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Toray RS-17B

Toray RS-17B is a modified epoxy resin that delivers extremely low moisture absorption while providing excellent mechanical properties, toughness, and modulus. RS-17B is a flexible cure system that may be cured from 135°C to 177°C (275°F to 350°F). RS-17B has a long spaceflight heritage. 135°C–177°C (275°F–350°F) Cure Epoxy.

Polymer Name: Epoxy Resins & Compounds

Functions: Prepreg

Processing Methods: Out of Autoclave Prepreg, Prepreg Processing, Vacuum Bagging

Technical Data Sheet

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Identification & Functionality

Composite Materials Functions

Features & Benefits

Product Highlights
  • Ambient out life of 4 weeks
  • Excellent tack and drape
  • Cures in 3 hours at 135°C (275°F) or 2 hours at 177°C (350°F)
  • Flexible, robust range of process cycles
  • Extremely low moisture absorption
  • Excellent balance of mechanical properties and toughness
  • Autoclave and press consolidation

Applications & Uses

Recommended Applications
  • Space & Satellite
  • Aerospace Structures

Properties

Physical Form
Thermal Properties
ValueUnitsTest Method / Conditions
Tg, dry, DMA (after 135°C/275°F + 163°C/325°F)171 (340)°C (°F)
Tg, dry, DMA (after 135°C/275°F + 177°C/350°F)178 (352)°C (°F)
Tg, dry, DMA (after 135°C/275°F)158 (316)°C (°F)
Typical Properties
ValueUnitsTest Method / Conditions
Density1.19g/cc
Equilibrium Moisture Absorption2.7%
Outgassing (CVCM) laminate0.02%
Outgassing (TM) laminate0.14%
Outgassing (WVR)0.34%

Storage & Handling

Shelf Life
  • Out Life*: 30 days at ≤ 21°C (70°F) and ≤ 60% RH
  • Frozen Storage Life: 12 months at -18°C (< 0°F)

Out life is the maximum time allowed at 21°C (70°F) or below and 60% or less RH before cure, after a single frozen storage cycle in the original unopened packaging at -18°C (0°F) or below for a period not exceeding the frozen storage life noted above. *Out life tested by SBS on a 15 x 15 cm (6”x 6”) laminate, cured in an autoclave. Users may need to evaluate out life limits for their own Applicationss due to differing thickness, configuration, and complexity.