- Applications:Appliances & Electronics, Semiconductor Manufacturing, Printed Circuit Boards (PCBs)
- Product Families:Other Adhesives & Sealants, Adhesives & Sealants
ESP7666-FOW is the modified boron nitride filled thermally conductive version of the high flow DAF of ESP7660-FOW. It is a high-bond strength epoxy film adhesive tor high flow when melted to easily flow over Wire-bond in stack chip die attach application. This new generation wafer level die- attach film is flexible before curing. This ESP7660-FOW is mounted onto the back of the wafer at 80-100°C, which is then diced into predetermined sizes using standard dicing tape. Depending on the different dicing tape used and with suitable releasing action such as UV or heat, the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-FOW has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.