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Other Devices & Assemblies
Products in Other Devices & Assemblies: Resins, Binders & Matrix Mat...
12 Products found in Other Devices & Assemblies
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Mitsubishi Chemical Group Corporation
jER™ 1750
Polymer Name:
Epoxy Resins & Compounds
Functions:
Binder & Resin, Resins, Binders & Matrix Materials, Resin, Adhesion Promoter, Coupling Agent
Chemical Family:
Bisphenol F Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
Labeling Claims:
High Purity
jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8040
Polymer Name:
Epoxy Resins & Compounds
Functions:
Binder & Resin, Resins, Binders & Matrix Materials, Resin, Adhesion Promoter, Coupling Agent
Chemical Family:
Epoxy & Epoxy Derivatives
Labeling Claims:
High Purity
jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX7105
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Impact Modifier, Adhesion Promoter, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Aluminum, Steel, Fibers & Fabrics, Glass, Plastics, Metal, Concrete, Ceramic
jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8000D
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Adhesion Promoter, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Radiation Curable Coating, Semiconductor Applications
Compatible Substrates & Surfaces:
Glass, Fibers & Fabrics, Concrete, Metal, Ceramic, Aluminum, Plastics, Steel
Features:
Transparency, Low Chlorine Content, Faster Cure Time, LED-curable, Radiation Curable, Fast Cure, UV Curable, Excellent Adhesion
jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL980
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Resins, Binders & Matrix Materials, Adhesion Promoter, Binder & Resin, Resin
Chemical Family:
Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Concrete, Aluminum, Fibers & Fabrics, Metal, Ceramic, Plastics, Steel, Glass
Features:
Low Chlorine Content, Excellent Electrical Insulation, Good Mechanical Properties, Water Resistant, Chemical Resistant, Electrically Insulating, Abrasion Resistance, Water Resistance, Improved Dimensional Stability, Reduced Wear, Good Electrical Properties, Chemical Resistance, Heat Resistance, Improved Flexibility, Flame Retardant
jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL983U
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Resins, Binders & Matrix Materials, Adhesion Promoter, Binder & Resin, Resin
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Concrete, Aluminum, Fibers & Fabrics, Metal, Ceramic, Plastics, Steel, Glass
Features:
Low Chlorine Content, Excellent Electrical Insulation, Good Mechanical Properties, Water Resistant, Chemical Resistant, Low Viscosity, Electrically Insulating, Abrasion Resistance, Water Resistance, Improved Dimensional Stability, Reduced Wear, Good Electrical Properties, Good Elastic Recovery, Chemical Resistance, Heat Resistance, Improved Flexibility
jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Envalior
Akulon® Ultraflow XG-FKGS6
Polymer Name:
Polyamide 6 (PA 6)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® Ultraflow XG-FKGS6 is a high-performance polyamide 6 and polyamide 66 material trusted worldwide for applications in automotive, electronics, electrical, furniture, and packaging. In molded parts, it delivers an impressive blend of design simplicity and processing ease, along with exceptional mechanical properties across a wide temperature range and diverse conditions. For extrusion, it sets industry benchmarks, featuring remarkable strength, resilience, and ease of processing. This product boasts special features including 30% glass reinforcement, flame retardancy (halogen-free), and being best suited for injection molding.
Envalior
Akulon® SG-KGS6
Polymer Name:
Polyamide 66 (PA 66)
Chemical Family:
Polyamides
Reinforcement Material:
Glass Fibers
Additives Included:
Heat Stabilizer
Fillers Included:
Glass Fiber
Processing Methods:
Injection Molding
Akulon® SG-KGS6 is a high-performance material that combines the properties of polyamide 6 and polyamide 66. It is widely used in various industries, including automotive, electronics, electrical, furniture, and packaging. Whether applied in molded parts or extrusion processes, Akulon® SG-KGS6 stands out for its exceptional combination of design flexibility, easy processing, and outstanding mechanical properties. It performs well over a wide temperature range and under diverse conditions.
MARTE SpA
Ares® P108
Polymer Name:
Thermoset Polyester
Chemical Family:
Polyesters, Orthophthalics, Unsaturated Polyester (UPE)
Ares P108 is medium reactivity resin characterized by good mechanical resistance and excellent filler wettability.
MARTE SpA
Ares® P308
Polymer Name:
Polydicyclopentadiene (PDCPD), Thermoset Polyester
Chemical Family:
Polyesters, Olefins
Ares P308 is extremely flexible resin with low styrene content and low exothermic peak.The cross-linked resin is soft and dry to the touch. It is particularly suitable for the production of abrasive cones suitable for abrading particularly fragile and delicate surfaces.
MARTE SpA
Ares® P808
Polymer Name:
Polydicyclopentadiene (PDCPD), Thermoset Polyester
Chemical Family:
Polyesters, Olefins
Ares P808 is DCPD resin with medium reactivity, good mechanical and dimensional characteristics, low styrene content and excellent filler wettability.
Havel Composites CZ sro
Havel Composites CZ sro Epoxy resin LH 330
Polymer Name:
Epoxy Resins & Compounds
Chemical Family:
Bisphenol A Type Epoxy, Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
Processing Methods:
Casting
Havel Composites CZ sro Epoxy resin LH 330 is suitable for curing at room temperature. Suitable hardener: H330, mixing ratio: 100:40 weight, or 100:50 volume. Gel time at 25°C is 70min. Heat resistance: 50°C. Designed for the production of coatings and surface finish of various parts. It is possible to engrain it by pigment pastes for epoxides.