Products in Thermoset Resins: Fast Curing

Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

Farboset® 2720 is a mineral-filled epoxy molding compound known for its rapid curing, exceptional moldability, and remarkable resistance to thermal shock and moisture. This compound is tailored to offer enhanced protection against moisture ingress and boasts a high glass transition temperature, making it an ideal choice for ensuring reliability in performance. Its primary purpose is to encapsulate a wide variety of electronic devices, including tantalum and ceramic capacitors, resistors, and resistor networks, providing them with a robust shield against environmental factors and mechanical stress.

Farboset® 2461 is a mineral-filled novolac epoxy molding compound that offers fast cure rates, excellent moldability, and superior thermal shock and moisture resistance. It has been formulated to achieve a high glass transition temperature, making it suitable for applications requiring optimal reliability performance, even in very thin sections. Farboset® 2461 is designed for encapsulating a wide range of electronic devices, including capacitors, resistors, resistor networks, and inductor coils, ensuring their protection and reliability in various operating conditions.

Cosmic Alkyd 3D36 is a specialized alkyd molding compound that incorporates long glass fibers for enhanced impact resistance and flame retardant properties. Supplied in flake form, it is designed for ease of use and versatility in molding applications. This compound molds readily using standard compression or transfer equipment, and it maintains its performance for up to one year when stored at temperatures of 100°C or below. Its unique blend of properties makes it suitable for applications that require both impact resistance and flame retardancy.

Farboset® 2460 is a novolac epoxy molding compound filled with minerals. It is designed for encapsulating a variety of electrical and electronic components, including tantalum and ceramic capacitors, resistors, resistor networks, and high-performance coils. This compound is formulated to provide fast cure rates, excellent moldability, and superior resistance to thermal shock and moisture. It has been specifically designed to offer improved resistance to moisture ingress, making it a reliable choice for applications where moisture resistance is crucial.

DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.

Farboset® 2510 is a mineral-filled, novolac epoxy molding compound known for its fast cure rates at low temperatures, excellent laser markability, and good moldability. This compound is specially formulated for encapsulating surface mount ceramic and tantalum capacitors, as well as other applications that demand quick cycle times. Its unique properties and rapid curing make it well-suited for applications where fast production and efficient marking are essential.

Farboset® 2270 is a granular epoxy molding compound that contains a combination of glass and mineral fillers. It is based on a novolac epoxy resin and is designed for encapsulating various electrical and electronic components, including capacitors, resistors, hybrids, and more. This compound is known for its good moldability and fast cure rates, especially at lower molding temperatures. It offers excellent performance and reliability for applications where these characteristics are crucial.

Farboset® 2472V0 is a novolac epoxy molding compound that is mineral-filled for enhanced performance. It offers rapid cure rates, excellent moldability, and exceptional resistance to thermal shock and moisture. This compound has been specially formulated to provide improved resistance to moisture ingress, making it an ideal choice for applications where exposure to moisture is a concern. Additionally, it features a high glass transition temperature, ensuring optimum reliability in performance. Its combination of properties makes it well-suited for a range of applications where resilience to environmental conditions is crucial.

Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.

Farboset® 2500 is a mineral-filled, flame-retardant, novolac epoxy molding compound that offers fast cure rates at low temperatures, laser markability, and good moldability. This compound is formulated for encapsulating surface mount ceramic and tantalum capacitors, along with other applications that require quick cycle times. Its flame-retardant properties make it suitable for applications where fire safety is a concern, while its rapid curing and ability to be laser marked enhance its utility in modern production processes.

Farboset® 5000 is a novolac epoxy molding compound that contains mineral and glass fillers. It is specifically designed for applications where fast curing, high hot strength, and low abrasion resistance are essential. This compound is well-suited for the encapsulation of solenoid coils and similar applications where electrical and thermal performance are critical.

Farboset® 1190 is a fast-curing epoxy molding compound that is mineral and glass-filled, and it contains improved strength properties. It is specially designed for encapsulating a variety of electrical and electronic components, such as coils, transformers, switches, and more. Farboset® 1190 is known for its excellent thermal shock resistance and superior resistance to cracking, making it a reliable choice for these applications.

ADEKA™ EH-4357S is a remarkable product within the plastics industry, known for its exceptional material features such as fast curing and low outgassing. The innovative deployment of a heat cure method sets this product apart, showcasing its commitment to advanced plastic technologies. In applications where efficiency and low outgassing are paramount, ADEKA™ EH-4357S stands as a reliable and efficient solution, exemplifying excellence in the dynamic field of plastics.

ADEKA™ EH-5030S, recognized by the polymer name epoxy resins and compounds, is known for its material features of fast curing and low outgassing. Employing a heat cure method, this product, driven by advanced plastic technologies, stands as a reliable solution within the plastics industry. In applications where efficiency and low outgassing are critical, ADEKA™ EH-5030S showcases its commitment to excellence in resin solutions.

ADEKA™ EH-5046S, identified by the polymer name epoxy resins and compounds, is renowned for its material features of fast curing and good adhesion. Employing a heat cure method, this product, rooted in advanced plastic technologies, serves as a reliable solution within the plastics industry. With its emphasis on fast curing and excellent adhesion properties, ADEKA™ EH-5046S stands out as a go-to choice for efficient and high-performance resin applications.

ADEKA™ EH-4351S, characterized by the polymer name epoxy resins and compounds, is distinguished for its material feature of fast curing. ADEKA™ EH-4351S employs a heat cure method. This product, rooted in advanced plastic technologies, offers efficient solutions within the plastics industry.

BCC Kwik Kast/Gray is a two component, fast setting polyurethane reproduction plastic. BC 8645 sets to a demoldable hardness within 30 minutes @ 77°F. Uses include; tracing models, core boxes, duplicating aids, patterns, prototypes, low temperature vacuum form tools, etc..

DI-PAK E-4888 & E-4889High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications.

Vikram Resins and Polymers VRP 2112 is a medium reactive superior grade Orthophthalic Acid based Unsaturated Polyester Resin. It has low viscosity, good wetting, good mechanical properties, and is fast curing. VRP 2112 is suitable for hand lay-up, RTM, and other molding applications and can be supplied as a pre-accelerated, thixotropic, or low viscosity resin.

RIGIDDI-PAK R-4242/4243Low cost, fast set potting compounds with excellent properties and FAST TURNOVER. R-4242/4243 are 1:1 by weight or volume, making them ideal for hand pour or automatic metering systems.

DI-PAK E-4501 Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame retardant and meet UL 94V-0 requirements.

DI-PAK E-4600 SERIESFlexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented.

DI-PAK E-4600 SERIESFlexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented.

Epoxy Flex-Filler is a pasty, solvent-free, fast curing two-component epoxy resin, almost shrinkage-free. It is compatible with common epoxy resin coatings.

Ebalta AH 110 / TGS is a non-filled epoxy resin with high strength and dimensional stability, even at increasing temperature. It also can be used as casting resin with powder fillers as aluminum powder, as laminating resin with glass fabrics and as binding resin with granular fillers as aluminum granules. Depending on the application if just needs to use a different hardener for the mixture. As laminating resin AH 110 / TGS is suitable for thin high solid laminates.

DI-PAK E-4888 & E-4889High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications.

DI-PAK E-4500 SERIESFlexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available.

Dynafoam 60% Reduction is a Thermoset, Unspecified (TS, Unspecified) product. It can be processed by foam processing and is available in North America. Applications of Dynafoam 60% Reduction include foam and sealing applications.Characteristics include: Heat Resistant Chemical Resistant Good Dimensional Stability

Siropol P 9170 resin is fast­-cure, resilient polyester for use where very clear casting is needed. The raw materials used in the manufacture of this resin are listed as acceptable in FDA regulation Title 21 CFR 177.2420 for repeated use in contact with food subject to user’s compliance with the prescribed limitations of that regulation.

ebalta SG 150 is a four component acryl casting resin. It consists of 2 liquid components and a hardener powder. Both liquid components are filled with the 1,5 amount in ppw of special aluminum powder. The resin cures within 20-30 minutes to well heat-conducting, heat-resistant molds. The cured molds are very well workable by machines. The structure is extremely dense and the machined areas have an aluminum-like appearance. It is possible to cast any quantity, which can be mixed in one or more containers. Altercating or casting in layers is not possible. Therefore it is very important to determine the casting volume exactly in order to avoid that the mixed quantity is too small. Since the hardener powder is hygroscopic, always seal it air-tight. We recommend to sieve it before each use. Linear shrinkage as per mixture listed in the data sheet. Room temperature and starting temperature of resin components are 21°C as per measurement. For other temperatures or a different content of aluminum powder, shrinkage might also be different.

BC 8400 is an unfilled, low viscosity, quick setting two component urethane system. An easy to use 1 to 1 mix ratio (Part A/Part B), BC 8400 offers the user a 3 minute working time with parts demoldable in as little as 30 minutes. When properly cured, BC 8400 will exhibit high impact strength and yield thermoplastic-like parts. Some outstanding features include the following: mercury free, moderate heat resistance, 1 to 1 mix ratio, turn white upon cure, longer mold life, high impact strength, no objectionable odor, excellent finishing properties, thermoplastic appearance, more parts per day.

DI-PAK E-4600 SERIESFlexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented.

DI-PAK E-4901-2, E-4901-10, & E-4901-30Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds.

DI-PAK E-4600 SERIESFlexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented.