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AI Technology EG 8050-LV

EG8050-LV is an electrically conductive, silver filled epoxy which exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). It can be readily reworked at 80-150°C and is ideal for applications such as large area die attach and substrate attach because of it's ability to bond materials with highly mismatched CTE.

Product Type: 2K (2 component) Adhesive, Epoxy Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Compatible Substrates & Surfaces: Aluminum, Copper, Metal

Application Method: Injection

Technical Data Sheet
  • TypeDocument Name
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Knowde Enhanced TDS

Identification & Functionality

Features & Benefits

Product Features
  • Stress free.
  • One or two component.
  • Reworkable.
  • Epoxy paste adhesive.
  • Large area die.
  • Substrate/component.
  • Reworkability.
  • Solder Replacement.
  • Mismatched CTE's.

Applications & Uses

Application Area
Application Method
Compatible Substrates & Surfaces
Cure Method
Application Procedures
  • Mix adhesive in 1:1 weight. (Note: In kit form, viscosity of Part A > Viscosity of Part B).
  • Dispense adhesive onto clean substrate.
  • Cure according to one of the recommended cure schedules.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 60minutes)max. 4x10⁻⁴Ω-cm
Glass Transition Temperature-22 to -18°C
Glass Transition Temperature-20°C
Current Carrying Capabilities35Amp/mm²
Lap Shear Strengthmin. 5.5N/mm²
Device Push Off Strengthmin. 10.3N/mm²
Cured Density3.6 - 4.4g/cc
Thermal Conductivitymin. 7.9W/m-°C
Thermal Conductivity7.11 - 8.69W/m-°C
Coefficeint of Linear Thermal Expansion120ppm/°C
Maximum Continuous Operation Temperaturemax. 130°C
Average Viscosity (at 25°C, 0.5rpm, Spindle CP51)104000 - 156000cPsBrookfield Viscometer DV-1
Electrical Resistivitymax. 4x10⁻⁴Ω-cm
Die Shear Strengthmin. 1500psi
Viscosity (at 0.5 rpm)129000cPs

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Cure Schedules
Temperature Time
25°C 120 hrs
80°C 8 hrs
100°C 4 hrs
125°C 2 hrs
150°C 1 hr

If Part A viscosity increases, it can be lowered using mek, acetone or ipa to get the viscosity needed using a drop or 2 at a time and mix well. It can also be heated up to 50°C to lower the viscosity, Mix well & take amount needed. Allow to cool before mixing with Part B.

Storage & Handling

Shelf Life
1 Year
Storage Information

Storage temperature: 25°C in original  sealed package.