Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
Features & Benefits
- Labeling Claims
- Ready-to-Use Product Features
- Product Features
- High strength.
- Rapid curing.
- 100% solid.
- Insulating.
- Epoxy paste adhesive.
- Rapid to snap curing.
- Die-attach.
- Automated assembly.
- Product Features
- Snap curing.
- Solvent free, thixotropic.
- Thermally conductive epoxy.
- Max.20 ppm lonic impurities.
- Large area die attach.
- Power substrate and component attach.
Applications & Uses
- Applications
- Application Area
- Application Procedures
- Thaw for 30 minutes before opening jar or using syringes.
- Dispense adhesive onto clean substrate with a suitable pattern to assure full die coverage.
- Cure according to one of the recommended schedules.
- Product Availability
- Thaw for 30 minutes before opening jar.
- Dispense adhesive onto clean substrate.
- Cure according to one of the recommended schedules.
Properties
- Physical Form
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Electrical Resistivity | min. 1x10¹⁴ | Ω-cm | — |
| Thermal Conductivity | min. 1.2 | W/m-°C | — |
| Thermal Conductivity | 1.08 - 1.32 | W/m-°C | — |
| Die Shear Strength | min. 3200 | psi | — |
| Glass Transition Temperature | 60 | °C | — |
| Glass Transition Temperature | 54 - 66 | °C | — |
| Viscosity (at 5 rpm, Thixotropic Index=>3) | 38000 | cPs | — |
| Electrical Resistivity (at 150°C, 2minutes) | min. 1x10¹⁴ | Ω-cm | — |
| Dielectric Strength | min. 750 | Volts/mil | — |
| Lap Shear Strength | min. 10.3 | N/mm² | — |
| Device Push Off Strength | min. 22 | N/mm² | — |
| Hardness | 72 - 88 | Shore D | — |
| Cured Density | 1.71 - 2.09 | g/cc | — |
| Coefficeint of Linear Thermal Expansion | 34 - 46 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
| Pot Life (at 25°C) | 5 | Days | — |
| Average Viscosity (at 24°C, 5rpm, Spindle CP51) | 30400 - 45600 | cPs | Brookfield Viscometer DV-1 |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time 80°C 30 mins 100°C 15 mins 125°C 6 mins 150°C 3 mins Bond strength at 150°C for 2 hours is the same as 3 mins.
- Cure Schedules
Temperature Time 80°C 4 hrs 100°C 2 hrs 125°C 1 hr 150°C 30 mins
Packaging & Availability
- Product Availability
ME7635-RC is available in syringes for automatic needle dispense applications or in jars.
- Product Availability
ME7655-RC is available in syringes for automatic needle dispense applications or in jars.
Storage & Handling
- Shelf Life
- 1 Year (at -40°C), 1 Month (at 25°C)
- Storage Information
Storage temperature: -40°C, 25°C .
- Storage Information
Storage temperature: -40°C.