Products

DEHESIVE® 929 is a solvent-free, addition-curing silicone fluid designed for release applications. This product has good curing properties, very good flow properties and coverage, an extremely stable release, excellent bath life, and excellent long-term anchorage to a wide variety of substrates.

VINNAPAS® 920 is a carboxylated, poly(vinyl alcohol) stabilized, vinyl acetate-ethylene (VAE) copolymer dispersion with a glass transition temperature (Tg) of -20 °C. It offers excellent flow, wetting, and adhesion to a wide variety of polymeric films, coatings, and other difficult substrates.

DEHESIVE® 902 AMA® is a solvent-free, addition-curing silicone fluid formulated for release applications on paper and filmic substrates. It is an integral component of a multicomponent release coating used in the production of paper and filmic release liners. These liners are widely utilized in the manufacturing of single- and double-sided industrial laminates.

DEHESIVE® PSA 850 R is a solvent-based silicone pressure-sensitive adhesive intended for coating films but also other substrates. It can be used for coating several film  substrates, such as polyester, polyamide, polyimide, and others, for the manufacture of different silicone pressure-sensitive adhesive tapes and other articles.

SILRES® 64558 VP is a toluene-based, ready-to-use formulation based on polysiloxanes and silicone resins. The product is preferably used as a binder in highly flexible composite tapes or as an intermediate to manufacture silicone pressure-sensitive adhesive (PSA) formulations. In composite tapes, SILRES® 64558 VP contributes to the tapes' excellent electrical insulation properties and outstanding long-term heat resistance. Besides, composite tapes made with SILRES® 64558 VP are highly stable against environmental impacts such as moisture, pollutants, and UV light, allowing them to be exposed continuously to constantly changing climatic conditions or UV radiation.

CRA® 17 is a highly efficient controlled-release additive designed specifically for adjusting the release force of solvent-free DEHESIVE® systems. It offers exceptional performance in achieving the highest release values among all CRA® modifiers. Its key features include high efficiency, rapid curing, and stable release characteristics.

DEHESIVE® SF 201 AMA® is a solvent-free, addition-curing silicone fluid. It is designed for release applications and is applied with additional components on paper and filmic substrates. The fast cure properties of DEHESIVE® SF 201 AMA® allow for use with temperature-sensitive substrates or comparatively low platinum levels at standard conditions.

CRA® EM 460 is a highly efficient controlled-release additive specifically developed for adjusting the release force of silicone emulsion-based DEHESIVE® systems. It is used in conjunction with coating polymers like DEHESIVE® EM 427 or DEHESIVE® EM 428 to create release coatings. The resulting system is designed for pressure-sensitive adhesive release applications and is compatible with papers of different porosities and films. The cure is achieved through a vinyl addition chemistry mechanism.

WACKER® Crosslinker V 90 is a solvent-free hydrogenpolysiloxane containing reactive Si-H groups. It is known for its fast curing properties, good release stability, and excellent anchorage to a wide variety of substrates. The fast-curing properties of WACKER® Crosslinker V 90 also enable the use of a low platinum concentration.

SILRES® REN 50 is a medium-hard methyl phenyl silicone resin available as a 50 wt.% solution in xylene-butanol (9:1). It is primarily employed as a binder for heat-resistant, anticorrosive coatings. Additionally, SILRES® REN 50 finds extensive use as a binder in various coating applications. It offers exceptional heat resistance and weatherability, ensuring optimal performance in demanding environments. Furthermore, it exhibits fast drying characteristics, forming a tack-free film at ambient temperature.

DEHESIVE® 944 is a solvent-based, addition-crosslinkable silicone recommended for use as a release coating. It offers excellent release stability, medium release at low peel speeds, excellent bath life, and excellent anchorage to a wide variety of substrates. It can be used for coating polyester films (PET), papers, and PE-laminated papers.

WACKER® Crosslinker V 58 is a hydrogenpolysiloxane that contains reactive Si-H groups. It offers excellent cure properties, allowing for low platinum concentration and low temperature cure. This crosslinker provides good release stability, ensuring consistent performance over time. It also demonstrates good anchorage, which may vary depending on the substrates used.

VINNAPAS® eco EAF 67 is an aqueous polymer dispersion, free of plasticizers, produced from vinyl acetate, ethylene, and acrylate monomers. This dispersion serves as a pressure-sensitive adhesive, exhibiting excellent cohesion and adhesion properties that remain effective even at elevated temperatures. The production of VINNAPAS® eco EAF 67 utilizes APEO-free surface active agents.

VINNAPAS® EAF 68 is a plasticizer-free, aqueous polymer dispersion produced from the monomers vinyl acetate, ethylene, and acrylate. VINNAPAS® EAF 68 is especially suitable as a raw material to manufacture floor covering adhesives, especially for carpets and PVC floor coverings. VINNAPAS® EAF 68 can also be used for the production of pressure-sensitive adhesives, such as self-adhesive tapes, films, labels, sound insulation mats, and heat insulation mats. VINNAPAS® EAF 68 may additionally be used as an adhesion promoter in adhesive formulations.

DEHESIVE® PSA 845 T is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for tight adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 90-200 °C.

VINNAPAS® EAF 67 is a plasticizer-free, aqueous polymer dispersion produced from the monomers vinyl acetate, ethylene, and acrylate. VINNAPAS® EAF 67 is especially suitable as a raw material to manufacture floor covering adhesives, especially for carpets and PVC floor coverings. VINNAPAS® EAF 67 can also be used for the production of pressure-sensitive adhesives, such as self-adhesive tapes, films, labels, sound insulation mats, and heat insulation mats. VINNAPAS® EAF 67 may additionally be used as an adhesion promoter in adhesive formulations.

DEHESIVE® PSA 847 M is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for tight adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 90-200 °C.

DEHESIVE® PSA 765 KR is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for low adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 100-200 °C.

CRA® 21 is an exceptional controlled release additive specifically formulated for adjusting the release force in solvent-based DEHESIVE® systems. As a solvent-based additive, it delivers high release levels, making it highly efficient in its intended application. Additionally, CRA® 21 exhibits good release stability, ensuring consistent performance over time.

VINNOL® E 22/48 A is a copolymer composed of approximately 75 wt.% vinyl chloride (VC) and 25 wt.% carbon acid esters with hydroxyl functionality. It serves as a binder for surface coating compounds and printing inks. As a thermoplastic and physically drying binder, VINNOL® E 22/48 A undergoes film formation as the solvent within the formulation evaporates.

DEHESIVE® PSA 846 L is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for low adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 90-200 °C.

DEHESIVE® PSA 820 L is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for low adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 100-200 °C.

CRA® eco 17 is an extremely efficient controlled release additive used for adjusting the release force of solvent-free DEHESIVE® systems. It is derived from renewable raw materials and complies with the "Standard REDcert²." CRA® eco 17 offers the highest release values among all CRA® modifiers.

CRA® 42 is an exceptionally efficient controlled-release additive specifically designed to adjust the release force in solvent-free DEHESIVE® systems. It offers remarkable performance in achieving high release levels. Furthermore, CRA® 42 provides an extremely stable release, ensuring consistent and reliable results. It also boasts fast-curing properties.

DEHESIVE® PSA 815 UT is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for ultra-tight adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 90-200 °C.

DEHESIVE® PSA 630 T is a solvent-based silicone pressure-sensitive adhesive intended particularly for coating films but also other substrates. It can be used for coating several film substrates, such as polyester, polyamide, polyimide, and other substrates, for the manufacture of different silicone pressure-sensitive adhesive tapes and other articles.

CRA® 23 is a highly efficient controlled-release additive designed to adjust the release force in solvent-based DEHESIVE® systems. As a solvent-based controlled release agent, it provides exceptional release levels. Moreover, CRA® 23 exhibits good release stability, ensuring consistent performance over time. It also boasts an excellent bathing life.

DEHESIVE® PSA 11 AP is a solvent-free, reactive silane mixture. Applied with addition-crosslinking DEHESIVE® or DEHESIVE® PSA-systems, it increases the adhesion to the substrate. The rub-off resistance of the cured silicone coating is improved significantly. It provides improved anchorage to unprimed PET film.

DEHESIVE® SFX 251 AMA® is a solvent-free, addition-curing silicone fluid. It is designed for release applications and is applied with additional components on paper and filmic substrates. The superior cure properties of DEHESIVE® SFX 251 AMA® provide fast cure even in low-temperature applications.

DEHESIVE® PSA 825 L is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for low adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 90-200 °C.

DEHESIVE® PSA 765 is a solvent-free, addition-curing silicone pressure-sensitive adhesive specifically designed for low adhesion levels. It is primarily intended for coating films but can also be used on other substrates. This product utilizes a thermal-curing system that achieves curing at a web temperature of 100-200 °C.