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AI Technology RTK 7556

RTK7556 is a reworkable, boron nitride-filled, tacky epoxy film adhesive. It is designed for bonding component and substrate to a mismatched substrate or carrier. This B-staged conductive adhesive offers excellent reworkabilty at 80-150°C. RTK7556 has high thermal conductivity and the low Tg adhesive imposes minimum thermal stress on bonded parts during thermal cycling or shock testing.

Product Type: Insulation Adhesive

Application Area: Die/Chip Attach

    Knowde Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Product Features
    • Stress free.
    • High thermal conductivity.
    • Tacky epoxy film adhesive.
    • Substrate and component.
    • Die attach.
    • Heat sink attach.

    Applications & Uses

    Application Area
    Application Procedures
    • Keep product at room temperature for at least minutes before using.
    • Cut to desired size.Clean contact surfaces if needed.
    • Remove one side of the release liner by peeling up a corner of the release liner. Fold the release liner over, approaching a 180° angle.
    • Pull the release liner quickly, removing it with one stroke.
    • Apply to substrate, then remove other side of release liner and attach die or component.
    • Cure according to one of the recommended cure schedules.

    Properties

    Typical Properties
    ValueUnitsTest Method / Conditions
    Electrical Resistivitymin. 1x10¹⁴Ω-cm
    Thermal Conductivitymin. 3.0W/m-°C
    Thermal Conductivity3.06 - 3.74W/m-°C
    Die Shear Strengthmin. 1500psi
    Glass Transition Temperature-66 to -54°C
    Glass Transition Temperature-45°C
    Electrical Resistivity (at 150°C, 30minutes)min. 1x10¹⁴Ω-cm
    Dielectric Strength675 - 825Volts/mil
    Lap Shear Strengthmin. 3.5N/mm²
    Device Push Off Strengthmin. 6.9N/mm²
    Hardness73.8 - 90.2Shore A
    Cured Density1.08 - 1.32g/cc
    Coefficeint of Linear Thermal Expansion93.5 - 126.5ppm/°C
    Maximum Continuous Operation Temperaturemax. 150°C

    Regulatory & Compliance

    Certifications & Compliance

    Technical Details & Test Data

    Cure Schedules
    Temperature Time Pressure
    100°C 4 hrs 5 -10 psi
    125°C 2 hrs 5 -10 psi
    150°C 1 hr 5 -10 psi

    The die or component can also be tacked on the substrate at 125C or higher with 10 psi. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.

    Packaging & Availability

    Product Availability
    • RTK7556 is available in reels, sheets, or as custom preforms.
    • Standard thicknesses are 0.003" and 0.006".
    • Special thicknesses are available.
    • This material is a self-supporting, tacky epoxy film adhesive.

    Storage & Handling

    Shelf Life
    1 Year (at -40°C)
    Storage Information

    Storage temperature:0 - 5°C in sealed container.