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MG Chemicals 8329TCF - Fast Cure Thermal Adhesive, High TC

8329TCF is a thermally conductive, fast-cure two-part epoxy adhesive. It is off-white, smooth, viscous, thixotropic, and bonds well to a wide variety of substrates. It is also flame retardant and meets the UL 94V-0 standard. For a 1 mL quantity, a minimal service cure can be achieved in 15 minutes at room temperature, and a full cure in 4 hours. This product is used to bond heat sinks, LEDs and other heat-generating components in electronic assemblies. It is suitable for use with dual-syringes, mix-tips and automatic dispensing systems. 8329TCF has been designed for maximum thermal conductivity with a high viscosity. For a lower viscosity, use 8329TFF. For a longer working life, use 8329TCM or 8329TCS.

Product Type: 2K (2 component) Adhesive, Conductive Adhesive

Application Area: Automotive Lighting, Battery Packs, Electrical Components, Heat Sink, Heat Spreader, LEDs, Power Transformers, Semiconductors

Cure Method: Air Dry, Heat Cure

Compatible Substrates & Surfaces: Aluminum, Elastomers & Rubbers, Fiberglass, Fibers & Fabrics, Glass, Metal, Paper, Steel, Wood

Chemical Family: Epoxy & Epoxy Derivatives

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Identification & Functionality

Features & Benefits

Key Attributes
  • Thermal conductivity of 1.0 W/(m·K)
  • 1:1 mix ratio
  • Working life: 4 minutes
  • Set time: 15 minutes
  • Cure time: 4 hours at room temperature or 10 minutes at 65 °C (149 °F)
  • Flame retardant—meets UL 94V-0 standard
  • Provides strong electrical insulation
  • Low CTE prior Tg
  • High tensile and compressive strength
  • Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons
  • RoHS 3 compliant

Applications & Uses

Application Instructions

For best results, follow the procedure below. For quantities less than 1 mL or for stricter stoichiometry control, mix by weight with a high-precision balance. Heat cure to achieve optimal conductivity.

Syringe or Cartridge

To insert the cartridge in the gun, see the Application Guide section for dispensing accessories.

  • Twist and remove the cap from the cartridge or syringe. Do not discard cap.
  • Dispense a small amount to ensure even flow of both parts.
  • (Optional) Attach a static mixer.
    • a. Dispense and discard 3 to 5 mL of the product to ensure a homogeneous mixture.
    • b. After use, dispose of static mixer.
  • Without a static mixer, dispense material on a mixing surface or container, and thoroughly mix parts A and B together.
  • To stop the flow, pull back on the plunger.
  • Clean nozzle to prevent contamination and material buildup.
  • Replace the cap on the cartridge or syringe.

Dispensing Accessories

Consult the table below for appropriate accessory selection. See the Application Guide for instructions on using the dispensing accessories

Cat. No. Dispensing Gun Static Mixer
8329TCF-50ML 8DG-50-1-1 N/A

Compatibility

Adhesion - 8329TCF epoxy adheres to most plastics and metals used to house printed circuit assemblies; however, it is not compatible with contaminants like water, oil, or greasy flux residues, which may affect adhesion. In case of contamination, first, clean the surface to be coated with MG Chemicals 824 Isopropyl Alcohol. For substrate substances with weak adhesion strengths, surface preparation such as sanding or pre-coating with a suitable primer may improve adhesion.

Chemical resistance - Once cured, the epoxy adhesive is inert under normal conditions. It will resist water and salt exposure. It is expected to resist short term exposures to fuels or similar non-polar organic solvents, but it is not suitable for prolonged exposures. Avoid use with strong acids, strong bases, or strong oxidizers.

Substrate Adhesion (In Decreasing Order)
MG Chemicals 8329TCF - Fast Cure Thermal Adhesive, High TC - Compatibility

Properties

Physical Form
Physical Properties
ValueUnitsTest Method / Conditions
ColorOff white
Density (at 25 °C, 77 °F)1.75g/mLASTM D 1475
Young’s Modulus1700 (250000)N/mm2 ( lb/in2)ASTM D 638
Lap Shear Strength (Stainless Steel)5.0 (700)N/mm2 (lb/in2)ASTM D 1002
Lap Shear Strength (Aluminum)8.6 (1 200)N/mm2 (lb/in2)ASTM D 1002
Lap Shear Strength (Copper)13 (1900)N/mm2 (lb/in2)ASTM D 1002
Lap Shear Strength (Brass)14 (2 100)N/mm2 (lb/in2)ASTM D 1002
Lap Shear Strength (Polycarbonate)1.5 (220)N/mm2 (lb/in2)ASTM D 1002
Lap Shear Strength (ABS)2.0 (300)N/mm2 (lb/in2)ASTM D 1002
FlammabilityMeets 94 V-0UL 94
ViscosityThixotropic
Density1.73g/mL
Thermal Properties
ValueUnitsTest Method / Conditions
Thermal Conductivity (at 25 °C, 77 °F)1W/(m·K)ASTM E 1461 92
Thermal Conductivity (at 50 °C, 222 °F)1W/(m·K)ASTM E 1461 92
Thermal Conductivity (at 100 °C, 212 °F)0.9W/(m·K)ASTM E 1461 92
Thermal Diffusivity (at 25 °C, 77 °F)0.4mm2/sASTM E 1461 92
Specific heat capacity @25 °C [77 °F]1.3J/(g·K)ASTM E 1461 92
Typical Properties
ValueUnitsTest Method / Conditions
Mix Ratio1:1Volume
Mix Ratio1:0.9Weight
Electrical Properties
ValueUnitsTest Method / Conditions
Breakdown Voltage (at 2.1 mm)35300 (35.3)V (kV)ASTM D 149
Dielectric Strength (at 2.1 mm)412 (16.2)kv/mm (v/mil)ASTM D 149
Breakdown Voltage (at 3.175 mm, 1/8")42700 (42.7)V (kV)Reference fit
Dielectric strength (at 3.175 mm, 1/8")342 (13.1)kv/mm (v/mil)Reference fit
Volume Resistivity3 x 10¹²Ω·cmASTM D 257
Volume Conductivity3.3 x 10⁻¹³S/cmASTM D 257
Cured Properties
ValueUnitsTest Method / Conditions
Hardness Shore D82Shore D Durometer
Tensile Strength13 (1900)N/mm2 (lb/in2)ASTM D 638
Compressive Strength48 (7000)N/mm2ASTM D 695
Glass Transition Temperature (Tg)23 (73)°C (°F)ASTM E 3418
CTE Prior Tg23 (73)ppm/˚C (ppm/°F)ASTM E 831
CTE After Tg107 (225)ppm/˚C (ppm/°F)ASTM E 831
Uncured Properties
ValueUnitsTest Method / Conditions
Solids Content100%
Note

Physical Properties

  • Note : Specifications are for epoxy samples cured at 22 °C for 24 h and conditioned at ambient temperature and humidity.
  • a) N/mm2 = mPa; lb/in2 = psi

Electrical Properties and Thermal Properties

  • Note : Specifications are for epoxy samples cured at 22 °C for 24 h and conditioned at ambient temperature and humidity.
  • a) To allow comparison between products, the dielectric strength was recalculated with the Tautscher equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
  • b) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10-6 = unit/unit/°C × 10-6

Uncured Properties :Mixture (A:B)

Reference fit
  • a) To allow comparison between products, the dielectric strength was recalculated with the Tautscher equation fitted to 5 experimental values and extrapolated to a standard thickness of 1/8” (3.175 mm).
  • b) Coefficient of Thermal Expansion (CTE) units are in ppm/°C = in/in/°C × 10-6 = unit/unit/°C × 10-6
Physical Properties
Physical Properties Part A Part B
Color White Slight yellow
Viscosity (25 °C [77 °F]) 9500000 cP [9500 Pa·s] a) 800000 cP [800 Pa·s] b)
Density 1.88 g/mL 1.59 g/mL
Odor Mild Mercaptan
  • a) Brookfield viscometer at 1 rpm with spindle RV F96
  • b) Brookfield viscometer at 1 rpm with spindle RV C93

Regulatory & Compliance

Chemical Inventories

Technical Details & Test Data

Usage Parameters
Properties Value
Working life (22 °C [72 °F]) 4 min
Shelf life (22 °C [72 °F]) ≥3 y
Set time (22 °C [72 °F]) 15 min
Full cure (22 °C [72 °F]) 4 h
Full cure (65 °C [149 °F]) 10 min
Full cure (80 °C [176 °F]) 5 min

Packaging & Availability

Packaging Type
Packaging and Supporting Products
Cat. No. Packaging Net Volume Net Weight

Packaging Weight

8329TCF-50ML Dual cartridge 78 g [1.52 fl oz] 45 mL [1.52 fl oz]

111 g [0.25 lb]

Storage & Handling

Temperature Ranges
Properties Value
Constant service temperature -40 to 150 °C [-40 to 302 °F]
Maximum Intermittent temperature a) 175 °C [347 °F]
Storage temperature 22 to 27 °C [72 to 81 °F]
  • a) Temperature that can be withstood for short periods without sustaining damage.