Products

124-22C is a pre catalyzed, solvent-resistant, anisotropic conductive ink, coating and adhesive. This product features excellent adhesion to Kapton, Mylar, glass, polycarbonate and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. It is also very resistant to scratching and creasing. Applications for 124-22C include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of surface mounted devices. This product is useful in application where shorts between closely spaced contacts is a concern.Features Solvent resistant, low temperature curing epoxy adhesive

124-24 is a screen-printable, anisotropic, UV cured adhesive. This product can be used on a variety of substrates such as polycarbonate, treated and untreated polyesters, Kapton, epoxy/glass PC boards and glass.Features UV curable flexible adhesive

126-22 is a pre-catalyzed, solvent-resistant, anisotropic conductive adhesive. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern.Features Solvent resistant epoxy adhesive Ideal for LED bonding

124-33(S) is a solvent resistant flexible electrically conductive adhesive. This product features excellent adhesion to Kapton®, Mylar®, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. Some applications for 124-33(S) include, but are not limited to, electrical attachments for surface mounted devices and heat-sealing openings in emi/rfi enclosures. 124-33(S) is a thermosetting version of 124-33 that is chemical and age resistant.Features Extremely flexible conductive adhesive

112-05 is screen-printable, anisotropic, conductive hot melt adhesive. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. The product can be rebonded many times by simply adding heat and slight pressure. Applications for 112-05 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of surface mounted devices. This product is useful in application where shorts between closely spaced contacts is a concern. 112-05 is a screen-printable version of 111-29.Features Thermoplastic urethane adhesive

128-15 is a flexo-printable, UV curable, flexible, ultraviolet-cured pressure sensitive adhesive. This material can be used on a variety of substrates including but not limited to polycarbonate, treated and untreated polyesters, Kapton, epoxy/glass PC boards, glass, stainless steel, aluminum, and copper. The possible applications for 128-15 include electronic circuitry, nameplates, and lamination.Features High peel strength Fast UV cure, no VOC Heat and humidity stable Suitable for high-speed printing

128-26 is a pourable, thermally conductive, silicone adhesive and potting compound suitable for application by stamping, screen printing, stencil printing, and syringe dispensing. This product features excellent adhesion to Kynar, Kapton, Mylar, glass, and a variety of other surfaces and is very resistant to flexing and creasing. Some applications for 128-26 include but are not limited to potting and encapsulation of stress-sensitive components, thermal management, and low-stress bonding applications.Features One Component thermally conductive heat cured adhesive.

111-27 is an electrically insulating coating and encapsulant suitable for application by spraying, dipping, syringe dispensing, pouring, and screen printing. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other surfaces. Unlike conventional insulating materials, this product is very resistant to flexing and creasing when used as a coating. Some applications for 111-27 include, but are not limited to, insulating polyimide flexible circuits, polymer thick film circuitry, environmental and humidity protection of surface mount components, insulating and diffusive layers of LEDs, and membrane switches. 111-27 also protects components from moisture, salts, and abrasion and features a high surface hardness with good toughness which reduces the risk of stress-fracturing bonded components. 111-27 is suitable for UV inspection.Features High dielectric strength coating

127-41-25 is a screen printable, UV curable, flexible, ultraviolet-cured anisotropic conductive pressure sensitive adhesive. This material can be used on a variety of substrates including but not limited to polycarbonate, treated and untreated polyesters, Kapton, epoxy/glass PC boards, glass, stainless steel, aluminum, and copper. The possible applications for 127-41-25 include electronic circuitry, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of surface mounted devices. 127-41-25 is optimized for a 0.001” bondline.Features UV curable pressure sensitive adhesive, ideal for 25µm bond line

127-41-50 is a screen printable, UV curable, flexible, ultraviolet-cured anisotropic conductive pressure sensitive adhesive. This material can be used on a variety of substrates including but not limited to polycarbonate, treated and untreated polyesters, Kapton, epoxy/glass PC boards, glass, stainless steel, aluminum, and copper. The possible applications for 127-41-50 include electronic circuitry, conductive splicing of ribbon cables, PTF circuits, and electrical attachment of surface mounted devices. 127-41-50 is optimized for a 0.002” bondline.Features UV curable pressure sensitive adhesive, ideal for 50µm bond line

126-37-F is an anisotropically conductive transferable low CTE adhesive film. This product features excellent adhesion to Kapton, Mylar, glass and a variety of other substrates. 126-37 is designed to exhibit minimal flow during bonding. This product provides superior electrical conductivity when bonding circuit materials to metal back planes and heat sinks. This product has excellent adhesion to aluminum, ceramic, and a variety of other substrates. This system features excellent thermal stability and flexibility in the B-Staged form. Unlike conventional conductive materials, this product is very resistant to flexing and creasing. The product can be re-bonded many times by simply adding heat and slight pressure

126-22-F is an anisotropic conductive, solvent-resistant, transferable adhesive film. This product features excellent adhesion to Kapton, Mylar, glass, and a variety of other substrates. Unlike conventional conductive materials, this product is very resistant to methyl ethyl ketone. This product features a hydrophobic resin that has proven well in humid aging studies and is also very resistant to scratching and creasing. Applications for 126-22 include, but are not limited to, conductive splicing of ribbon cables, PTF circuits attachments, and LED surface bonding demands. This product is useful in application where ensuring good electrical contact for all connections is a concern. This product is available in thicknesses from 1 to 5 mils