECAST 37-90 is a proprietary anhydride cured epoxy system. LEECAST 37-90 is light in color and may be used with features a convenient 1:1 by volume mix ratio. Electrical properties are excellent. Mechanical and thermal properties are also very good - comparable with resins cured with amine hardeners.

LEECAST 29-192-1 is a two-part epoxy compound designed for potting electrical and electronic components. The advantages of LEECAST 29-192-1 include, good thermal shock resistance, good electrical properties, non-abrasive filler, and room temperature cure.

Leecast 16-46 A is a two-part epoxy compound designed for the encapsulation of electrical and electronic components. The advantages of LEECAST 16-46 include flame retardancy, good thermal shock resistance, good electrical properties, non-abrasive filler, easy 1 to 1 mix ratio and room temperature cure.