Products

DEHESIVE® PSA 850 R is a solvent-based silicone pressure-sensitive adhesive intended for coating films but also other substrates. It can be used for coating several film  substrates, such as polyester, polyamide, polyimide, and others, for the manufacture of different silicone pressure-sensitive adhesive tapes and other articles.

DEHESIVE® PSA 845 T is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for tight adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 90-200 °C.

DEHESIVE® PSA 847 M is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for tight adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 90-200 °C.

DEHESIVE® PSA 765 KR is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for low adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 100-200 °C.

DEHESIVE® PSA 810 M is a solvent-based, addition-curing silicone pressure-sensitive adhesive specifically designed for coating films as well as other substrates. It offers excellent control over adhesion force along with a tight adhesion force profile. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 90-200 °C.

DEHESIVE® PSA 846 L is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for low adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 90-200 °C.

DEHESIVE® PSA 820 L is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for low adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 100-200 °C.

DEHESIVE® PSA 815 UT is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for ultra-tight adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 90-200 °C.

DEHESIVE® PSA 630 T is a solvent-based silicone pressure-sensitive adhesive intended particularly for coating films but also other substrates. It can be used for coating several film substrates, such as polyester, polyamide, polyimide, and other substrates, for the manufacture of different silicone pressure-sensitive adhesive tapes and other articles.

DEHESIVE® PSA 825 L is a solvent-free, addition-curing silicone pressure-sensitive adhesive designed for low adhesion levels. It serves as a general-purpose adhesive, primarily intended for coating films but also suitable for other substrates. This product utilizes a thermal-curing system and achieves curing at a web temperature range of 90-200 °C.

DEHESIVE® PSA 765 is a solvent-free, addition-curing silicone pressure-sensitive adhesive specifically designed for low adhesion levels. It is primarily intended for coating films but can also be used on other substrates. This product utilizes a thermal-curing system that achieves curing at a web temperature of 100-200 °C.