Products in Thermoset Resins

Thermoset Resin A is a low viscosity, quick setting, easy to use casting material. A model or tool cast from Lik-Wood will weigh 60% less than other filled urethane systems. Within 30 minutes after mixing and pouring, Lik-Wood is ready to be carved, sanded, filed, tapped, etc.. Its amazing wood-like characteristics make it ideal for light-weight backing of laminates and/or surface coats. Perfect for fast take offs, cores, engineering changes, temporary molds, patterns, models, prototypes, and bases for die models.Handling Properties:BCC's Lik-Wood is a fast-setting, two part casting system which requires careful preparation prior to mixing parts A and B. Because Lik-Wood contains components having very low density there will be some separation at the surface of the material in its container. Using a paint shaker, jiffy mixer, or mixing spatula, re-suspension of the ingredients is easily accomplished. Precaution should be taken to prevent any moisture contamination from containers or utensils. It is recommended that the work area be well ventilated and normal cleanliness and safety rules be observed. Avoid prolonged exposure to vapors and contact with skin.Preparation of Mold Surface:Clean the surface from dust and possible presence of moisture. Apply BC 87 Parting Agent and polish to a uniform high gloss finish (usually 2-3 coats are recommended). For wood surfaces, 2-3 coats of a high quality sanding sealer is necessary. For plaster surfaces, seal with PVC sealer to ensure complete absence of moisture. For both wood and plaster surfaces, follow with 2-3 coats of 87 Parting Agent.Mixing and Pouring:Pour weighed or measured amounts of Part A & B into a separate dry container by pouring Part A into Part B. Mix with a spatula or mechanical stirrer for 30-40 seconds for quart size batches or 40-50 seconds for gallon batches while avoiding air entrapment. Immediately pour mixed resin uninterrupted from a convenient height above the mold cavity to resist air bubble entrapment. Clean your mixing tools by rinsing in an alcohol type solvent. Larger masses (2 feet or more) may be built up with successive pours. Castings may be demolded within 30-60 minutes but should be properly supported while "green". Under normal conditions, maximum hardness or cure will be achieved in 12-18 hours.

Polyurethane Resin is a liquid molding compounds are tough, fast cycling, low cost, and easy to use. Polyurethane Resin is designed to be used with Liquid Molding, open casting, pressure casting, or vacuum casting processes. Polyurethane Resin can be used with silicone, epoxy, urethane, polyester, or aluminum molds. Low cost molds and fast cycle times are two key attributes of Polyurethane Resin. Polyurethane Resin is available in several series. Each series has different products with different physical properties. Properties such as elongation, tensile strength, and modulus of elasticity can be selected to mold parts with the correct physical characteristics. Choose the Polyurethane Resin material with the exact properties you need, or that are required to meet specifications.Polyurethane Resin is available in opaque white, clear/transparent, and in fire retardant (UL 94V-0) versions. Custom coloring can be achieved by pigmenting Polyurethane Resin with Hapco's easy to mix color dispersions. Both opaque and translucent color dispersions are available.Polyurethane Resin can be molded in inexpensive molds, reducing total part cost, for short run programs.Polyurethane Resin is made for prototypes and short runs of plastic parts. Polyurethane Resin fills the need for low cost, high performance parts, in volumes less than 10,000 parts per year. Polyurethane Resin of general purpose Liquid Molding Compounds that do not change color and remain clear/ light yellow when cured. Polyurethane Resin are ideal for in mold coloring of parts. They can be easily pigmented and the color remains the same in the cured or liquid state. Tensile strengths from 10,300 psi to 11,800 psi are available.

Thermoset Resin C is an Unsaturated Polyester resin non-economic slight dark color with good chemical resistance.It is used in glass fiber lamination and general-purpose.

MultiTech MultiFunctional L is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparency LED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs MultiTech MultiFunctional L is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group

MultiTech Resin is an alicyclic epoxide for epoxy resin composition, with the following features :- Excellent fluidity. Possible to maintain low viscosity at high temperature by partial addition of DE-102- High light resistance- Low water absorption

Thermoset Resin B is a four component acryl casting resin. It consists of 2 liquid components and a hardener powder. Both liquid components are filled with the 1,5 amount in ppw of special aluminum powder. The resin cures within 20-30 minutes to well heat-conducting, heat-resistant molds. The cured molds are very well workable by machines. The structure is extremely dense and the machined areas have an aluminum-like appearance. It is possible to cast any quantity, which can be mixed in one or more containers. Altercating or casting in layers is not possible. Therefore it is very important to determine the casting volume exactly in order to avoid that the mixed quantity is too small. Since the hardener powder is hygroscopic, always seal it air-tight. We recommend to sieve it before each use. Linear shrinkage as per mixture listed in the data sheet. Room temperature and starting temperature of resin components are 21°C as per measurement. For other temperatures or a different content of aluminum powder, shrinkage might also be different.

ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.

jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.

SABIC's Specialties Business LNP THERMOCOMP TF002 compound is based on Polyurethane (TPU) resin containing 10% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

SABIC's Specialties Business LNP STAT-KON TX06488 compound is based on Polyurethane (TPU) resin containing conductive carbon powder. Added features of this grade include: Excellent Ductility, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.

MOCOM Compounds ALCOM® LDDC PMMA 1000 UV 18124 BK1074-11 is a polymethylmethacrylate base polymer with a UV stabilized filler/additive system suitable for applications such as lamp covers, display elements, operating elements, and light transparent components in automotive and lighting markets. Pre-drying conditions include 80°C in a dry air (dessiccant) dryer for 3-4 hours and 80°C in an air circulating dryer for 4-6 hours, with a maximum moisture content of <0.02%. For injection molding, melt temperature should be between 220-280°C and mold temperature should be between 50-80°C.

MOCOM Compounds ALCOM® LDDC PMMA 1000UV18123 BK1016-11 is a translucent, UV stabilized Polymethylmethacrylate polymer used for Automotive, Lighting, and interior decoration/finishing, light transparent components, and Black Panel-Technology applications such as lamp covers, display elements, and operating elements. Pre-drying conditions involve 80°C in a dry air (dessiccant) dryer for 3-4 hours and 80°C in an air circulating dryer for 4-6 hours with a maximum moisture content of less than 0.02%. For processing injection molding, the melt temperature should be between 220-270°C and the mold temperature should be between 50-80°C. It should be protected from light.

Esschem MMA - Styrene Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) and styrene. These bead copolymers offer a wide array of properties and applications. With increased MMA content, the resulting materials exhibit remarkable strength and transparency. Conversely, a higher proportion of styrene enhances hydrophobicity, hardness, and impact resistance. The molecular weight plays a crucial role in determining the characteristics of the copolymers. Higher molecular weights, often associated with increased styrene content, yield stronger and more heat-resistant materials. Esschem's ability to manipulate the molecular weight distribution allows for customized properties such as durability, elasticity, and processing ease. Additionally, the particle size of the copolymers influences surface properties and rigidity.

Farboset® 1115AC is intended for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions, making it suitable for various thermoset molding applications and ensuring safety and reliability in its intended use.

Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.

GAC Chemical Ammonium Sulfate NFA Grade, a versatile product with Kosher certification, ensuring compliance with dietary preferences. This compound finds application in various industrial processes, including flame retardant and styrene butadiene manufacturing. Additionally, it plays a vital role in leather tanning and water treatment, addressing diverse industrial needs.

DAP D69/6130 is a versatile diallyl ortho-phthalate molding compound with the advantage of being long-glass fiber filled. Supplied in flake form, this compound is convenient to work with. It can be easily molded using compression or transfer equipment and can be preformed for improved handling. Notably, it maintains its performance even when stored at room temperature for up to one year. This makes it a reliable choice for a wide range of applications where long-term performance and ease of use are essential.

Esschem EMA - EHMA Bead Copolymers are a unique combination of ethyl methacrylate (EMA) and 2-ethylhexyl methacrylate (EHMA) that offers exceptional properties.The incorporation of 2-EHMA disrupts the polymer chain packing, resulting in lower glass transition temperatures and enhanced low-temperature flexibility, while significantly improving transparency.With variations in molecular weight, Esschem can further enhance the strength and flexibility of these bead copolymers. The smaller particle size of the beads improves processability and has the potential to enhance transparency, while larger particles contribute to a more rigid material.

Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.

Cosmic Epoxy E484 is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It boasts excellent mechanical strength and electrical properties, particularly at high temperatures, and has successfully passed NASA outgassing tests. This compound finds applications in electrical hardware, including underwater connectors and various insulation needs.

Cosmic Epoxy C102 is a copper-filled molding compound available in a very fine granular form. It is suitable for various molding processes, including injection molding, compression molding, and transfer molding. This material is designed for fabricating parts that demand high strength and excellent electrical conductivity.

METTON® LMR M1537 Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. The low-pressure molding process is ideal for producing large plastic parts used in heavy trucks, agriculture, construction, the military, and other industrial applications.

Farboset® 2477FPB is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for a variety of thermoset molding applications, ensuring safety and reliability in its intended use.

Esschem EMA Bead Copolymers are a range of bead polymers synthesized from ethyl methacrylate (EMA) that offers the strength of polymethyl methacrylate (PMMA) with slightly different properties.The copolymers exhibit a slightly lower glass transition temperature, resulting in a softer and more flexible final product compared to PMMA.By controlling the molecular weight, Esschem can customize the heat resistance and strength of the polymer, making it suitable for various applications across multiple industries.The smaller particle size of the beads enhances surface properties like adhesion, while larger particles contribute to a more robust and rigid material.

Farboset® 1712 is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for a variety of thermoset molding applications, ensuring safety and reliability in its intended use.

Esschem MMA - BMA Bead Copolymers are a range of copolymers combining methyl methacrylate (MMA) with butyl methacrylate (BMA).These copolymers offer a versatile solution with varying properties based on the MMA and BMA content. Higher MMA content results in copolymers with elevated glass transition temperatures, melting points, and tensile strengths, making them suitable for applications that require strength and rigidity. Conversely, increased BMA content lowers these properties while enhancing processability and potential flexibility.By adjusting the molecular weight, Esschem can tailor the copolymer structure to achieve specific rigidity requirements. Additionally, controlling the particle size allows for improvements in mechanical strength, with smaller particles offering larger surface area to volume ratios.