- Polymer Name:Polycarbonate (PC)
- Additives Included:Impact Modifier, Heat Stabilizer, Mold Release Agent, Metal Deactivator
- Fillers Included:Glass Fiber
- Processing Methods:Laser Sintering (SLS), Injection Molding
- Flexural Modulus:8020.0 - 8020.0 MPa
SABIC's Specialties Business LNP THERMOCOMP DX13354 compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance suitable for Laser Direct Structuring (LDS) applications, Improved Impact, Good Surface Esthetics and Wide Processing Window.
This product does not contain PFAS intentionally added during SHPP’s manufacturing process and are not expected to contain unintentional PFAS impurities. Each user is responsible for evaluating the presence of unintentional PFAS impurities.