Knowde Enhanced TDS
Identification & Functionality
- Product Type
- Technologies
Features & Benefits
- Ready-to-Use Product Features
- Product Features
- Thermally conductivity.
- Instant melt-bondable.
- Dry film adhesive.
- Ambient storage.
- High volume, automated assemblies.
- Heat-sink.
- Component attach.
- Substrate attach.
Applications & Uses
- Applications
- Application Area
- Application Procedures
- Cut or pre-cut to desired size.
- Remove film from protective paper.
- Place between substrate and part.
- Apply pressure and reflow material.
Properties
- Typical Properties
| Value | Units | Test Method / Conditions | |
| Thermal Conductivity | min. 2.0 | W/m-°C | — |
| Thermal Conductivity | 1.445 - 1.955 | W/m-°C | — |
| Die Shear Strength | min. 1500 | psi | — |
| Glass Transition Temperature | -40 | °C | — |
| Glass Transition Temperature | -60.5 to -49.5 | °C | — |
| Electrical Resistivity (at 150°C, 30minutes) | min. 1x10¹⁴ | Ω-cm | — |
| Dielectric Strength | min. 750 | Volts/mil | — |
| Device Push Off Strength | min. 3.45 | N/mm² | — |
| Hardness | 72 - 88 | Shore A | — |
| Cured Density | 2.25 - 2.75 | g/cc | — |
| Coefficeint of Linear Thermal Expansion | 68 - 92 | ppm/°C | — |
| Maximum Continuous Operation Temperature | max. 150 | °C | — |
Regulatory & Compliance
- Certifications & Compliance
Technical Details & Test Data
- Cure Schedules
Temperature Time 190°C 2 hrs
Packaging & Availability
- Product Availability
TP7155 is available in sheet sizes or as custom preforms. Standard thicknesses are 0.003" and 0.006". Special thicknesses are available.
Storage & Handling
- Shelf Life
- 1 Year (at 25°C)
- Storage Information
Storage temperature: 25°C