Fluon+™ PFA EA-2000

Identification & Functionality

Chemical Family

Fluoropolymers

Polymer Name

Perfluoroalkoxy Polymer (PFA)

Plastics & Elastomers Functions

Resin

Technologies

Plastics

Product Families

Plastics — Engineering & Specialty Polymers

High Performance Thermoplastics

Features & Benefits

Materials Features

Chemical Resistant,

Good Electrical Properties,

Heat Resistance,

Low Dielectric Constant,

Low Friction,

Non Stick,

Oil Resistant,

Water Resistant

Features of EA-2000

• Heat resistance to 260C and superior chemical resistance, equivalent to conventional PFA materials
• Adhesion to other polymers and metals without the use of surface treatment or a separate adhesive layer via a traditional melt-processable method.
• Excellent non-stick properties, low frictional properties, and water and oil repellency (high contact angle)
• Low dielectric constant (2.1) and low dissipation factor (0.001)

Applications & Uses

Markets

Adhesives & Sealants,

Automotive & Transportation,

Consumer Goods,

Electrical & Electronics,

Industrial,

Printing & Packaging

Applications

Consumer Goods — Appliances & Electronics

Automotive & Transportation — Automotive

Fuel Systems

Industrial — Chemical & Industrial Manufacturing

Equipment & Parts

Adhesives & Sealants — Packaging & Paper

Tape & Label Adhesives

Electrical & Electronics — Parts & Components

Printed Circuit Boards (PCBs)

Printing & Packaging — Tapes, Labels & Adhesives

Tapes & Labels

Compatible Polymers & Resins

Polyimides (PI)

Compatible Substrates & Surfaces

Copper,

Fibers & Fabrics,

Glass,

Metal

Plastics & Elastomers End Uses

Automotive Fuel Structural Components,

Conveyor Parts,

Hoses,

Interposer,

Printed Circuit Boards,

Tape,

Tubing

Plastics & Elastomers Processing Methods

Coextrusion

Assumed Applications of EA-2000

• Printed circuit boards (rigid or flexible)
• Heat-resistant insulating tape
• Heat-resistant laminated tubing
• Interposers
• Steel plate laminates
• Ideal for PCB materials

Properties

Typical Properties

	Value	Units	Test Method / Conditions
Coefficient of Water Absorption	max. 0.03	%	ASTM D570
Dielectric Constant (at 1GHz)	2.1	—	ASTM D150
Dielectric Dissipation Factor (at 1GHz)	max. 0.002	—	ASTM D150
Durometer Hardness	59	—	Shore D
Elongation (at Break)	460	%	ASTM D638
Flexural Modulus	640	MPa	ASTM D790
Izod Impact Strength (at 23ºC,Notched)	Non-Break	J/m	ASTM D256
Melting Point	300	°C	DSC
MFR	10 – 25	g/10 min	ASTM D3307 (327°C,49 N)
MIT Folding Endurance	8.0 x 10³	Cycles	ASTM D2176
Specific Gravity	2.1	—	ASTM D792
Specific Heat	1.05	kJ/(kg•K)	—
Strength (at Break)	36	MPa	ASTM D638
Volume Resistance	6.5 x 10¹⁷	Ω-cm	ASTM D257

Technical Details & Test Data

Example of Film Extrusion Conditions of EA-2000

An example of the processing conditions for a mono-layer film with EA-2000 is shown below.

Conditions	Extruder temperature						Roll temperature
	C1	C2	C3	C4	H	D	Nip roll temperature
EA-2000	300°C	320°C	340°C	340°C	340°C	340°C	180°C

 

Extruder: Ø30 mm single screw (L/D=24)
Die: T-die (450 mm in width)
Line speed: 10 m/min

 

Example of Molding Conditions of EA-2000/Copper Foil Laminate

An example of the processing conditions for copper foil laminate with EA-2000 is shown below.

• Film: EA-2000 (30 μm-t)
• Metal Laminate: Copper foil
• Laminate conditions: An adhesion sample (350 mm) is produced using a vacuum press.

• Peel strength measurement method: 90° peel test using 1 cm wide strips.

	Cu surface roughness		Peel strength (N/cm)
	Rz (μm)	Ra (μm)
EA-2000/General copper foil	7.2	1.45	13
EA-2000/Low-profile copper foil	3.0	0.25	11
EA-2000/Profile-free copper foil	1.2	0.19	12
EA-2000/Non-roughened copper foil	0.9	0.13	12

Example Molding Conditions of EA-2000/Glass Cloth

EA-2000/glass cloth substrate molding conditions

• Film: EA-2000 (35 μm-t)
• Copper foil: Electrolytic copper foil roughened surface Rz=1.2 μm (12 μmt)
• Glass cloth: 2116 type E-glass cloth
• Laminate conditions: A substrate sample (350 mm) will be produced with the same conditions using a vacuum press.

Material composition

Characteristics of EA-2000/glass cloth substrate

• Favorable relative dielectric constant and dielectric dissipation factor
• Excellent copper foil adhesion and copper plating coverage inside through -holes
• Favorable solder heat resistance with low linear expansion coefficient in the xy-plane

Technical information

The information and data stated in this material (and any information and data provided to customers) are based on actual data obtained from reliable sources and should not be considered as guaranteed values for matters not stated in this material. We hereby disclaim any warranties, whether express or implied, regarding this material. The user is responsible for complying with all relevant laws and regulations irrespective of whether stated in this material or not. The provision of this material does not grant a license to any patents, trademarks, or licenses for those products, or any licenses to other intellectual properties.

Storage & Handling

Handling Precautions

All Fluon+ grades should be stored in clean and dry conditions. No special pre-heating or conditioning is required.

As with most fluoropolymers, care is needed when heating EA-2000 pellets and local exhaust ventilation is required. Please refer
to our Safety data sheets (SDS) for guidance.

Thermal decomposition of this product will generate hydrogen fluoride, which is corrosive. Corrosion resistant materials are
required for prolonged contact with molten resin.

EA-2000 should be processed at a maximum temperature of 380C in order to preserve the adhesive functionality of the polymer