Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Product Type
- Technologies
- Product Families
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Stress free.
- Tack free.
- Electrically conductive.
- Epoxy film adhesive.
- Substrate and component.
- Reworkability.
- Mismatched CTE's
- Automated assemblies.
Applications & Uses
- Applications
- Application Area
- Application Procedures
- Remove film from protective paper
- Cut to desired size.
- Place on substrate and cure according to one of the recommended schedules.
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Electrical Resistivity (at 25°C, 1minute) | max. 5x10⁻⁴ | Ω-cm | — |
| Glass Transition Temperature | -25 | °C | — |
| Device Push Off Strength | 8.3 | N/mm² | — |
| Hardness | 82 | Shore A | — |
| Cured Density | 3.5 | g/cc | — |
| Thermal Conductivity | 6.4 | W/m-°C | — |
| Coefficeint of Linear Thermal Expansion | 110 | ppm/°C | — |
| Maximum Continuous Operation Temperature | 150 | °C | — |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time Pressure 80°C 8 hrs 5 - 10 psi 100°C 4 hrs 5 - 10 psi 125°C 2 hrs 5 - 10 psi 150°C 1 hr 5 - 10 psi The die or component can also be tacked on the substrate at 80°C or higher with 5 psi. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.
Packaging & Availability
- Product Availability
ESP8350 is available in sheet sizes or as custom preforms. Standard thicknesses are 0.006" and 0.008" Special thicknesses are available.
Storage & Handling
- Shelf Life
- 1 Year (at 0-5°C)
- Storage Information
Storage temperature: 0 - 5°C in sealed and/or protected package.