Products in Plastics: Transfer Molding

AGC Chemicals Americas, Inc. Fluon® PFA P-66P is a melt-processible copolymer of tetrafluoroethylene and a perfluorinated vinyl ether. It has chemical, electrical, and thermal properties that are similar to polytetrafluoroethylene (PTFE), but can be processed using conventional extrusion, injection molding, blow molding, and transfer molding techniques. This versatile material can withstand a wide range of temperatures (-200°C to 260°C) and is available in the form of 1/8 inch pellets. It is commonly used for extrusion, transfer, compression, and injection molding, and offers the best resistance to stress cracking among the PFA materials.

AGC Chemicals Americas, Inc. Fluon+™ ETFE AH-700C is a compound designed for use in automotive fuel hoses. This functionalized polymer is ideal for hose constructions that require chemical resistance, permeation resistance, and unsurpassed protection against static buildup. AH-700C balances performance and economics. It is supplied in cylindrical pellet form, with pellets measuring approximately 0.080 inches in diameter and 0.125 inches in length.

AGC Chemicals Americas, Inc. Fluon+™ ETFE AH-800C is a compound designed for use in automotive fuel hose. This product is ideal for hose constructions which require chemical resistance, permeation resistance, and unsurpassed protection against static build-up. AH-800C has a higher upper-end temperature rating (approaching 200°C) and improved resistance to stress cracks at elevated temperatures. These products are supplied in cylindrical pellet form. These pellets are approximately 0.080 inches in diameter x 0.125 inches long.

AGC Chemicals Americas, Inc. Fluon+™ LM-ETFE AH-3000 is a semiconductive modified copolymer of ethylene and tetrafluoroethylene used in applications where strong adhesion to polyamide polymers, especially nylon 12, is required. It also exhibits high permeation resistance to many fluids and gasses, especially automotive fuels. It is processed using conventional melt extrusion methods and is available as a 1/8” pellet.

AGC Chemicals Americas, Inc. Fluon+™ LM-ETFE AH-3000L is a semiconductive modified copolymer of ethylene and tetrafluoroethylene used in applications where superior stress-cracking properties and strong adhesion to polyamide polymers, especially nylon 12, are required. It also exhibits high permeation resistance to many fluids and gasses, especially automotive fuels. It is processed using conventional melt extrusion methods and is available as a 1/8” pellet.

AGC Chemicals Americas, Inc. Fluon+™ LM-ETFE AH-2000 is a modified copolymer of ethylene and tetrafluoroethylene used in applications where strong adhesion to polyamide polymers, especially nylon 12, is required. This product also exhibits high permeation resistance to many fluids and gasses, especially automotive fuels. It is processed using conventional melt extrusion methods and is available as a 1/8” pellet.

AGC Chemicals Americas, Inc. Fluon+™ Non-Conductive LM-ETFE AH-600 is a compound designed for use in automotive fuel hose. This product is ideal for hose constructions which require chemical resistance, permeation resistance, and an unsurpassed bond to polyamide materials. These products are supplied in cylindrical pellet form. These pellets are approximately 0.080 inches in diameter x 0.125 inches long. It offers a lower melting compound that results in a wider process window and better compatibility with some polyamide nylons for co-extrusion.

AGC Chemicals Americas, Inc. Fluon+™ LM-ETFE AH-600C is a compound designed for use in automotive fuel hose. This product is ideal for hose constructions which require chemical resistance, permeation resistance, and unsurpassed protection against static build-up. AH-600C offers a lower melting compound that results in a wider process window and better compatibility with some polyamide nylons for co-extrusion. These products are supplied in cylindrical pellet form. These pellets are approximately 0.080 inches in diameter x 0.125 inches long.

AGC Chemicals Americas, Inc. Fluon+™ Non-Conductive ETFE AH-700 is a compound designed for use in automotive fuel hose. This product is ideal for hose constructions which require chemical resistance, permeation resistance, and an unsurpassed bond to polyamide materials. Non-Conductive AH-700 balances performance and economics. These products are supplied in cylindrical pellet form. These pellets are approximately 0.080 inches in diameter x 0.125 inches long.

AGC Chemicals Americas, Inc. Fluon+™ LM-ETFE AH-2100 is a modified copolymer of ethylene and tetrafluoroethylene used in applications where strong adhesion to polyamide polymers, especially nylon 12, is required. It also exhibits high permeation resistance to many fluids and gasses, especially automotive fuels. It is processed using conventional melt extrusion methods and is available as a 1/8” pellet.

AGC Chemicals Americas, Inc. Fluon+™ Non-Conductive ETFE AH-800 is a compound designed for use in automotive fuel hose. This product is ideal for hose constructions which require chemical resistance, permeation resistance, and an unsurpassed bond to polyamide materials. AH-800 has a higher upper-end temperature rating (approaching 200°C) and improved resistance to stress cracks at elevated temperatures. These products are supplied in cylindrical pellet form. These pellets are approximately 0.080 inches in diameter x 0.125 inches long.

Cosmic Alkyd 3D36 is a specialized alkyd molding compound that incorporates long glass fibers for enhanced impact resistance and flame retardant properties. Supplied in flake form, it is designed for ease of use and versatility in molding applications. This compound molds readily using standard compression or transfer equipment, and it maintains its performance for up to one year when stored at temperatures of 100°C or below. Its unique blend of properties makes it suitable for applications that require both impact resistance and flame retardancy.

DAP D69/6130 is a versatile diallyl ortho-phthalate molding compound with the advantage of being long-glass fiber filled. Supplied in flake form, this compound is convenient to work with. It can be easily molded using compression or transfer equipment and can be preformed for improved handling. Notably, it maintains its performance even when stored at room temperature for up to one year. This makes it a reliable choice for a wide range of applications where long-term performance and ease of use are essential.

Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.

DAP K77/6220F is a high-quality diallyl iso-phthalate molding compound that combines short glass fibers and flame retardant properties. Supplied in granular form, it is designed for ease of use in molding applications. This compound has excellent flow characteristics, making it easy to pour and mold in standard compression, transfer, or injection equipment. Its flame retardant properties make it suitable for applications where fire resistance is a critical factor, such as in the production of components for fire safety equipment or other high-temperature environments.

Cosmic Epoxy CP7318 is a long-glass-reinforced epoxy molding compound supplied in flake form. It can be compressed or transfer-moulded and exhibits high physical strength. This material has a shelf life of 12 months when stored at 20°C or lower. It serves as an ideal replacement for numerous aircraft and heavy metal parts.

DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.

Cosmic Epoxy CP7311 is a long-glass reinforced epoxy molding compound that comes in a flake form. It is designed to be an ideal replacement for various aircraft and heavy metal parts, providing a durable and high-strength material suitable for demanding applications in these industries.

Cosmic Epoxy EH71 is an iron-filled epoxy molding compound available in a black granular form. It is well-suited for EMI/RFI shielding applications and can be used in either compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to streamline the manufacturing process by eliminating the labor-intensive over/under molding steps.

Cosmic Epoxy CP7314 is a long-glass reinforced epoxy molding compound provided in flake form. This material is well-suited for serving as a replacement for a wide range of aircraft and heavy metal parts, offering enhanced durability and strength for demanding applications in these industries.

Cosmic Alkyd 3D94 is a mineral-filled polyester molding compound that is available in sheet form. This compound is designed for ease of use in molding applications and can be readily molded using standard compression or transfer equipment. It offers good moldability, making it suitable for a range of applications where a combination of mechanical strength and cost-effectiveness is desired. When stored at temperatures of 50°C or below, it has a shelf life of six months, providing flexibility in manufacturing and storage.

DAP ID-50 is a general-purpose diallyl ortho-phthalate molding compound filled with Dacron. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

Cosmic Epoxy EH40 is an iron-filled epoxy molding compound available in a black granular form. It is suitable for EMI/RFI shielding applications and can be used for compression or transfer molding to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the need for labor-intensive over/under molding.

Farboset® 1115 is a granular, mineral-filled, anhydride epoxy molding compound with fast cure rates and excellent hot strength. It is specially designed for encapsulating various electrical and electronic components, including coils, transformers, bushings, switches, and more. The material offers good hot rigidity during the molding process and is commonly used in injection and transfer molding applications.

DAP D44/6160 is a mineral-filled, special-purpose diallyl ortho-phthalate molding compound supplied in a free-flowing granular form. It can be easily molded using compression, transfer, or injection equipment and can be readily preformed. It surpasses all mineral compounds available today in terms of mechanical and electrical properties. It boasts extremely low water absorption, high dielectric strength, and a low dissipation factor, along with high tensile strength, exceptional arc resistance, and excellent resistance to high temperatures.

Cosmic Epoxy EH61 is an iron-filled epoxy molding compound provided in a black granular form. It is designed for EMI/RFI shielding applications and can be utilized in compression or transfer molding processes to manufacture core rods or encapsulate surface mount and axial leaded inductors. This single molded compound streamlines the manufacturing process, eliminating the labor-intensive over/under molding steps.

Cosmic Epoxy EH21 is an iron-filled epoxy molding compound provided in a black granular form. It is well-suited for applications requiring EMI (Electromagnetic Interference) and RFI (Radio-Frequency Interference) shielding. This material can be molded through compression or transfer molding processes to create core rods or to encapsulate surface mount and axial leaded inductors. It offers the advantage of simplifying the molding process by eliminating the need for labor-intensive over/under molding.

Cosmic Epoxy EH51 is an iron-filled epoxy molding compound available in a black granular form. It is designed for EMI/RFI shielding applications and can be used in compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the labor-intensive over/under molding.

DAP K31/6220 is a versatile diallyl iso-phthalate molding compound, filled with short glass fibers and supplied in granular form. This compound offers excellent heat resistance and is suitable for a wide range of applications. It is easy to work with, pouring easily and allowing for preforming. Additionally, it molds readily using standard compression, transfer, or injection equipment. One notable feature of K31/6220 is its FDA approval for direct food contact use, making it a reliable choice for applications in the food industry where heat resistance and safety standards are essential.

DAP K66/6230F is a versatile diallyl iso-phthalate molding compound that incorporates long glass fibers for enhanced strength and flame retardant properties. Supplied in flake form, it is designed for ease of use in molding applications. This compound can be readily preformed and molds easily using standard compression or transfer equipment, making it a flexible choice for various applications. Notably, it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.

Cosmic Epoxy C102 is a copper-filled molding compound available in a very fine granular form. It is suitable for various molding processes, including injection molding, compression molding, and transfer molding. This material is designed for fabricating parts that demand high strength and excellent electrical conductivity.

Cosmic Epoxy EH31 is an iron-filled epoxy molding compound available in a granular form with a black color. This material is designed for EMI/RFI shielding applications. It can be used for compression or transfer molding to create core rods and encapsulate surface mount and axial leaded inductors. Using this single molded compound can streamline the manufacturing process and eliminate the need for labor-intensive over/under molding.

DAP K61/6230 is a general-purpose diallyl iso-phthalate molding compound that contains long-glass fiber fillers. It is supplied in flake form, making it suitable for various molding applications. This compound can be preformed and easily molded using standard compression and transfer equipment. It offers good moldability and is designed to meet the requirements of general-purpose molding applications where a balance of mechanical strength and ease of processing is essential.

DAP ID-40 is a general-purpose diallyl ortho-phthalate molding compound filled with Orlon. It is supplied in a granular form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

DAP 224 is a general-purpose diallyl ortho-phthalate molding compound filled with Dacroon. It is supplied in a flake form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.

DAP D33/6120 is a versatile general purpose diallyl ortho-phthalate molding compound that incorporates short glass fibers for added strength. Supplied in a free-flowing granular form, it is designed for ease of use in molding applications. This compound can be easily molded using compression, transfer, or injection equipment, and it can also be readily preformed to suit the specific requirements of the application. Its blend of properties makes it suitable for a range of molding applications where strength and versatility are essential.