- Polymer Name:Epoxy Resins & Compounds
- End Uses:Power Transformers, Capacitors, Coils, Relay Bases, Encapsulant, Diodes
- Volume Resistivity:95000000000000.0 - 95000000000000.0 Ohm-m
- Flexural Strength:118.58 - 118.58 MPa
Farboset® 1160 is a granular, mineral-filled, anhydride epoxy molding compound designed for the encapsulation of various electrical and electronic components. It offers fast cure rates, long flow, and excellent thermal shock resistance. This compound is suitable for applications involving the encapsulation of coils, transformers, capacitors, diodes, relays, and other components that require good hot rigidity during the molding process.