Products

Yincae® SMT 138E is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Yincae® TGP 110A is a thermally conductive adhesive. It is a reactive thermal grease, eliminates micro-bubbles at rough interfaces and has a very thin BLT.

Yincae® TGP 100 is a reactive thermal grease product that forms a very thin BLT eliminating microbubbles at the rough interface when applied. In service time the products cure to form a thermal gel or thermal pad with the performance of a thermal phase change material.

Yincae® TM 158 is a rapid cure, self-filling, self-leveling and self­ soldering adhesives, which can be used as die attach adhesives for LED, CSP, QFP etc., to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. In comparison to conductive adhesives (Ag),TM products have higher electrical and thermal conductivity. In comparison to soldering materials, our solderable adhesives eliminate outgassing from soldering processes, eliminate die skewing and shifting and eliminate solder bleeding. This soldered interface is encapsulated with a 3D polymer network after curing allowing it to tolerate harsh environmental conditions.

Yincae® SMT 256B is designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.

Yincae® SMT 256TB is a TCB adhesive designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.

Yincae® BP 256 is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Yincae® SMT 256L is a dip adhesive designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.

Yincae® SMT 266 is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Yincae® TEC 135 is a thermally conductive and anisotropic electrical adhesive.

Yincae® SMT 256T is a designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA and flip-chip.

Yincae® TGP 88A is a reactive thermal grease product that forms a very thin BLT eliminating microbubbles at the rough interface when applied. In service time the products cure to form a thermal gel or thermal pad with the performance of a thermal phase change material.

Yincae® TM 150 is a rapid cure, self-filling, self-leveling and self­ soldering adhesives, which can be used as die attach adhesives for LED, CSP, QFP etc., to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. In comparison to conductive adhesives (Ag),TM products have higher electrical and thermal conductivity. In comparison to soldering materials, our solderable adhesives eliminate outgassing from soldering processes, eliminate die skewing and shifting and eliminate solder bleeding. This soldered interface is encapsulated with a 3D polymer network after curing allowing it to tolerate harsh environmental conditions .

Yincae® TCA 136 is a thermal conductive adhesive. It is a highly conductive adhesive with excellent adhesion strength to copper, aluminum, steel, ceramic, glass and most plastics.

Yincae® TGP 110 is a thermally conductive adhesive. It is a reactive thermal grease, eliminates micro-bubbles at rough interfaces and has a very thin BLT.

Yincae® SMT 256 is a family of microchip assembly and ball attachment adhesive products that are used to enhance solder joint reliability and eliminate solder joint cracking in CSP, BGA, flip chips and POP microchip applications. They remove metal oxide and allow individual solder joints to be formed, encapsulated by a 3-D polymer network. The resulting solder joint bond is 5 to 10 times stronger than that of conventional underfill. These products are specially engineered for use in lead-free, Sn/Pb and Sn/Bi processes.

Yincae® TM 150E is a rapid cure, self-filling, self-leveling and self­ soldering adhesives, which can be used as die attach adhesives for LED, CSP, QFP etc., to replace conductive adhesives (Ag) or solder materials such as solder paste or preform. In comparison to conductive adhesives (Ag),TM products have higher electrical and thermal conductivity. In comparison to soldering materials, our solderable adhesives eliminate outgassing from soldering processes, eliminate die skewing and shifting and eliminate solder bleeding. This soldered interface is encapsulated with a 3D polymer network after curing allowing it to tolerate harsh environmental conditions .