Search
the marketplace
through 230,000 Chemicals and Raw Ingredients
through 8,000+ Supplier owned storefronts
Segments
Nutraceuticals & Supplements
undefined
View All
HI&I Cleaning & Formulating
Chemical Manufacturing
Pharmaceuticals
Pulp & Paper
Oil & Gas
Agriculture & Feed
Case & Construction
Formulated Adhesives & Coatings
Food & Nutrition
Personal Care
Mining
Cosmetic Ingredients
Food Ingredients
Most popular categories
CASE Ingredients
Plastics
Pharmaceuticals & Nutraceuticals
Knowde for Suppliers
Knowde
Electrical & Electronics
Packaging & Assembly
Potting Compounds
Products in Potting Compounds
506 Products found in Potting Compounds
Filters
Suppliers
Product Families
Functions
Chemical Family
Features
Products
Brands
Suppliers
Formulations
Documents
Relevance
Cosmic Plastics
Cosmic Epoxy E4920AC
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920AC is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it suitable for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Cosmic Epoxy EH21
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Compression Molding, Transfer Molding
End Uses:
Encapsulant, Inductor, Core Rods
Cosmic Epoxy EH21 is an iron-filled epoxy molding compound provided in a black granular form. It is well-suited for applications requiring EMI (Electromagnetic Interference) and RFI (Radio-Frequency Interference) shielding. This material can be molded through compression or transfer molding processes to create core rods or to encapsulate surface mount and axial leaded inductors. It offers the advantage of simplifying the molding process by eliminating the need for labor-intensive over/under molding.
Cosmic Plastics
Cosmic Epoxy EH61
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH61 is an iron-filled epoxy molding compound provided in a black granular form. It is designed for EMI/RFI shielding applications and can be utilized in compression or transfer molding processes to manufacture core rods or encapsulate surface mount and axial leaded inductors. This single molded compound streamlines the manufacturing process, eliminating the labor-intensive over/under molding steps.
Cosmic Plastics
Cosmic Epoxy E4920FC
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Diodes, Inductor, Rectifier, Encapsulant, Capacitors
Volume Resistivity:
55000000000000.0 - 55000000000000.0 Ohm-m
Flexural Strength:
127.465 - 127.465 MPa
Cosmic Epoxy E4920FC is a mineral-filled epoxy molding compound available either in granular form or preformed in a variety of sizes and weights. It offers excellent moisture resistance, thermal cycling stability, and outstanding moldability. Parts molded from this material also resist fungus growth and are designed for the encapsulation of passive devices such as capacitors, inductors, diodes, and rectifiers.
Cosmic Plastics
Farboset® 1708
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Coils
Farboset® 1708 is a specialized epoxy molding compound that combines mineral and short glass fillers, making it well-suited for the encapsulation of coils and other electrical and electronic components. It offers excellent moldability, which is important for achieving precise shapes during the encapsulation process. One of its standout features is its extreme resistance to thermal shock, meaning it can withstand rapid changes in temperature without cracking or degrading.
Cosmic Plastics
Cosmic Epoxy EH71
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH71 is an iron-filled epoxy molding compound available in a black granular form. It is well-suited for EMI/RFI shielding applications and can be used in either compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to streamline the manufacturing process by eliminating the labor-intensive over/under molding steps.
Cosmic Plastics
Farboset® 1180
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Farboset® 1180 is a granular, glass-filled, general-purpose anhydride epoxy molding compound. It is formulated for encapsulation applications where excellent thermal shock resistance and physical strength are required. This compound helps protect electronic and electrical components by providing thermal shock resistance and maintaining their integrity under challenging conditions.
Cosmic Plastics
Farboset® 2720
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Resistor, Capacitors, Resistor Network, Encapsulant
Farboset® 2720 is a mineral-filled epoxy molding compound known for its rapid curing, exceptional moldability, and remarkable resistance to thermal shock and moisture. This compound is tailored to offer enhanced protection against moisture ingress and boasts a high glass transition temperature, making it an ideal choice for ensuring reliability in performance. Its primary purpose is to encapsulate a wide variety of electronic devices, including tantalum and ceramic capacitors, resistors, and resistor networks, providing them with a robust shield against environmental factors and mechanical stress.
Cosmic Plastics
Cosmic Epoxy EH40
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH40 is an iron-filled epoxy molding compound available in a black granular form. It is suitable for EMI/RFI shielding applications and can be used for compression or transfer molding to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the need for labor-intensive over/under molding.
Cosmic Plastics
Cosmic Epoxy EH51
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH51 is an iron-filled epoxy molding compound available in a black granular form. It is designed for EMI/RFI shielding applications and can be used in compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the labor-intensive over/under molding.
Cosmic Plastics
Cosmic Epoxy E4920D
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Diodes, Inductor, Rectifier, Encapsulant, Capacitors
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4920D is a mineral-filled epoxy molding compound that is available in either granular form or as preformed shapes in various sizes and weights. This compound is commonly used for molding applications and offers good versatility in manufacturing processes.
Cosmic Plastics
Cosmic Epoxy E4920VS
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920VS is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Farboset® 1115
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Injection Molding, Transfer Molding
End Uses:
Coils, Encapsulant, Power Transformers, Bushings, Switches
Volume Resistivity:
50000000000000.0 - 50000000000000.0 Ohm-m
Flexural Strength:
123.97 - 123.97 MPa
Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.
Cosmic Plastics
Farboset® 5000
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Power Transformers, Coils, Switches, Encapsulant, Solenoid Coil
Farboset® 5000 is a novolac epoxy molding compound that contains mineral and glass fillers. It is specifically designed for applications where fast curing, high hot strength, and low abrasion resistance are essential. This compound is well-suited for the encapsulation of solenoid coils and similar applications where electrical and thermal performance are critical.
Cosmic Plastics
DAP K43/6260
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Housings, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1800.0 - 1800.0 kg/m³
Tensile Strength:
31.005000000000003 - 41.34 MPa
DAP K43/6260 is a versatile diallyl iso-phthalate molding compound that is filled with minerals and supplied in granular form. This compound is designed for ease of use and versatility. It pours easily, can be preformed, and molds readily using standard compression, transfer, or injection equipment. What sets K43/6260 apart is its exceptional heat resistance, high arc resistance, and ease of molding around inserts. These features make it an ideal choice for applications that demand high-temperature performance and electrical insulation properties, while still allowing for straightforward processing and customization.
Cosmic Plastics
Cosmic Epoxy E4940S
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Optical Fiber Connector, Resistor Network
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4940S is a mineral-filled epoxy molding compound supplied in granular form. It offers excellent dimensional stability, improved thermal cycling properties, and exceptional moisture resistance. This product is specifically designed for high-volume encapsulation of resistor networks and fiber-optic connectors that demand high quality, reliability, and excellent moldability.
Cosmic Plastics
Farboset® 1190
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Coils, Switches, Encapsulant, Power Transformers
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
137.788 - 137.788 MPa
Farboset® 1190 is a fast-curing epoxy molding compound that is mineral and glass-filled, and it contains improved strength properties. It is specially designed for encapsulating a variety of electrical and electronic components, such as coils, transformers, switches, and more. Farboset® 1190 is known for its excellent thermal shock resistance and superior resistance to cracking, making it a reliable choice for these applications.
Cosmic Plastics
Cosmic Epoxy E4920H
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920H is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, provided as granules, preforms, or powder, and is offered in various colors. This product features a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
EpoxySet Inc.
EpoxySet Inc. EC-1012MFR-HT
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1012MFR-HT is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
EpoxySet Inc.
URACAST™ UXP-052107-1
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UXP-052107-1 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release.
EpoxySet Inc.
EPOXICAST™ 1006M-4
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1006M-4 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.
EpoxySet Inc.
EPOXICAST™ EC-1850FT/EH-10E
Ready to Use Product Type:
Potting Compound, Encapsulant
Application Areas:
Oscillators, Power Transformers, Amplifiers
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1850FT with EH-10E Hardener is a very low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.
EpoxySet Inc.
EpoxySet Inc. EC-1012M/EH-20M
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
EpoxySet Inc.
EPOXICAST™ EC-1015
Ready to Use Product Type:
Potting Compound, Encapsulant
Application Areas:
Power Transformers, Oscillators, Semiconductors, Amplifiers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.
EpoxySet Inc.
URACAST™ UC-2521
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2521 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
EPOXICAST™ EC-1006
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.
EpoxySet Inc.
EPOXIBOND™ EB-430-1HT
Chemical Family:
Epoxy & Epoxy Derivatives
Ready to Use Product Type:
Encapsulant
Application Areas:
Power Transformers, Semiconductors, Integrated Circuits, Electrical Components
EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.
EpoxySet Inc.
URACAST™ UC-2350
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2350 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
URACAST™ UC-2356
Ready to Use Product Type:
2K (2 component) Adhesive, Potting Compound, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2356 is a two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows for easy flow and air release and excellent hydrolytic stability. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
URACAST™ UC-2524
Ready to Use Product Type:
2K (2 component) Adhesive, Encapsulant
Application Areas:
Relays, Coils, Printed Circuit Boards, Rectifiers, TV Sets, Amplifiers
Chemical Family:
Urethanes
UC-2524 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
EpoxySet Inc.
EpoxySet Inc. UB-50
Ready to Use Product Type:
Encapsulant, Potting Compound, 2K (2 component) Adhesive
Compatible Substrates & Surfaces:
Metal, Plastics, Ceramic
Chemical Family:
Urethanes
UB-50 is a clear, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent bond to metals, ceramics, and many plastics used in medical industry such as acrylic, polycarbonate, PVC etc. They also have excellent water resistance, and are exceptionally resistant to thermal shock. They can be used as an adhesive or for potting, casting and encapsulating applications.
EpoxySet Inc.
EPOXICAST™ EC-1009
Ready to Use Product Type:
Encapsulant, Potting Compound
Application Areas:
Capacitor Bushings, Power Transformers, Integrated Circuits
Chemical Family:
Epoxy & Epoxy Derivatives
EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
Creative Materials Inc.
Creative Materials 108-50
Ready to Use Product Type:
Conductive Adhesive, 1K (1 component) Adhesive, Potting Compound, Epoxy Adhesive
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
108-50 is a one component, thermally conductive, low stress, low shrink potting compound and adhesive. 108-50 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring Class "F" service temperature rating. 108-50 can also be used as an adhesive for bonding stress sensitive substrates.Features Low stress, moderate thermally conductive adhesive/potting compound
Creative Materials Inc.
Creative Materials 109-12
Ready to Use Product Type:
Conductive Adhesive, 1K (1 component) Adhesive, Potting Compound, Epoxy Adhesive
Application Method:
Injection
Chemical Family:
Epoxy & Epoxy Derivatives
109-12 is a one component, highly thermally conductive, low stress, low shrink potting compound and adhesive. 109-12 features exceptional resistance to thermal cycling. Recommended applications include potting of dissimilar materials requiring class "F+" service temperature rating. 109-12 is a more thermally conductive version of 108-50.Features Low stress High thermally conductive adhesive/potting compound
Creative Materials Inc.
Creative Materials 102-12A/B-187
Ready to Use Product Type:
Epoxy Sealant, Potting Compound, 2K (2 component) Sealant
Cure Method:
Air Dry
Chemical Family:
Epoxy & Epoxy Derivatives
102-12/B-187 is a black, two component, thermally conductive epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12/B-187 exhibits excellent thermal shock resistance and is especially suited to protecting sensitive electronic devices from a range of operating conditions including moisture, vibration, and temperature variation. Other useful applications include, but are not limited to, potting relays, electronic controls, sensors, and inverters and sealing of electronic component housings. Using B-187 allows for faster curing compared to B119-44.FeaturesSame as above, but extended pot life; better resistance to thermal cracking.
Creative Materials Inc.
Creative Materials 102-12A/B
Ready to Use Product Type:
Epoxy Sealant, Potting Compound, 2K (2 component) Sealant
Cure Method:
Air Dry
Chemical Family:
Epoxy & Epoxy Derivatives
102-12 is a black, two component thermally conductive epoxy potting and encapsulating compound. Product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole free surface. 102-12 is an improved, crack-resistant version of F947. Use with standard Part B for room temperature cure.FeaturesThermal cycle resistantBlack, epoxy compound.Room temperature cureImproved crack resistanceHigh thermal conductivity
Show
36
of 506 results
Go to page
1
2
3
4
5
6
7
8
9
10