Products

Yincae® SMT 256 is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Yincae® SMT 266 is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Yincae® SMT 256B is designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.

Yincae® SMT 256T is a designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.

Yincae® SMT 256TB is a TCB adhesive designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.

Yincae® BP 256 is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Yincae® SMT 256L is a dip adhesive designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.

Yincae® SMT 138E is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Yincae® TCA 136 is a thermal conductive adhesive. It is a highly conductive adhesive with excellent adhesion strength to copper, aluminum, steel, ceramic, glass and most plastics.

Yincae® TEC 135 is a thermally conductive and anisotropic electrical adhesive.

Yincae® TGP 88A is a reactive thermal grease product that forms a very thin BLT eliminating microbubbles at the rough interface when applied. In service time the products cure to form a thermal gel or thermal pad with the performance of a thermal phase change material.

Yincae® TGP 100 is a reactive thermal grease product that forms a very thin BLT eliminating microbubbles at the rough interface when applied. In service time the products cure to form a thermal gel or thermal pad with the performance of a thermal phase change material.