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MG Chemicals 8329TCM - Thermal Adhesive, High TC

8329TCM is a 2-part thermally conductive epoxy adhesive. It is a dark gray, smooth, thixotropic paste that cures to form a hard, durable polymer that is thermally conductive, yet electrically insulating. This adhesive is most often used as heatsink glue, attaching heatsinks to CPUs, LEDs, or other heat generating electronics components. This compound has been formulated for high thermal conductivity. It is highly viscous and must be mixed by hand prior to application. For a lower viscosity use 8349TFM. For a shorter working time, use 8349TFM. For a longer working time, use 8329TCS.

Product Type: 2K (2 component) Adhesive, Conductive Adhesive

Application Area: Automotive Lighting, Battery Packs, Electrical Components, Heat Sink, Heat Spreader, LEDs, Power Transformers, Semiconductors

Cure Method: Air Dry, Heat Cure

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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Key Attributes
  • High thermal conductivity
  • 1:1 mix ratio
  • Provides strong electrical insulation
  • Bonds well to a wide variety of substances
  • Strong resistance to humidity, salt water, mild bases, and aliphatic hydrocarbons

Applications & Uses

Recommended Preparation

Clean the substrate with Isopropyl Alcohol, MG #824, so the surface is free of oils, dust, and other residues.

Syringe

  1. Stir each part individually to re-incorporate material that may have separated during storage.
  2. Measure 0.93 part by weight of A.
  3. Measure 1 part by weight of B.
  4. Thoroughly mix parts A and B together.
  5. Apply adhesive to the application area.

Can or Jar

  1. Stir each part individually to re-incorporate material that may have separated during storage.
  2. Measure 0.93 part by weight of A.
  3. Measure 1 part by weight of B.
  4. Thoroughly mix parts A and B together.
  5. Apply adhesive to the application area.

Properties

Physical Form
Thermal Properties
ValueUnitsTest Method / Conditions
Thermal Conductivity (at 25 ˚C)1.4W/(m·K)
Typical Properties
ValueUnitsTest Method / Conditions
Viscosity (at 25 ˚C)ᴬ780Pa·s
Viscosity (at 25 ˚C)ᴮ810Pa·s
Cured Properties
ValueUnitsTest Method / Conditions
Resistivity9 x 10¹²Ω·cm
Hardness Shore D77
Tensile Strength10N/mm2
Compressive Strength34N/mm2
Lap Shear (Stainless steel)6.4N/mm2
Lap Shear (Aluminum)6.1N/mm2
Glass Transition Temperature (Tg)46˚C
CTE Prior Tg71ppm/˚C
CTE After Tg131ppm/˚C
Service Temperature Range-40 to 150˚C
Uncured Properties
ValueUnitsTest Method / Conditions
Mixed Density2.41g/mL

Regulatory & Compliance

Chemical Inventories

Technical Details & Test Data

Cure Instructions

Allow to cure at room temperature for 24 hours, or cure the adhesive in an oven at one of these time/temperature options :

Temperature 65 °C 80 °C 100 °C
Time 1 hour 45 minutes 20 minutes

Usage Parameters
Working Time 45 min
Service Cure 5 h @ 22 ˚C
Mix Ratio by Volume 1:1
Mix Ratio by Weight 0.93:1

Packaging & Availability

Available Packaging
Cat. No. Packaging Net Volume Net Weight
8329TCM-6ML 2 Syringe Kit 6 mL 14.8 g
8329TCM-50ML 2 Jar Kit 50 mL 121 g
8329TCM-200ML 2 Can Kit 200 mL 494 g

Storage & Handling

Shelf Life
3 Years
Temperature Ranges

Store between 16 and 27 ˚C in a dry area, away from sunlight (see SDS). To maximize shelf life, recap product firmly when not in use.