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AI Technology ME 7156

ME7156 is a reworkable, alumina filled, electrically insulating and thermally conductive epoxy paste adhesive. It exhibits outstanding flexibility for bonding materials with highly mismatched CTE's (i.e., alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it useful for bonding large area die and components. ME7156 can be readily reworked at 80-100°C. Positive displacement dispensing equipment with ceramic auger is recommended..

Product Type: Epoxy Adhesive

Application Area: Die/Chip Attach

Cure Method: Heat Cure

Compatible Substrates & Surfaces: Aluminum, Copper, Metal

Application Method: Injection

Technical Data Sheet
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Knowde Enhanced TDS

Identification & Functionality

Product Type

Features & Benefits

Product Features
  • Stress free.
  • Thermally conductive.
  • Reworkable.
  • Epoxy paste adhesive.
  • Substrate and component.
  • Reworkability.
  • Mismatched CTE's

Applications & Uses

Application Area
Application Method
Compatible Substrates & Surfaces
Cure Method
Application Procedures
  • Leave at ambient temperature until thawed before opening jar or dispensing syringe.
  • Dispense adhesive onto clean substrate.
  • Pre-bake the substrate with dispensed adhesive at 60°C for 30 to 60 minutes to achieve optimum bonding. Pre-bake not needed in all applications
  • Cure according to one of the recommended schedules.

Properties

Physical Form
Typical Properties
ValueUnitsTest Method / Conditions
Electrical Resistivity (at 150°C, 60minutes)min. 1x10¹⁴Ω-cm
Dielectric Strengthmin. 750Volts/mil
Glass Transition Temperature- 27.5 to -22.5°C
Glass Transition Temperature-25°C
Lap Shear Strengthmin. 6.2N/mm²
Device Push Off Strengthmin. 16.6N/mm²
Hardness72 - 88Shore A
Cured Density2.07 - 2.53g/cc
Thermal Conductivity1.53 - 1.87W/m-°C
Thermal Conductivitymin. 1.7W/m-°C
Coefficeint of Linear Thermal Expansion102 - 138ppm/°C
Maximum Continuous Operation Temperaturemax. 150°C
Average Viscosity (at 25°C, 0.5rpm, Spindle CP51)115200 - 172800cPsBrookfield Viscometer DV-1
Electrical Resistivitymin. 1x10¹⁴Ω-cm
Die Shear Strengthmin. 2400psi
Viscosity (at 0.5 rpm)144000cPs

Regulatory & Compliance

Certifications & Compliance

Technical Details & Test Data

Cure Schedules
Temperature Time
80°C 8 hrs
125°C 4 hrs
150°C 2 hrs
175°C 1 hr

For higher temperature curing, above 12 °C and/or bonding area of over 1cmx1cm, it is recommended that the dispensed adhesive be pre-baked, open faced without parts, at 60°C for 30 minutes, before parts are mounted and cured.

Packaging & Availability

Product Availability

ME7156 is available in syringes for automatic needle dispense applications or in jars. Both viscosity and thixotropic index can be modified to your specific needs.

Storage & Handling

Shelf Life
1 Year
Storage Information

Storage temperature: -40°C.

Pot life: 72 hrs at 25°C.