- Applications:Semiconductor Manufacturing, Appliances & Electronics, Adhesives & Sealants
- Product Families:Other Adhesives & Sealants, Adhesives & Sealants
TP7155 is an aluminum oxide filled, medium bond strength thermoplastic film adhesive designed for bonding die, component, and substrate. It has good thermal conductivity. The dry, tack-free handling of the film makes it suitable for automated assembly. TP7155 is designed for bonding parts that may be operaung at 160 continuously. If excessive tensile stress is expected at temperature above 150°C, additional mechanical support may be considered.