Search
the marketplace
through 230,000 Chemicals and Raw Ingredients
through 8,000+ Supplier owned storefronts
company tower banner
AI Technology Company Logo

AI Technology ESP 7666-FOW

ESP7666-FOW is the modified boron nitride filled thermally conductive version of the high flow DAF of ESP7660-FOW. It is a high-bond strength epoxy film adhesive tor high flow when melted to easily flow over Wire-bond in stack chip die attach application. This new generation wafer level die- attach film is flexible before curing. This ESP7660-FOW is mounted onto the back of the wafer at 80-100°C, which is then diced into predetermined sizes using standard dicing tape. Depending on the different dicing tape used and with suitable releasing action such as UV or heat, the diced chip is picked and placed directly onto a lead frame or substrate. It is designed for bonding component and substrate to substrate and carrier with matched thermal coefficients of expansion. ESP7660-FOW has good thermal stability. The dry, tack-free handling of the film makes it suitable for an automated assembly.

Product Type: Epoxy Adhesive, Underfill Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Technical Data Sheet
  • TypeDocument Name
View All Documents

Knowde Enhanced TDS

Identification & Functionality

Product Type

Epoxy Adhesive,

Underfill Adhesive

Technologies

Ready-to-Use Products

Product Families

Ready-to-Use Products — Adhesives & Sealants

Other Adhesives & Sealants

Features & Benefits

Ready-to-Use Product Features

Electrically Insulating,

Excellent Melt Flow,

Flexible,

Good Bonding Strength,

Good Thermal Stability,

High Flow,

High Glass Transition Temperature,

Low Dielectric Constant,

Moisture Barrier,

Tack-free,

Thermally Conductive

Product Features
  • High flow DAF adhesive.
  • Electrically insulating.
  • High moisture resistance.
  • Thermally conductive.
  • Flow ove wire die attach.
  • High volume, automated assemblies.
  • Outstanding dielectric layer.
  • Low dielectric constant (approx. 3.6) and loss (max. 0.003).

Applications & Uses

Markets

Consumer Goods,

Electrical & Electronics

Applications

Consumer Goods — Appliances & Electronics

Electrical & Electronics — Packaging & Assembly

Adhesives & Sealants

Electrical & Electronics — Parts & Components

Printed Circuit Boards (PCBs),

Semiconductor Manufacturing

Application Area

Die/Chip Attach

Cure Method

Heat Cure

Application Procedures
  • Keep product in aluminum polylaminate protective bag when not in use.
  • Before using, remove protective bleached paper liner from film. Place wafer onto adhesive side DDAF.
  • Laminate (low heat of 80-100°C) wafer onto adhesive until good wetting is achieved. Dice wafer as usual.
  • Once dicing is complete, pass wafer under UV light or heat (depending on dicing tape) so that die can be released for pick and place operation. Cure according to one of the recommended schedules.

Properties

Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 60minutes)min. 1x10¹⁴Ω-cm-
Dielectric Strengthmin. 750Volts/mil-
Glass Transition Temperature175°C-
Device Push Off Strengthmin. 34.2N/mm²-
Hardness85Shore D-
Cured Density2.1g/cc-
Thermal Conductivity3.6W/m-°C-
Coefficeint of Linear Thermal Expansion55ppm/°C-
Maximum Continuous Operation Temperature150°C-

Regulatory & Compliance

Certifications & Compliance

ISO 9001

Technical Details & Test Data

Cure Schedules
Temperature Time Pressure
125°C 90 mins 5-15 psi
150°C 30 mins 5-15 psi

The die or component can also be tacked on the substrate at 120-150°C with 3 psi. When a filet around the edge of the die or component is observed, the pressure can be released for the rest of the bonding cycle.

Packaging & Availability

Packaging Type

Rolls

Product Availability

ESP7666-FOW is available in sheet sizes or rolls. Standard thicknesses of ESP7660-FOW are 25 and 50 micron. Special thicknesses are available.

Storage & Handling

Shelf Life
1 Year
Storage Information

Storage temperature: 25°C in sealed package.