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Thermoset Resins
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922 Products found in Thermoset Resins
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Cosmic Plastics
DAP K31/6220
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Housings, Structural Parts, Insulators, Terminal Blocks, Switches
Density:
1760.0 - 1760.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP K31/6220 is a versatile diallyl iso-phthalate molding compound, filled with short glass fibers and supplied in granular form. This compound offers excellent heat resistance and is suitable for a wide range of applications. It is easy to work with, pouring easily and allowing for preforming. Additionally, it molds readily using standard compression, transfer, or injection equipment. One notable feature of K31/6220 is its FDA approval for direct food contact use, making it a reliable choice for applications in the food industry where heat resistance and safety standards are essential.
Cosmic Plastics
DAP ID-40
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Printed Circuit Boards, Connectors, Terminal Blocks
DAP ID-40 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.
Cosmic Plastics
Cosmic Alkyd 3D94
Polymer Name:
Alkyd Resin
Physical Form:
Sheets
Features:
Low Odor, Easy To Mold
Density:
1890.0 - 1890.0 kg/m³
Color:
Green
Cosmic Alkyd 3D94 is a mineral-filled polyester molding compound that is available in sheet form. This compound is designed for ease of use in molding applications and can be readily molded using standard compression or transfer equipment. It offers good moldability, making it suitable for a range of applications where a combination of mechanical strength and cost-effectiveness is desired. When stored at temperatures of 50°C or below, it has a shelf life of six months, providing flexibility in manufacturing and storage.
Cosmic Plastics
DAP 306.0
Polymer Name:
Diallyl Phthalate
End Uses:
Cups, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1520.0 - 1520.0 kg/m³
Tensile Strength:
24.804000000000002 - 34.45 MPa
DAP 306 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon and supplied in flake form. It is suitable for a variety of applications, including switches, terminals, insulators, cups, cases, and other components that require strength as well as chemical and moisture resistance. It can also be used for the encapsulation of electrical and electronic components.
Metton America
METTON® LMR M1540 Polymers
Polymer Name:
Polydicyclopentadiene (PDCPD)
Processing Methods:
Injection Molding, Reaction Injection Molding (RIM)
Density:
1026.0 - 1034.0 kg/m³
METTON® LMR M1540 Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. Large plastic components used in military, agricultural, construction, heavy-duty vehicles, and other industrial applications may be produced with the low-pressure molding technique.
Cosmic Plastics
Cosmic Epoxy EH61
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH61 is an iron-filled epoxy molding compound provided in a black granular form. It is designed for EMI/RFI shielding applications and can be utilized in compression or transfer molding processes to manufacture core rods or encapsulate surface mount and axial leaded inductors. This single molded compound streamlines the manufacturing process, eliminating the labor-intensive over/under molding steps.
Cosmic Plastics
DAP K61/6230
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Cups, Housings, Cases, Insulators, Terminal Blocks, Switches
Density:
1720.0 - 1720.0 kg/m³
Tensile Strength:
41.34 - 68.9 MPa
DAP K61/6230 is a general-purpose diallyl iso-phthalate molding compound that contains long-glass fiber fillers. It is supplied in flake form, making it suitable for various molding applications. This compound can be preformed and easily molded using standard compression and transfer equipment. It offers good moldability and is designed to meet the requirements of general-purpose molding applications where a balance of mechanical strength and ease of processing is essential.
Cosmic Plastics
Cosmic Epoxy EH71
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH71 is an iron-filled epoxy molding compound available in a black granular form. It is well-suited for EMI/RFI shielding applications and can be used in either compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to streamline the manufacturing process by eliminating the labor-intensive over/under molding steps.
Cosmic Plastics
Cosmic Epoxy CP7311
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Aircraft Applications
Flexural Strength:
0.24115 - 310.05 MPa
Cosmic Epoxy CP7311 is a long-glass reinforced epoxy molding compound that comes in a flake form. It is designed to be an ideal replacement for various aircraft and heavy metal parts, providing a durable and high-strength material suitable for demanding applications in these industries.
Metton America
METTON® LMR High-HDT Grade M3000-TH Polymers
Polymer Name:
Polydicyclopentadiene (PDCPD)
Processing Methods:
Injection Molding, Reaction Injection Molding (RIM)
Density:
1030.0 - 1030.0 kg/m³
METTON® LMR High-HDT Grade M3000-TH Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. The low-pressure molding process is ideal for producing large plastic parts used in heavy trucks, agriculture, construction, the military, and other industrial applications.
Esschem
Esschem EMA - EGDMA Bead Copolymers
Polymer Name:
EMA/EGDMA Copolymer
Functions:
Impact Modifier, Resin, Resins, Binders & Matrix Materials, Binder & Resin
Chemical Family:
Acrylics, Acrylates & Methacrylates, Methacrylates
Labeling Claims:
Non-Toxic, Biocompatible
Physical Form:
Beads, Solid
Esschem EMA - EGDMA Bead Copolymers are a versatile combination of ethyl methacrylate (EMA) and ethylene glycol dimethacrylate (EGDMA). With a higher proportion of EMA, these copolymers exhibit enhanced flexibility due to the less bulky ethyl group present in EMA. Conversely, increasing the EGDMA content results in a more crosslinked structure, leading to greater rigidity. The glass transition temperature remains relatively stable regardless of the percentage of each constituent. By precisely controlling the molecular weight, Esschem can optimize the level of crosslinking, resulting in superior mechanical properties such as hardness and tensile strength. Additionally, the particle size can be tailored to influence surface area and reactivity, allowing for further adjustment of the physical properties.
GAC Chemical
GAC Chemical Ammonium Sulfate Reagent/ACS Grade
Chemical Name:
Ammonium Sulfate
CAS Number:
7783-20-2
Functions:
Stabilizer, Resin
Chemical Family:
Sulfates, Ammonium Compounds, Ammonium Salts
Synonyms:
(NH4)2SO4, Ammonium Sulphate, Diammonium Sulfate
GAC Chemical Ammonium Sulfate Reagent/ACS Grade meets reagent/ACS grade specifications, is certified kosher, and boasts high purity. Available in granular form, it is part of their processing, purification, and testing solutions range, specifically within testing solutions for pharmaceuticals and nutraceuticals.
Cosmic Plastics
Farboset® 1160
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Power Transformers, Capacitors, Coils, Relay Bases, Encapsulant, Diodes
Volume Resistivity:
95000000000000.0 - 95000000000000.0 Ohm-m
Flexural Strength:
118.58 - 118.58 MPa
Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.
Cosmic Plastics
DAP D72/6120F
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1820.0 - 1820.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.
Cosmic Plastics
Farboset® 2461
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Capacitors, Resistor Network, Resistor, Encapsulant, Inductor Coil
Volume Resistivity:
22000000000000.0 - 22000000000000.0 Ohm-m
Flexural Strength:
85.436 - 85.436 MPa
Farboset® 2461 is a mineral-filled novolac epoxy molding compound that offers fast cure rates, excellent moldability, and superior thermal shock and moisture resistance. It has been formulated to achieve a high glass transition temperature, making it suitable for applications requiring optimal reliability performance, even in very thin sections. Farboset® 2461 is designed for encapsulating a wide range of electronic devices, including capacitors, resistors, resistor networks, and inductor coils, ensuring their protection and reliability in various operating conditions.
Cosmic Plastics
DAP D33/6120
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1720.0 - 1720.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.
Esschem
Esschem MMA - HPMA Bead Copolymers
Polymer Name:
MMA/HPMA Copolymer
Functions:
Resin, Binder & Resin, Impact Modifier, Resins, Binders & Matrix Materials
Chemical Family:
Acrylic Ester Copolymer, Acrylics, Acrylates & Methacrylates, Methacrylates
Physical Form:
Beads, Solid
Labeling Claims:
Biocompatible, Non-Toxic
Esschem MMA - HPMA Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) with hydroxypropyl methacrylate (HPMA). These bead copolymers offer exceptional performance and customizable properties for various applications. With increased MMA content, these copolymers exhibit elevated glass transition temperatures, melting points, and tensile strengths, providing enhanced strength and durability. Conversely, higher HPMA content improves adhesion and reduces glass transition temperatures, melting points, and tensile strengths, offering flexibility and tailored characteristics. Esschem further enhances the molecular weight of these copolymers, resulting in more rigid and durable materials. By manipulating the particle size, solubility, dispersion properties, and transparency can be optimized, making them ideal for applications that demand transparency, strength, and toughness.
Metton America
METTON® LMR M1539 Polymers
Polymer Name:
Polydicyclopentadiene (PDCPD)
Processing Methods:
Injection Molding, Reaction Injection Molding (RIM)
Density:
1026.0 - 1034.0 kg/m³
METTON® LMR M1539 Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. The low-pressure molding process is ideal for producing large plastic parts used in heavy trucks, agriculture, construction, the military, and other industrial applications.
GAC Chemical
GAC Chemical Ammonium Sulfate Purified Granular Grade
INCI Name:
Ammonium Sulfate
Chemical Name:
Ammonium Sulfate
CAS Number:
7783-20-2
Functions:
Viscosity Modifier, Resin, Stabilizer
Chemical Family:
Sulfates, Ammonium Compounds, Ammonium Salts
Synonyms:
(NH4)2SO4, Ammonium Sulphate, Diammonium Sulfate
GAC Chemical Ammonium Sulfate Purified Granular Grade comes with the benefit claim of high purity and is certified Kosher. This product is available in granular form.
Cosmic Plastics
Farboset® 2460
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Capacitors, Resistor Network, Resistor, Coils, Encapsulant
Volume Resistivity:
18000000000000.0 - 18000000000000.0 Ohm-m
Flexural Strength:
1372.0 - 1372.0 MPa
Farboset® 2460 is a novolac epoxy molding compound filled with minerals. It is designed for encapsulating a variety of electrical and electronic components, including tantalum and ceramic capacitors, resistors, resistor networks, and high-performance coils. This compound is formulated to provide fast cure rates, excellent moldability, and superior resistance to thermal shock and moisture. It has been specifically designed to offer improved resistance to moisture ingress, making it a reliable choice for applications where moisture resistance is crucial.
Cosmic Plastics
DAP K66/6230F
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Housings, Structural Parts, Insulators, Terminal Blocks, Switches
Density:
1820.0 - 1820.0 kg/m³
Tensile Strength:
0.04134 - 68.9 MPa
DAP K66/6230F is a versatile diallyl iso-phthalate molding compound that incorporates long glass fibers for enhanced strength and flame retardant properties. Supplied in flake form, it is designed for ease of use in molding applications. This compound can be readily preformed and molds easily using standard compression or transfer equipment, making it a flexible choice for various applications. Notably, it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.
GAC Chemical
Aqua Aide™ Crystals
Ingredient Name:
Ammonium Sulfate
Chemical Name:
Ammonium Sulfate
CAS Number:
7783-20-2
Functions:
Resin, Stabilizer
Chemical Family:
Sulfates, Ammonium Compounds, Ammonium Salts
Synonyms:
(NH4)2SO4, Ammonium Sulphate, Diammonium Sulfate
Aqua Aide™ Crystals serve as a stabilizer in food products. These crystals possess stabilizing properties and are water-soluble. Additionally, they are odorless and easy to handle. Aqua Aide™ Crystals are also labeled as Kosher.
Cosmic Plastics
Farboset® 1707-2
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Power Transformers, Bushings, Coils, Encapsulant
Farboset® 1707-2 is a mineral and glass-filled, anhydride epoxy molding compound that is engineered for the encapsulation of various electrical and electronic components. It is specifically formulated to provide high thermal shock resistance, making it ideal for protecting components that may be subjected to rapid temperature changes or other harsh environmental conditions. This compound helps ensure the reliability and durability of encapsulated components.
Metton America
METTON® LMR M1534 Polymers
Polymer Name:
Polydicyclopentadiene (PDCPD)
Processing Methods:
Injection Molding, Reaction Injection Molding (RIM)
Density:
1026.0 - 1034.0 kg/m³
METTON® LMR M1534 Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. The low-pressure molding process is ideal for producing large plastic parts used in heavy trucks, agriculture, construction, the military, and other industrial applications.
Cosmic Plastics
Cosmic Epoxy E4920VS
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920VS is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Esschem
Esschem MMA Bead Copolymers
Polymer Name:
Methyl Methacrylate Copolymer
Functions:
Resin, Binder & Resin, Impact Modifier, Resins, Binders & Matrix Materials
Chemical Family:
Acrylic Ester Copolymer, Acrylics, Acrylates & Methacrylates, Methacrylates
Physical Form:
Beads, Solid
Labeling Claims:
Biocompatible, Non-Toxic
Esschem MMA Bead Copolymers are a collection of methyl methacrylate (MMA) bead polymers renowned for their exceptional properties.These polymers exhibit impressive features such as high glass transition temperature, melting point, tensile strength, and impact resistance.Esschem meticulously controls the reaction conditions to create polymers with specific molecular weight distributions, allowing for a wide range of desired properties. This precise control enhances the inherent strength, rigidity, and impact resistance of MMA polymers.Moreover, by carefully manipulating the particle size, Esschem offers the flexibility to customize properties such as hardness, toughness, and processability.
Cosmic Plastics
DAP K43/6260
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Housings, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1800.0 - 1800.0 kg/m³
Tensile Strength:
31.005000000000003 - 41.34 MPa
DAP K43/6260 is a versatile diallyl iso-phthalate molding compound that is filled with minerals and supplied in granular form. This compound is designed for ease of use and versatility. It pours easily, can be preformed, and molds readily using standard compression, transfer, or injection equipment. What sets K43/6260 apart is its exceptional heat resistance, high arc resistance, and ease of molding around inserts. These features make it an ideal choice for applications that demand high-temperature performance and electrical insulation properties, while still allowing for straightforward processing and customization.
Cosmic Plastics
Cosmic Epoxy E4940S
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Optical Fiber Connector, Resistor Network
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4940S is a mineral-filled epoxy molding compound supplied in granular form. It offers excellent dimensional stability, improved thermal cycling properties, and exceptional moisture resistance. This product is specifically designed for high-volume encapsulation of resistor networks and fiber-optic connectors that demand high quality, reliability, and excellent moldability.
Cosmic Plastics
Farboset® 5000
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Power Transformers, Coils, Switches, Encapsulant, Solenoid Coil
Farboset® 5000 is a novolac epoxy molding compound that contains mineral and glass fillers. It is specifically designed for applications where fast curing, high hot strength, and low abrasion resistance are essential. This compound is well-suited for the encapsulation of solenoid coils and similar applications where electrical and thermal performance are critical.
Cosmic Plastics
Farboset® 1190
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Coils, Switches, Encapsulant, Power Transformers
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
137.788 - 137.788 MPa
Farboset® 1190 is a fast-curing epoxy molding compound that is mineral and glass-filled, and it contains improved strength properties. It is specially designed for encapsulating a variety of electrical and electronic components, such as coils, transformers, switches, and more. Farboset® 1190 is known for its excellent thermal shock resistance and superior resistance to cracking, making it a reliable choice for these applications.
Cosmic Plastics
DAP D72F1
Polymer Name:
Diallyl Phthalate
DAP D72F1 is intended for thermoset molding and is available in solid form, offered as granules or preforms in various colors. It has a mild odor and is insoluble in water, making it suitable for a wide range of applications. Additionally, this product exhibits no reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Cosmic Epoxy E4920H
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920H is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
ADEKA Corporation
ADEKA™ EP-4000
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Casting
End Uses:
Engineered Applications, Electrical/Electronic Applications
ADEKA™ EP-4000, identified by the polymer name epoxy resins and compounds, finds application in engineered and electrical/electronic applications. Noted for its material features of good adhesion and flexibility, this product is specifically tailored for processing methods such as casting in plastics and elastomers. ADEKA™ EP-4000 stands as a reliable choice in industries where superior adhesion, flexibility, and versatile processing methods are essential.
ADEKA Corporation
ADEKA™ EH-3636AS
Polymer Name:
Epoxy Resins & Compounds
ADEKA™ EH-3636AS, featuring the polymer name epoxy resins and compounds, stands as a specialized product within the realm of plastics. Driven by advanced plastic technologies, it caters to diverse applications, ensuring optimal performance and versatility in the field of plastics.
ADEKA Corporation
ADEKA™ EP-4100G
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Casting
End Uses:
General Purpose, Electrical/Electronic Applications
ADEKA™ EP-4100G, a variant of epoxy resins and compounds, stands out with its general-purpose material features. Specifically designed for plastics and elastomers processed using casting methods, this polymer finds versatile applications. Its end uses span across electrical and electronic applications and general-purpose industrial scenarios, making ADEKA™ EP-4100G a reliable choice for various manufacturing needs.
ADEKA Corporation
ADEKA™ ED-509S
Polymer Name:
Epoxy Resins & Compounds
ADEKA™ ED-509S, featuring the polymer name epoxy resins and compounds, is a specialized resin meticulously crafted for plastics and elastomer functions. Grounded in advanced plastic technologies, it plays a crucial role as an essential component in formulations within the plastics industry, showcasing a dedication to excellence in resin applications.
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