Knowde Enhanced TDS
Identification & Functionality
- Chemical Family
- Technologies
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Features & Benefits
- Ready-to-Use Product Features
Applications & Uses
- Markets
- Applications
- Application Area
- Cure Method
- Application Details
Processing
Dispensing
Material can be processed from cartridge or from hobbock by automated needle dispensing or manual dispensing at low pressure. Appropriate dispensing equipment and gasketing is recommended for optimum processing as well as protection of the equipment since product contains abrasive fillers. Accurate dispensing is possible with piston pump technology at high dispensing performance. Superior dispensing performance is also possible with endless piston pump technology.
Surface preparation
- All surfaces of parts, tools and processing equipment must be clean and free of contaminants that will inhibit the cure of SEMICOSIL® 9981 TC. Examples of inhibiting contaminants are sulfur containing materials, plasticizers, urethanes, amine containing materials and organometallic compounds – especially organotin compounds.
- If a substrate’s ability to inhibit cure is unknown, a smallscale test should be run to determine compatibility. For oven curing it is recommended to not use ovens applied for the cure of epoxy or polyurethane based encapsulants in order to avoid potential crosscontamination with potentially inhibiting hardeners.
Bonding
- SEMICOSIL 9981 TC is suited for manual bonding at low bonding forces as well as automate vacuum bonding.
- Adhesion is generated and facilitated on various substrate like metals, ceramics and plastics FR4 by curing at elevated temperatures.
- We recommend running preliminary tests to optimize conditions for the particular application.
Temperature Curing time, thickness 1 cm
150 °C 2 h - Applications
- Automotive Electronics
- Power Electronics
- Silanes for chemical vapor deposition (CVD) and spin-on dielectrics (SOD)
- Thermal Interface Management
Properties
- Physical Form
- Cured Properties
- Uncured Properties
- Properties
- One-component
- Almost constant properties between -50 °C and +180 °C
- Cure at moderate temperatue (150 °C / 2 h)
- Thermal conductivity is 10 W/mK
- Electrical conductive
- Low bond line thickness (10 μm)
- Emphasized thermal stability in cured state
- Flexibility in application method
- Superior despensing performance, screen printability
- Suitable for automated bonding or vacuums bonding processes
- Note
Values from pressed sheet (165 °C / 15 min) and Post cure (150 °C / 2 hrs / Dry-oven) for cured properties.
| Value | Units | Test Method / Conditions | |
| Curing Time (thickness 1cm, at 150°C) | 2 | hours | — |
| Density (in water, at 25°C) | 5.6 | g/cm³ | DIN 53479 A / ISO 2781 |
| Shore Hardness A | 80 | — | DIN 53 505 / ISO 868 |
| Thermal Conductivity (at 4mm) | 10 | W/m.K | TPS-2500 S / ISO 22007-2 |
| Volume Resistivity | 9.00 x 10⁻⁴ | Ohm-cm | Resistance Meter |
| Value | Units | Test Method / Conditions | |
| Compression Thickness (Uncured material, Push gage, 5 - 20 N/cm²) | max. 10 | µm | — |
| Pot Life | min. 8 | hours | — |
| Viscosity (at 25°C, Shear rate 0.5 s⁻¹) | 300 | Pa.s | DIN EN ISO 3219 |
| Viscosity (at 25°C, Shear rate 10 s⁻¹) | 100 | Pa.s | DIN EN ISO 3219 |
Regulatory & Compliance
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Packaging & Availability
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Storage & Handling
- Storage Information
The 1-part silicone SEMICOSIL 9981 TC's the storage temperature is -20 °C to -40 °C. Prior to application slow warming to room temperature is recommended. It is recommended to process material at room temperature (23 °C) within a time frame of 8 hours.
Shelf Life
SEMICOSIL® 9981 TC has the shelf life is 6 months when stored at under -20 °C in the originally sealed container. Before application container should be slowly warmed to room temperature.