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AI Technology EG 8050

EG8050 is an electrically conductive, silver filled epoxy which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). Post bake at 100°c or 125°c for 24 hrs using a vacuum or air flow oven is recommended in order to pass NASA outgassing testing. It can be readily reworked at 80-150°C and is ideal for applications such as large area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE.

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Compatible Substrates & Surfaces: Aluminum, Copper, Metal

Application Method: Injection

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Applications & Uses

Application Area
Application Method
Compatible Substrates & Surfaces
Cure Method

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 60minutes)max. 4x10⁻⁴Ω-cm
Glass Transition Temperature-22 to -18°C
Glass Transition Temperature-20°C
Current Carrying Capabilities35Amp/mm²
Lap Shear Strengthmin. 6.9N/mm²
Device Push Off Strengthmin. 13.8N/mm²
Cured Density2.07 - 2.53g/cc
Thermal Conductivitymin. 6.0W/m-°C
Thermal Conductivitymin. 7.9W/m-°C
Thermal Conductivity7.11 - 8.69W/m-°C
Coefficeint of Linear Thermal Expansion120ppm/°C
Maximum Continuous Operation Temperaturemax. 150°C
Average Viscosity (at 25°C, 0.5rpm, Spindle CP51)148000 - 222000cPsBrookfield Viscometer DV-1
Electrical Resistivitymax. 4x10⁻⁴Ω-cm
Die Shear Strengthmin. 1800psi
Die Shear Strengthmin. 2000psi
Viscosity (at 0.5 rpm)190000cPs
Viscosity (at 0.5 rpm)300000cPs

Regulatory & Compliance

Certifications & Compliance

Storage & Handling

Shelf Life
1 Year