Products results

Rainmaker Polymers ACLLAS10NA2 is an Antistat PEC. Rainmaker Polymers' Antistat Concentrates dissipate surface charges and eliminate the undesirable effects of static build up.

B-STAGE PROCEDURE125-22 is a screen-printable, B-Stageable, electrically conductive, one part epoxy adhesive, suitable for application by screen-printing and syringe dispensing. 125-22 is designed to exhibit minimal flow during bonding. This product provides superior electrical and thermal conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to copper, aluminum and ceramic and a variety of other substrates. Additional applications include, but are not limited to, assembling electrical and electronic components. This system features excellent thermal stability and flexibility in the B-Staged form.Features Minimal flow during cure Low CTE B-Stageable Long Screen Life Excellent Chemical Resistance Excellent High Temperature Performance B-stageable conductive adhesive with low flow & low CTE

ME8550-DA is a die attach epoxy paste adhesive designed for needle dispensing and screen-printing processing. This silver filled conductive die-attach adhesive can be rapidly cured at low temperatures.This single component, silver filled paste is electrically and thermally conductive. It is thixotropic with minimal sag. ME8550-DA has been designed to eliminate bleeding on both silver plated copper and alloy 42 leadframes.

Neoflon PFA AF-0500, presented as a solid white film, emerges from precise melt extrusion using neoflon PFA material. This product showcases a molecular design that merges carbon and fluorine atoms with the perfluoroalkoxyl group, ensuring remarkable heat resilience, chemical resistance, and nonflammability. Celebrated for its nonadhesive properties, it seamlessly offers fabricating capabilities such as sealing, thermoforming, welding, and heat bonding. Tailored for sectors like automotive, electrical and electronics, aerospace, and transportation, its applications span electrical components, printed circuit boards, and aircraft components. Its inherent attributes, coupled with specialized surface treatment, enhance compatibility with diverse materials, amplifying its multifaceted industry relevance.

EC-1850FT is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components.

Wollastonite is a naturally occuring, non-metallic, acicular (needle-shape) mineral.

Tedlar® TCC15BL3 protective film helps extend the look and life of the design, even in the most extreme environments. It provides long-term durability and performance, withstanding severe weather and harsh chemicals. Tedlar® protective film can be easily applied to a range of surfaces, offering design flexibility and reliable surface performance.

FLASHBOND™ UV-5608DC is an innovative light cure epoxy adhesive. It has unique features that allow for fast processing and fixturing of parts. Once the adhesive has been activated with UV light, it has set open time that allows for assembly of parts. The product continues to cure at room temperature or rapidly cures when exposed to low temperature heat. The cured product exhibits low shrinkage and excellent thermal, water and chemical resistance. Typical applications include bonding of optics, connectors, fibers, lenses, prisms and other electronic components where low shrinkage and low outgassing are required.

Wollastonite is a naturally occuring, non-metallic, acicular (needle-shape) mineral.

Tedlar® TWW10BG3 protective film helps extend the look and life of the design, even in the most extreme environments. From severe weather to harsh chemicals, Tedlar® protective film provides long-term durability and performance. Tedlar® protective film can easily be applied to a range of surfaces, providing the flexibility to design your way and the surface performance to keep it that way.

APPLI-TEC 5336 Epoxy is a black, electrically isolating, thermally conductive epoxy designed specifically for staking and encapsulating electronics on circuit boards as well as potting and encapsulating power supplies, transformers, and coils. This material is ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals. 5336 is supplied in frozen syringes.

Yincae® TGP 110 is a thermally conductive adhesive. It is a reactive thermal grease, eliminates micro-bubbles at rough interfaces and has a very thin BLT.

Polynt Group BMC 900 RI RF is a bulk molding compound based on an unsaturated polyester resin, fire retardant grade, halogen-free, reinforced with glass fibers. This BMC has been developed for electrical application with a high percentage of recycled BMC after grinding. Good mechanical properties and good fire protection grade are combined into the BMC 903 RI RF gr ch.. BMC RF 500/18 is formulated according to RoHS, REAC regulation SVHC and WEEE European legislation.

Polycor® 949 Neutral Base sanding gel coats have been specifically formulated for use as a sanding substrate. Sanding gel coats are used for FRP parts that will be subsequently painted. They can be used for room temperature and heated molding rtm applications. Customer experiences have proven that these products can be post-baked at temperatures up to 285°f for as long as two hours. They may also be used for utility, noncritical exterior applications. They are not intended Nor should they be used as a surface coat for the marine, tub/shower or swimming pool industries. They should not be used for water immersion service boat hull, swimming pool, spa, water tank, etc. , even if/when painted.

3B Fiberglass DS 2200-13P is a 13 μm filament dia-meter, 4 mm long chopped glass fiber designed for production of Polyolefin compounds.DS 2200-13P shows outstanding compatibility with Polypropylene. This is the material of choice for very high glass content (up to 50 %wt) compound grades that require good fiber dispersion as well as mechanical properties. DS 2200-13P is also desig-ned for parts weathering in prolonged contact with water, detergents and glycol. DS 2200-13P can also be used in applications complying with strin-gent requirements of food contact and drinkable water standards EC 10/2011, FDA, BfR and ACS. DS 2200-13P is supplied on a pel-letized form and offers outstanding feeding-to-extruder behavior as well as excellent fiber impregnation.DS 2200-13P’s sizing chemistry also requires reduced amount of coupling agents so that parts reach optimum mechanical performances.

Polynt Group VUP-5750BK-25R is generally used in electronic and electrical applications.

Virgin Super Modified PTFE is weldable and has lower deformation under load.

THERMLfilm® THT™ 9003 is a durable thermal transfer printable topcoat that allows for printability at 600 DPI for high-density barcodes like data matrix codes while maintaining consistent ANSI scannability. Permanent pressure-sensitive adhesive bonds well to standard PCBs, and the adhesive has a low outgassing rate.

E-SPHERES® SL150 is Medium Grade White Hollow Ceramic Microspheres.

APCM DA 4082 is 200°F cure modified epoxy prepreg system which can be prepreged on fiberglass fabric, woven Kevlar, or other woven fabrics. In addition to their low temperature cure capabilities, DA 4080 prepregs have excellent flow to allow for vacuum bag cure conditions. DA 4080 is a one sided pre-impregnated system yielding a single sided tack material. DA 4082 is the same system except that both sides of the fabric are coated yielding a double sided tack material. Both prepregs can be used for laminating and honeycomb sandwich construction.

Dicolloy™ EHSO3 is anionic, foams slowly, and has no cloud point. Over a wide pH range, DicolloyTM Alkoxy sulfonates have excellent salt stability, pH stability, and hydrolysis resistance. EHSO3 Dicolloy™ / sulfopropylated 2-ethylhexanol ethoxylate

Zymet CN-1736 is designed to enhance the drop test reliability of 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solder pastes and tacky fluxes.

Dongguan SUGO Plastics Technology B4120 FR has high mechanical strength, anti-static, static dissipative with good toughness and good dimensional stability.it is also conductive, EMI with good creep resistance and ROHS compliant, heat & cold resistance.

Dongguan SUGO Plastics Technology B3400D has high mechanical strength, anti-static, static dissipative with good toughness and good dimensional stability.it is also conductive, EMI with good creep resistance and ROHS compliant, heat & cold resistance.

HOZOLE is a high-performance duroplastic resin system.

NuSil™ CV2-2946 is a controlled volatility (NuSil™ CV) silicone materials silicone's ability to remain elastic at low temperatures and resistant to breakdown at high temperatures offer excellent utility in extraterrestrial environments where materials are repeatedly exposed to extreme temperatures. NuSil's Controlled Volatility (NuSil™ CV) and Ultra Low Outgassing TM (SNuSil™ CV) silicone products are used by leading space programs to provide the much-needed resilient protection they require against contamination and material degradation.Benefits of Silicone Materials for Space Broad Operating Temperature Compensation for CTE Mismatch Protection Against Atomic Oxygen Optically Clear Formulations Flight Legacy Comments: 0.6 W/m-K, Thin Bond Line.

Ultra-Illumina™ 3511 is a UV light curable conformal coating made entirely of solids that is used on PCB assembly. It does not clog valves and is intended for use in high volume spray systems. When fully cured, Incure 3511 forms a glossy, hard, and resilient protective coating with a thickness of up to 5mm that acts as a moisture barrier even at high altitudes. Because of the fluorescing properties, quick in-process and quality inspection of coating coverage is possible. Secondary heat-cure is used to cure shadowed areas under components. UL 746C compliant, rated indoor/outdoor to 120°C, and flame class 94V-0.

Atom Adhesives AA-DUCT 916 is an electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require high flexibility coupled with good electrical and mechanical properties.

Polynt Group HUP 23/30 RB-Color is generally used in cosmetics, electronic and electrical, foundries, peroxides applications.

APCM DA 4090 is modified epoxy pre-impregnated system which can cure at 250°F (121°C) for one hour. DA 4090 | DA 4092 can be supplied on any commercially available glass, Kevlar, or graphite fabric. DA 4090 is a one sided pre-impregnated fabric yielding a single sided tack material. DA 4092 is the same system where both sides of the fabric are pre-impregnated yielding a double sided tack material. Both prepreg systems can be used for laminating and honeycomb sandwich construction.

Polynt Group HUP 17/30 RB-Color is generally used in cosmetics, electronic and electrical, foundries, peroxides applications.

BAI YUN® Circuit Board Silicone Sealant Translucent Neutral Cure Silicone BAIYUN SKO342 Translucent Industrial Sealant used in electronic switch lighting and circuit board fixing and Sealing House Appliances.

NuSil™ R3-1075 is a rtv silicone conformal coating.