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Evonik
ALBIFLEX® 297
Polymer Name:
Bisphenol-A Epoxy-Silicone Block Copolymer
Chemical Family:
Epoxy & Epoxy Derivatives, Bisphenol Epoxy Resins
Processing Methods:
Casting
ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin that excels in crafting high-performance elastomers. This versatile liquid, responsive to epoxy, seamlessly cures when combined with aliphatic and cycloaliphatic epoxy resin curing agents. ALBIFLEX® 297 accommodates various conventional casting and molding techniques for your manufacturing needs.
Mitsubishi Chemical Group Corporation
jER™ 1750
Polymer Name:
Epoxy Resins & Compounds
Functions:
Binder & Resin, Resins, Binders & Matrix Materials, Resin, Adhesion Promoter, Coupling Agent
Chemical Family:
Bisphenol F Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
Labeling Claims:
High Purity
jER™ 1750 is a very low viscosity Bisphenol F-type liquid epoxy resin. It can be used in sealants, casting agents and adhesives in electrical and electronic applications and fiber reinforced plastics, and for liquid underfill and adhesives for semiconductor manufacturing.FeaturesChemical, heat and water resistanceElectrical insulation*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ 4250
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Impact Modifier, Adhesion Promoter, Plasticizer, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Aluminum, Steel, Fibers & Fabrics, Glass, Plastics, Metal, Concrete, Ceramic
jER™ 4250 is a hybrid bisphenol A/bisphenol F-type epoxy resin that is more flexible than conventional polymer-type epoxy resins. It can be used as an additive to add toughness, insulating and vapor barrier properties and resistance to heat, water and chemicals to a variety of applications. FeaturesPolymer-type epoxy resin with epoxy functional groups at the both endsHigh molecular weightHigh softening points Good adhesionApplicationsPCM, CAN and other coatingsPaintThermoplastics Printed electronics Plastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8040
Polymer Name:
Epoxy Resins & Compounds
Functions:
Binder & Resin, Resins, Binders & Matrix Materials, Resin, Adhesion Promoter, Coupling Agent
Chemical Family:
Epoxy & Epoxy Derivatives
Labeling Claims:
High Purity
jER™ YX8040 is a hydrogenated bisphenol A-type solid epoxy resin, with high molecular weight. It can be used for optical materials such as LED encapsulants and adhesives for displays.FeaturesHigh purityTransparencyLED-curableUV-curable *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ Epoxy YX7110
Polymer Name:
Epoxy Resins & Compounds
Functions:
Binder & Resin, Resins, Binders & Matrix Materials, Impact Modifier, Resin, Adhesion Promoter, Coupling Agent
Chemical Family:
Epoxy & Epoxy Derivatives
jER™ YX7110 is a tough and flexible liquid-type epoxy resin. It can be used as an impact modifier for brittle materials, as an additive to increase impact resistance, and for stress relaxation to avoid cracking and warpage. jER™ YX7110 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol. Features Adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol Crack and impact resistance Excellent flexibility and elasticity High viscosity Low warpage Maintains flexibility even after full-curing Applications Coatings Adhesives Composites Potting and encapsulation materials Base film/sheet for wearable devices *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ 1256
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Impact Modifier, Adhesion Promoter, Plasticizer, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Bisphenol A Type Epoxy, Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Aluminum, Steel, Fibers & Fabrics, Glass, Plastics, Metal, Concrete, Ceramic
jER™ 1256 is a solid epoxy resin produced from Bisphenol A epoxy resin. It is a polymer-type epoxy resin with epoxy functional group at the both ends. It can be used to add toughness, insulating and vapor barrier properties, and resistance to heat, water and chemicals in a variety of applications. FeaturesHigh molecular weightHigh softening pointsGood film formerHydrolysis resistanceFlexibilityStrong adhesionApplicationsPCM, CAN, and other coatingsPaintsFiber-reinforced materialsThermoplasticsPrinted electronicsPlastic processing *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX8000D
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Adhesion Promoter, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Radiation Curable Coating, Semiconductor Applications
Compatible Substrates & Surfaces:
Glass, Fibers & Fabrics, Concrete, Metal, Ceramic, Aluminum, Plastics, Steel
Features:
Transparency, Low Chlorine Content, Faster Cure Time, LED-curable, Radiation Curable, Fast Cure, UV Curable, Excellent Adhesion
jER™ YX8000D is a hydrogenated bisphenol A-type liquid epoxy resin with significantly lower chlorine impurity levels than other commercially available products. It can be used for wide variety of optical adhesives and encapsulants.FeaturesExcellent adhesionFast cure timeLow chlorine contentExcellent transparencyLED-curableUV-curableApplicationsConsumer appliances and electronicsElectrical and electronic displaysElectronics adhesivesPotting compoundsSemiconductor manufacturingLEDs*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL980
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Resins, Binders & Matrix Materials, Adhesion Promoter, Binder & Resin, Resin
Chemical Family:
Bisphenol A Type Epoxy, Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Concrete, Aluminum, Fibers & Fabrics, Metal, Ceramic, Plastics, Steel, Glass
Features:
Low Chlorine Content, Excellent Electrical Insulation, Good Mechanical Properties, Water Resistant, Chemical Resistant, Electrically Insulating, Abrasion Resistance, Water Resistance, Improved Dimensional Stability, Reduced Wear, Good Electrical Properties, Chemical Resistance, Heat Resistance, Improved Flexibility, Flame Retardant
jER™ YL980 is is a Bisphenol A-type liquid epoxy resin with very low chlorine content. It can be used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). Benefits Excellent adhesiveness Maintains high electrical reliability Features Chemical, heat and water resistant Electrical insulating properties Significantly low chlorine content (below 500 ppm) Applications Electrical and electronic applications Potting & encapsulation materials Adhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX7105
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Impact Modifier, Adhesion Promoter, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Aluminum, Steel, Fibers & Fabrics, Glass, Plastics, Metal, Concrete, Ceramic
jER™ YX7105 is a liquid-type epoxy resin with toughness, flexibility, and high stretchability. It is used as an impact modifier for semiconductor, printed electronics and wearable devices to avoid bending and warpage. jER™ YX7105 is an adduct formed from the reaction of epichlorohydrin and an aliphatic and aromatic polyol.FeaturesExcellent adhesionGood toughnessGood mechanical, impact and crack resistanceExcellent elasticity and flexibilityApplicationsPrinted electronics (resist ink, build-up wire board, flexible printed wire board, metal core printed circuit board)Semiconductor manufacturing (liquid mold compound, underfill, sidefill, diebonding, ACF, NCF, ACP, NCP)Base film and sheet for wearable devicesCoatingsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX4000
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Adhesion Promoter, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Epoxy & Epoxy Derivatives
Compatible Substrates & Surfaces:
Aluminum, Steel, Fibers & Fabrics, Glass, Plastics, Metal, Concrete, Ceramic
jER™ YX4000 is a biphenol-type solid epoxy resin with significantly low melt viscosity, low water absorption and a good balance between adhesiveness and rigidity against stress. It can be used for electrical and electronic applications. jERTM YX4000 is an adduct formed from the reaction of epichlorohydrin and tetramethylbiphenol FeaturesAbrasion, heat and water resistanceElectrical insulationWear resistanceProduct HighlightsSignificantly low melt viscosity (melting point: 108°C)Low chroline contentLow water absorption ApplicationsElectrical and electronic applications (EMC, solder resist, PCB)Potting and encapsulation materialsPowder coatings for ship bottomsAdhesivesComposites *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YL983U
Polymer Name:
Epoxy Resins & Compounds
Functions:
Coupling Agent, Resins, Binders & Matrix Materials, Adhesion Promoter, Binder & Resin, Resin
Chemical Family:
Bisphenol Epoxy Resins, Epoxy & Epoxy Derivatives, Bisphenol F Type Epoxy
End Uses:
Underfill, Semiconductor Applications
Compatible Substrates & Surfaces:
Concrete, Aluminum, Fibers & Fabrics, Metal, Ceramic, Plastics, Steel, Glass
Features:
Low Chlorine Content, Excellent Electrical Insulation, Good Mechanical Properties, Water Resistant, Chemical Resistant, Low Viscosity, Electrically Insulating, Abrasion Resistance, Water Resistance, Improved Dimensional Stability, Reduced Wear, Good Electrical Properties, Good Elastic Recovery, Chemical Resistance, Heat Resistance, Improved Flexibility
jER™ YL983U is a Bisphenol F-type liquid epoxy resin with very low chlorine content and low viscosity. It is used for electrical and electronic applications (Sealant, casting agent, adhesives, and so on). BenefitsExcellent adhesivenessGood elastic recovery FeaturesChemical, heat and water resistantElectrical insulating propertiesSignificantly low chlorine content (below 500 ppm)Low viscosityApplicationsElectrical and electronic applications Potting & encapsulation materialsAdhesives *jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
Mitsubishi Chemical Group Corporation
jER™ YX7400N
Polymer Name:
Epoxy Resins & Compounds
Functions:
Resins, Binders & Matrix Materials, Impact Modifier, Adhesion Promoter, Coupling Agent, Binder & Resin, Resin
Chemical Family:
Epoxy & Epoxy Derivatives
End Uses:
Semiconductor Applications, Conformal Coating
Features:
Excellent Elasticity, Reduced Wear, Good Mechanical Properties, Abrasion Resistance, Impact Resistance, Good Elasticity, Improved Flexibility, High Impact Resistance, Excellent Resilience, Improved Dimensional Stability
jER™ YX7400N is an adduct formed from the reaction of epichlorohydrin and an aliphatic polyol.FeaturesAdduct formed from the reaction of epichlorohydrin and an aliphatic polyolExcellent elasticityImpact resistanceApplicationsConsumer appliances and electronicsElectrical devices, assemblies, parts and componentsElectronics adhesivesElectrical and electronic packaging and assemblySpecialty and conformal coatingsPotting compoundsPrinted circuit boards (PCBs)Semiconductor manufacturing*jER™ is provided by Mitsubishi Chemical Corporation, a member of the Mitsubishi Chemical Group.
SABIC's Specialties Business
LNP™ THERMOCOMP™ Compound TF002
Polymer Name:
Polyurethane (unspecified)
Processing Methods:
Injection Molding
End Uses:
Commercial Appliance, Industrial Applications, Displays, Home Appliances, Cell Phones, Tablets, Electrical/Electronic Applications, Semiconductor Applications, Sporting Goods, Consumer Applications, Appliances, Computer Components
Density:
1310.0 - 1310.0 kg/m³
SABIC's Specialties Business LNP THERMOCOMP TF002 compound is based on Polyurethane (TPU) resin containing 10% glass fiber. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
SABIC's Specialties Business
LNP™ STAT-KON™ Compound TX06488
Polymer Name:
Polyurethane (unspecified)
Processing Methods:
Injection Molding
End Uses:
Semiconductor Applications, Wires, Industrial Applications, Electrical/Electronic Applications, Cables
Density:
1280.0 - 1280.0 kg/m³
SABIC's Specialties Business LNP STAT-KON TX06488 compound is based on Polyurethane (TPU) resin containing conductive carbon powder. Added features of this grade include: Excellent Ductility, Electrically Conductive. This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.
MOCOM Compounds
ALCOM® LDDC PMMA 1000 UV 18124 BK1074-11
Polymer Name:
Polymethyl Methacrylate (PMMA)
End Uses:
Automotive Applications, Lamp Covers, Displays, Black Panel Technology
Features:
Translucent, Good Light Diffusion, UV Stabilized, UV Resistant
Density:
1180.0 - 1180.0 kg/m³
Flexural Modulus:
3300.0 - 3300.0 MPa
MOCOM Compounds ALCOM® LDDC PMMA 1000 UV 18124 BK1074-11 is a polymethylmethacrylate base polymer with a UV stabilized filler/additive system suitable for applications such as lamp covers, display elements, operating elements, and light transparent components in automotive and lighting markets. Pre-drying conditions include 80°C in a dry air (dessiccant) dryer for 3-4 hours and 80°C in an air circulating dryer for 4-6 hours, with a maximum moisture content of <0.02%. For injection molding, melt temperature should be between 220-280°C and mold temperature should be between 50-80°C.
MOCOM Compounds
ALCOM® LDDC PMMA 1000UV18123 BK1016-11
Polymer Name:
Polymethyl Methacrylate (PMMA)
End Uses:
Lamp Covers, Displays, Black Panel Technology, Automotive Applications
Features:
Translucent, Good Light Diffusion, UV Stabilized, UV Resistant
Density:
1180.0 - 1180.0 kg/m³
Flexural Modulus:
3500.0 - 3500.0 MPa
MOCOM Compounds ALCOM® LDDC PMMA 1000UV18123 BK1016-11 is a translucent, UV stabilized Polymethylmethacrylate polymer used for Automotive, Lighting, and interior decoration/finishing, light transparent components, and Black Panel-Technology applications such as lamp covers, display elements, and operating elements. Pre-drying conditions involve 80°C in a dry air (dessiccant) dryer for 3-4 hours and 80°C in an air circulating dryer for 4-6 hours with a maximum moisture content of less than 0.02%. For processing injection molding, the melt temperature should be between 220-270°C and the mold temperature should be between 50-80°C. It should be protected from light.
Cosmic Plastics
DAP D72/6120F
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Cups, Cases, Encapsulant, Insulators, Terminal Blocks, Switches
Density:
1820.0 - 1820.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP D72/6120F is a versatile diiallyl ortho-phthalate molding compound, filled with short glass fibers and featuring flame retardant properties. Supplied in a free-flowing granular form, this compound is well-suited for a variety of molding applications. It can be easily molded using compression, transfer, or injection equipment and can be preformed with ease. An important distinction is that it has passed NASA outgassing tests, indicating its suitability for applications with stringent outgassing requirements, particularly in industries like aerospace where such standards are critical.
Cosmic Plastics
Farboset® 2461
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Capacitors, Resistor Network, Resistor, Encapsulant, Inductor Coil
Volume Resistivity:
22000000000000.0 - 22000000000000.0 Ohm-m
Flexural Strength:
85.436 - 85.436 MPa
Farboset® 2461 is a mineral-filled novolac epoxy molding compound that offers fast cure rates, excellent moldability, and superior thermal shock and moisture resistance. It has been formulated to achieve a high glass transition temperature, making it suitable for applications requiring optimal reliability performance, even in very thin sections. Farboset® 2461 is designed for encapsulating a wide range of electronic devices, including capacitors, resistors, resistor networks, and inductor coils, ensuring their protection and reliability in various operating conditions.
Cosmic Plastics
DAP K31/6220
Polymer Name:
Diallyl Phthalate
Processing Methods:
Compression Molding, Injection Molding, Transfer Molding
End Uses:
Housings, Structural Parts, Insulators, Terminal Blocks, Switches
Density:
1760.0 - 1760.0 kg/m³
Tensile Strength:
0.0414 - 69.0 MPa
DAP K31/6220 is a versatile diallyl iso-phthalate molding compound, filled with short glass fibers and supplied in granular form. This compound offers excellent heat resistance and is suitable for a wide range of applications. It is easy to work with, pouring easily and allowing for preforming. Additionally, it molds readily using standard compression, transfer, or injection equipment. One notable feature of K31/6220 is its FDA approval for direct food contact use, making it a reliable choice for applications in the food industry where heat resistance and safety standards are essential.
Cosmic Plastics
Farboset® 2270
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Resistor, Capacitors, Encapsulant
Farboset® 2270 is a granular epoxy molding compound that contains a combination of glass and mineral fillers. It is based on a novolac epoxy resin and is designed for encapsulating various electrical and electronic components, including capacitors, resistors, hybrids, and more. This compound is known for its good moldability and fast cure rates, especially at lower molding temperatures. It offers excellent performance and reliability for applications where these characteristics are crucial.
Cosmic Plastics
Farboset® 2477FPB
Polymer Name:
Epoxy Resins & Compounds
Farboset® 2477FPB is designed for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions. It is well-suited for a variety of thermoset molding applications, ensuring safety and reliability in its intended use.
Esschem
Esschem EMA Bead Copolymers
Polymer Name:
Ethyl Methacrylate Copolymer
Functions:
Resin, Binder & Resin, Impact Modifier, Resins, Binders & Matrix Materials
Chemical Family:
Acrylic Ester Copolymer, Acrylics, Acrylates & Methacrylates, Methacrylates
Physical Form:
Beads, Solid
Labeling Claims:
Biocompatible, Non-Toxic
Esschem EMA Bead Copolymers are a range of bead polymers synthesized from ethyl methacrylate (EMA) that offers the strength of polymethyl methacrylate (PMMA) with slightly different properties.The copolymers exhibit a slightly lower glass transition temperature, resulting in a softer and more flexible final product compared to PMMA.By controlling the molecular weight, Esschem can customize the heat resistance and strength of the polymer, making it suitable for various applications across multiple industries.The smaller particle size of the beads enhances surface properties like adhesion, while larger particles contribute to a more robust and rigid material.
Esschem
Esschem MMA - AMA Bead Copolymers
Polymer Name:
MMA/AMA Copolymer
Functions:
Resin, Binder & Resin, Impact Modifier, Resins, Binders & Matrix Materials
Chemical Family:
Acrylic Ester Copolymer, Acrylics, Acrylates & Methacrylates, Methacrylates
Physical Form:
Beads, Solid
Labeling Claims:
Biocompatible, Non-Toxic
Esschem MMA - AMA Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) with allyl methacrylate (AMA). These copolymers showcase the unique characteristics of AMA as a crosslinker in polymers. With varying MMA and AMA concentrations, Esschem offers a wide range of copolymer beads with different properties. Higher MMA content in the copolymer results in elevated glass transition temperatures, melting points, and tensile strengths, making them ideal for applications requiring high strength and rigidity. On the other hand, increasing the AMA content lowers these properties while enhancing crosslinking and hardness. By adjusting the molecular weight, Esschem can further customize the copolymer's rigidity and crosslinking behavior. The particle size of the beads can also be modified to optimize processing and surface properties, including adhesion characteristics.
Metton America
METTON® LMR M1537 Polymers
Polymer Name:
Polydicyclopentadiene (PDCPD)
Processing Methods:
Injection Molding, Reaction Injection Molding (RIM)
Density:
1026.0 - 1034.0 kg/m³
METTON® LMR M1537 Polymers are tough and durable engineering plastics (poly-DCPD). They offer part design freedom with integrated functionality and part consolidation opportunities, similar to injection molding, as a replacement for traditional materials like wood and metal. The low-pressure molding process is ideal for producing large plastic parts used in heavy trucks, agriculture, construction, the military, and other industrial applications.
Cosmic Plastics
Cosmic Epoxy E4930R
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Transistor, Resistor, Optocoupler, Encapsulant, Capacitors
Volume Resistivity:
10000000000000.0 - 10000000000000.0 Ohm-m
Flexural Strength:
103.35 - 103.35 MPa
Cosmic Epoxy E4930R is a mineral-filled epoxy molding compound supplied in granular form. It is designed for encapsulating various electronic components, including optocouplers, capacitors, resistors, resistor networks, transistors, SOICs (Small Outline Integrated Circuits), and QFPs (Quad Flat Packages). This material helps protect and insulate these components, ensuring their proper functioning in electronic applications.
Cosmic Plastics
Farboset® 1115AC
Polymer Name:
Epoxy Resins & Compounds
Farboset® 1115AC is intended for use as a compound in thermoset molding. It is available in a solid form, presented as granules, with a granular appearance and a mild odor. This product is insoluble in water and does not exhibit reactivity under normal conditions, making it suitable for various thermoset molding applications and ensuring safety and reliability in its intended use.
Esschem
Esschem EMA - EHMA Bead Copolymers
Polymer Name:
EMA/EHMA Copolymer
Functions:
Resin, Binder & Resin, Impact Modifier, Resins, Binders & Matrix Materials
Chemical Family:
Acrylics, Acrylates & Methacrylates, Methacrylates
Physical Form:
Beads, Solid
Labeling Claims:
Biocompatible, Non-Toxic
Esschem EMA - EHMA Bead Copolymers are a unique combination of ethyl methacrylate (EMA) and 2-ethylhexyl methacrylate (EHMA) that offers exceptional properties.The incorporation of 2-EHMA disrupts the polymer chain packing, resulting in lower glass transition temperatures and enhanced low-temperature flexibility, while significantly improving transparency.With variations in molecular weight, Esschem can further enhance the strength and flexibility of these bead copolymers. The smaller particle size of the beads improves processability and has the potential to enhance transparency, while larger particles contribute to a more rigid material.
Esschem
Esschem MMA - Styrene Bead Copolymers
Polymer Name:
Styrene Methyl Methacrylate Copolymer (SMMA)
Functions:
Resin, Impact Modifier, Binder & Resin, Resins, Binders & Matrix Materials
Chemical Family:
Acrylics, Acrylates & Methacrylates, Methacrylates, Styrenics, Styrene-Acrylic Copolymer, Styrene Copolymers, Styrene Methacrylate Copolymer
Physical Form:
Beads, Solid
Labeling Claims:
Biocompatible, Non-Toxic
Esschem MMA - Styrene Bead Copolymers are a versatile range of copolymers combining methyl methacrylate (MMA) and styrene. These bead copolymers offer a wide array of properties and applications. With increased MMA content, the resulting materials exhibit remarkable strength and transparency. Conversely, a higher proportion of styrene enhances hydrophobicity, hardness, and impact resistance. The molecular weight plays a crucial role in determining the characteristics of the copolymers. Higher molecular weights, often associated with increased styrene content, yield stronger and more heat-resistant materials. Esschem's ability to manipulate the molecular weight distribution allows for customized properties such as durability, elasticity, and processing ease. Additionally, the particle size of the copolymers influences surface properties and rigidity.
Cosmic Plastics
Cosmic Epoxy E484
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Connectors, Electrical Insulation
Volume Resistivity:
100000000.0 - 100000000.0 Ohm-m
Flexural Strength:
130.91 - 130.91 MPa
Cosmic Epoxy E484 is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It boasts excellent mechanical strength and electrical properties, particularly at high temperatures, and has successfully passed NASA outgassing tests. This compound finds applications in electrical hardware, including underwater connectors and various insulation needs.
Cosmic Plastics
Cosmic Epoxy C102
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Injection Molding, Compression Molding
Cosmic Epoxy C102 is a copper-filled molding compound available in a very fine granular form. It is suitable for various molding processes, including injection molding, compression molding, and transfer molding. This material is designed for fabricating parts that demand high strength and excellent electrical conductivity.
Cosmic Plastics
Farboset® 2220
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Bushings, Encapsulant, Insulators
Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.
Cosmic Plastics
Cosmic Epoxy E484-FDA
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Connectors, Electrical Insulation
Volume Resistivity:
100000000.0 - 100000000.0 Ohm-m
Flexural Strength:
130.91 - 130.91 MPa
Cosmic Epoxy E484-FDA is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It has received approval for direct food contact. Notably, it possesses outstanding mechanical strength and electrical properties, especially at high temperatures, and has met the rigorous NASA outgassing standards. This material is used in electrical hardware applications such as underwater connectors and other insulation needs.
Cosmic Plastics
Cosmic Epoxy EH81
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Inductor, Core Rods, Encapsulant
Cosmic Epoxy EH81 is an iron-filled epoxy molding compound available in a black granular form. It is specifically designed for EMI/RFI shielding applications and can be used in both compression and transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. The advantage of this material is its ability to simplify the manufacturing process by eliminating the labor-intensive over/under molding steps.
Cosmic Plastics
Farboset® 2510
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant, Capacitors
Farboset® 2510 is a mineral-filled, novolac epoxy molding compound known for its fast cure rates at low temperatures, excellent laser markability, and good moldability. This compound is specially formulated for encapsulating surface mount ceramic and tantalum capacitors, as well as other applications that demand quick cycle times. Its unique properties and rapid curing make it well-suited for applications where fast production and efficient marking are essential.
Cosmic Plastics
Cosmic Epoxy E4920CD
Polymer Name:
Epoxy Resins & Compounds
End Uses:
Encapsulant
Cosmic Epoxy E4920CD is designed for the thermoset molding of electronic encapsulation. It is available in a solid form, offered as granules, preforms, or powders, and is available in various colors. This product has a mild odor and is insoluble in water, making it well-suited for a wide range of electronic applications. Additionally, it does not exhibit reactivity under normal conditions, ensuring safety and reliability in its intended use.
Cosmic Plastics
Cosmic Epoxy CP7318
Polymer Name:
Epoxy Resins & Compounds
Processing Methods:
Transfer Molding, Compression Molding
End Uses:
Aircraft Applications
Flexural Strength:
0.12402 - 165.36 MPa
Cosmic Epoxy CP7318 is a long-glass-reinforced epoxy molding compound supplied in flake form. It can be compressed or transfer-moulded and exhibits high physical strength. This material has a shelf life of 12 months when stored at 20°C or lower. It serves as an ideal replacement for numerous aircraft and heavy metal parts.
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