company tower banner
AI Technology Company Logo

AI Technology ME 7863

ME7863 is a one part, quartz filled cyanate ester die attach adhesive. It was designed for solder-sealed ceramic packages. It can withstand temperatures up to 300°C without thermal degradation. ME7863 has processing characteristics required in high speed automation. Its unique chemistry results in very low moisture absorption, high adhesive strength and low CTE.

Product Type: 1K (1 component) Adhesive, Epoxy Adhesive, Insulation Adhesive, Solvent free (100% Solids) Adhesive, Solventless & High Solids Coating, Thermal Adhesive

Application Area: Die/Chip Attach

Chemical Family: Epoxy & Epoxy Derivatives

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Labeling Claims
    Product Features
    • Solvent free.
    • Low moisture absorption.
    • Low lonic impurities.
    • High temperature curing.
    • Die attach.
    • High speed automated processing.
    • Hermetically sealed packages.

    Applications & Uses

    Application Area
    Application Procedures
    • Thaw to room temperature before opening container.
    • Dispense adhesive onto clean substrate with a suitable pattern to cure according to the recommended schedule, i.e. B-Stage followed by a cure schedule.
    Note

    The monomer contained in this product is subject to crystallization even at room temperature. If product is thawed and remains crystallized, simply place in 40°C environment for as long as needed to return product to the liquid state i.e. usually not more that 15- 20 minutes.

    Properties

    Physical Form
    Typical Properties
    ValueUnitsTest Method / Conditions
    Thermal Conductivitymin. 1.0W/m-°C
    Thermal Conductivitymin. 1W/m-°C
    Die Shear Strengthmin. 2500psi
    Glass Transition Temperature240°C
    Viscosity (at 5 rpm)65000cPs
    Dielectric Strengthmin. 750Volts/mil
    Lap Shear Strengthmin. 6.9N/mm²
    Device Push Off Strengthmin. 17.2N/mm²
    Hardness95Shore D
    Cured Density1.6g/cc
    Coefficeint of Linear Thermal Expansion20ppm/°C
    Maximum Continuous Operation Temperature250°C
    Average Viscosity (at 25°C, 5rpm, Spindle CP51)65000cPsBrookfield Viscometer DV-1

    Regulatory & Compliance

    Certifications & Compliance

    Technical Details & Test Data

    Cure Schedules
    Temperature Time
    125°C 2 hrs
    150°C 1 hr
    • Post cure if required.
    • Pot Life is 8 hrs at  25°C.

    Packaging & Availability

    Product Availability

    ME7863 is available in syringes for automatic dispense applications or in jars.

    Storage & Handling

    Shelf Life
    1 Year (at -40°C)
    Storage Information

    Storage temperature: -40°C.